DAC1203D160
Dual 12 bits DAC, up to 160 MHz, 2 x interpolating
Rev. 02 — 14 August 2008
Product data sheet
1. General description
The DAC1203D160 is optimized to reduce architecture complexity and overall system
cost. The Digital-to-Analog Converter (DAC) leads dynamic performance in multi-carrier
support, because of its direct IF conversion capabilities. With an internal sampling rate up
to 160 MHz, the DAC1203D160 is an extremely competitive solution for broadband
wireless systems transmitters, as well as a wide range of other applications.
2. Features
I
I
I
I
I
I
I
I
I
I
Dual 12-bit resolution
Spurious Free Dynamic Range (SFDR) = 80 dBc at 2.5 MHz
Input data rate up to 80 MHz
2
×
interpolation filter
Output data rate up to 160 MHz
Single 3.3 V power supply
Low noise capacitor free integrated PLL
Low power dissipation
HTQFP80 package
Ambient temperature from
−40 °C
to +85
°C
3. Applications
I
I
I
I
I
I
Broadband wireless systems
Digital radio links
Cellular base stations
Instrumentation
Cable modems
Cable Modem Termination System (CMTS)/Data Over Cable Service Interface
Specification (DOCSIS)
NXP Semiconductors
DAC1203D160
Dual 12 bits DAC, up to 160 MHz, 2 x interpolating
4. Ordering information
Table 1.
Ordering information
Package
Name
DAC1203D160HW
HTQFP80
Description
plastic thermal enhanced thin quad flat package; 80 leads;
body 12
×
12
×
1 mm; exposed die pad
Version
SOT841-1
Type number
5. Block diagram
DAC1203D160
11 to 16,
19 to 24
I11 to I0
12
V
CCA
U/I
60
IVIRES
73
LATCH
12
FIR
12
DAC
72
IOUT
IOUTN
(CLK
×
2)
CLK
CLKN
5
6
31 to 34,
37 to 42,
45 to 46
Q11 to Q0
12
CLOCK
DRIVER
PLL
(CLK
×
2)
INTERNAL
BAND GAP
58
57
GAPOUT
GAPD
QOUT
QOUTN
(CLK
×
2)
LATCH
DAC
12
FIR
12
69
68
i.c.
V
CCD
2, 8
10, 51
(1)
(2)
(3)
(4)
U/I
V
CCA
59
QVIRES
V
CCA
014aaa542
AGND DGND
DEC
(1) Pins 1, 3, 61, 65, 76 and 80.
(2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79.
(3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56.
(4) Pins 18, 26, 36, 43, 63 and 78.
Fig 1. Block diagram
DAC1203D160_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 14 August 2008
2 of 19
NXP Semiconductors
DAC1203D160
Dual 12 bits DAC, up to 160 MHz, 2 x interpolating
6. Pinning information
6.1 Pinning
68 QOUTN
72 IOUTN
80 V
CCA
79 AGND
77 AGND
75 AGND
74 AGND
71 AGND
70 AGND
69 QOUT
67 AGND
66 AGND
64 AGND
62 AGND
76 V
CCA
65 V
CCA
73 IOUT
78 DEC
V
CCA
i.c.
V
CCA
AGND
CLK
CLKN
AGND
i.c.
DGND
1
2
3
4
5
6
7
8
9
63 DEC
61 V
CCA
60 IVIRES
59 QVIRES
58 GAPOUT
57 GAPD
56 DGND
55 DGND
54 DGND
53 DGND
52 DGND
51 V
CCD
50 DGND
49 DGND
48 n.c.
47 n.c.
46 Q0
45 Q1
44 DGND
43 DEC
42 Q2
41 Q3
Q4 40
014aaa543
© NXP B.V. 2008. All rights reserved.
V
CCD
10
I11 11
I10 12
I9 13
I8 14
I7 15
I6 16
DGND 17
DEC 18
I5 19
I4 20
I3 21
I2 22
I1 23
I0 24
DGND 25
DEC 26
n.c. 27
DGND
DAC1203D160HW
n.c. 28
DGND 29
DGND 30
Q11 31
Q10 32
Q9 33
Q8 34
DGND 35
DEC 36
Q7 37
Q6 38
Fig 2. Pin configuration
6.2 Pin description
Table 2.
Symbol
V
CCA
i.c.
V
CCA
AGND
CLK
CLKN
AGND
i.c.
DGND
DAC1203D160_2
Pin description
Pin
1
2
3
4
5
6
7
8
9
Type
[1]
S
I/O
S
G
I
I
G
O
G
Description
analog supply voltage
internally connected; leave open
analog supply voltage
analog ground
clock input
complementary clock input
analog ground
internally connected; leave open
digital ground
Product data sheet
Rev. 02 — 14 August 2008
Q5 39
3 of 19
NXP Semiconductors
DAC1203D160
Dual 12 bits DAC, up to 160 MHz, 2 x interpolating
Pin description
…continued
Pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
Type
[1]
S
I
I
I
I
I
I
G
O
I
I
I
I
I
I
G
O
I
I
G
G
I
I
I
I
G
O
I
I
I
I
I
I
O
G
I
I
I
I
G
G
Description
digital supply voltage
I data input bit 11 (Most Significant Bit (MSB))
I data input bit 10
I data input bit 9
I data input bit 8
I data input bit 7
I data input bit 6
digital ground
decoupling node
I data input bit 5
I data input bit 4
I data input bit 3
I data input bit 2
I data input bit 1
I data input bit 0 (Least Significant Bit (LSB))
digital ground
decoupling node
not connected
not connected
digital ground
digital ground
Q data input bit 11 (MSB)
Q data input bit 10
Q data input bit 9
Q data input bit 8
digital ground
decoupling node
Q data input bit 7
Q data input bit 6
Q data input bit 5
Q data input bit 4
Q data input bit 3
Q data input bit 2
decoupling node
digital ground
Q data input bit 1
Q data input bit 0 (LSB)
not connected
not connected
digital ground
digital ground
© NXP B.V. 2008. All rights reserved.
Table 2.
Symbol
V
CCD
I11
I10
I9
I8
I7
I6
DGND
DEC
I5
I4
I3
I2
I1
I0
DGND
DEC
n.c.
n.c.
DGND
DGND
Q11
Q10
Q9
Q8
DGND
DEC
Q7
Q6
Q5
Q4
Q3
Q2
DEC
DGND
Q1
Q0
n.c.
n.c.
DGND
DGND
DAC1203D160_2
Product data sheet
Rev. 02 — 14 August 2008
4 of 19
NXP Semiconductors
DAC1203D160
Dual 12 bits DAC, up to 160 MHz, 2 x interpolating
Pin description
…continued
Pin
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Type
[1]
S
G
G
G
G
G
I
I/O
I
I
S
G
O
G
S
G
G
O
O
G
G
O
O
G
G
S
G
O
G
S
Description
digital supply voltage
digital ground
digital ground
digital ground
digital ground
digital ground
internal band gap power disable input
band gap output voltage
Q DAC biasing resistor
I DAC biasing resistor
analog supply voltage
analog ground
decoupling node
analog ground
analog supply voltage
analog ground
analog ground
complementary Q DAC output current
Q DAC output current
analog ground
analog ground
complementary I DAC output current
I DAC output current
analog ground
analog ground
analog supply voltage
analog ground
decoupling node
analog ground
analog supply voltage
Table 2.
Symbol
V
CCD
DGND
DGND
DGND
DGND
DGND
GAPD
GAPOUT
QVIRES
IVIRES
V
CCA
AGND
DEC
AGND
V
CCA
AGND
AGND
QOUTN
QOUT
AGND
AGND
IOUTN
IOUT
AGND
AGND
V
CCA
AGND
DEC
AGND
V
CCA
[1]
Type description: S: Supply; G: Ground; I: Input; O: Output.
DAC1203D160_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 14 August 2008
5 of 19
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