EEWORLDEEWORLDEEWORLD

Part Number

Search

PWC2512-2.21MJ

Description
RESISTOR, METAL GLAZE/THICK FILM, 1.5W, 5%, 100ppm, 2210000ohm, SURFACE MOUNT, 2512, CHIP
CategoryPassive components    The resistor   
File Size572KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

PWC2512-2.21MJ Overview

RESISTOR, METAL GLAZE/THICK FILM, 1.5W, 5%, 100ppm, 2210000ohm, SURFACE MOUNT, 2512, CHIP

PWC2512-2.21MJ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1805580360
package instruction, 2512
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-609 codee3
Manufacturer's serial numberPWC
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, 7 INCH
Rated power dissipation(P)1.5 W
Rated temperature70 °C
resistance2210000 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage500 V
Pulse Withstanding
Chip Resistors
PWC Series
Excellent pulse withstand performance
Improved working voltage
Improved power rating
Standard chip sizes (0805 to 2512)
Custom designs available
Welwyn Components
Electrical Data
Size
Power @70°C
Resistance range
Tolerance
LEV
TCR
Operating temperature
Thermal Impedance
Pad / trace area*
Values
Pulse capability
W
Ohms
%
V
ppm/°C
°C
°C/W
mm
2
220
40
160
50
150
200
-55 to +155
80
60
50
100
0805
0.125
1206
0.33
1R0 to 10M
10R to 1M: 0.5, All values: 1, 5
400
500
<10R:200
≥10R:100
2010
0.75
2512
1.5
E24 or E96 preferred other values to special order
See graphs - full application note available on request
*Recommended minimum pad & adjacent trace area for each termination for rated power dissipation on FR4 PCB
Physical Data
Dimensions of PWC resistors are given below in mm and weight in g
L
0805
1206
2010
2512
2.0±0.3
3.2±0.4
5.1±0.3
6.5±0.3
W
1.25±0.2
1.6±0.2
2.5±0.2
3.2±0.2
T max
0.6
0.7
0.8
0.8
A
0.3±0.15
0.4±0.2
0.6±0.3
0.6±0.3
B
0.9 min
1.7 min
3.0 min
4.4 min
C
0.3±0.1
0.4±0.15
0.6±0.25
0.6±0.25
Wt.
0.009
0.020
0.036
0.055
A
B
L
A
W
T
Wrap-around terminations
(3 faces)
Construction
Thick film resistor material, overglaze and organic protection
are screen printed on a 96% alumina substrate. Wrap-around
terminations have an electroplated nickel barrier and solder
coating, this ensures excellent ‘leach’ resistance properties
and solderability.
Marking
Components are not marked. Reels are marked with type,
value, tolerance, date code and quantity.
Solvent Resitance
The body protection is resistant to all normal industrial
cleaning solvents suitable for printed circuits.
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
12. 08
07. 08
37
Complain!!! Condemn sunboyljp!!!
On the afternoon of September 28, I met a person named sunboyljp in our forum who posted a message asking for SKYPE on CE. At that time, my colleague and I made a bet: 1000 points for the transaction....
w19864h Embedded System
Amplifier Bias Zeroing Problem
What is the function of resistor R2 in the figure?...
Big_Ben Analog electronics
I'm begging for the wireless identification device for the 2007 B paper.
I'm begging for the 2007 B wireless identification device. Is there any relevant information about it, written by Xidian University, Min Biao, Xie Shengxiang, Zhou Tao, and the pre-competition tutor i...
神速蜗牛 Embedded System
Solution to the problem that the failure of one RS485 communication node affects other nodes
In RS485 communication, when a node fails, other nodes will be affected and communication failure will occur. Is there any way to solve this problem?...
changyouhuaxia Industrial Control Electronics
Advanced ideas for embedded Linux device driver development: driver layering and driver separation
When we are studying I2C, USB, and SD drivers, have you discovered a commonality? That is, during driver development, each driver is divided into three parts, from top to bottom: 1. XXX device driver ...
jingcheng ARM Technology
About MSP430FR4133 low power consumption
I have just come into contact with 430 and have been working on its low power mode recently. However, after reading a lot of information, I still don’t have a clear idea of how to enter and exit the l...
什么鬼 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 851  749  2724  2495  86  18  16  55  51  2 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号