DS2012RN datasheet, PDF - EEWORLD Datasheet

DS2012RN: DescriptionFIFO, 4KX9, 120ns, Asynchronous, CMOS, PQCC32,; Categorystorage storage; File Size55KB，1 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS2012RN Overview

FIFO, 4KX9, 120ns, Asynchronous, CMOS, PQCC32,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	DALLAS
Reach Compliance Code	unknown
Maximum access time	120 ns
Maximum clock frequency (fCLK)	7.14 MHz
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
memory density	36864 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4KX9
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.002 A
Maximum slew rate	0.12 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

	DS2012RN	DS2012N
Description	FIFO, 4KX9, 120ns, Asynchronous, CMOS, PQCC32,	FIFO, 4KX9, 120ns, Asynchronous, CMOS, PDIP28,
Is it Rohs certified?	incompatible	incompatible
Maker	DALLAS	DALLAS
Reach Compliance Code	unknown	unknown
Maximum access time	120 ns	120 ns
Maximum clock frequency (fCLK)	7.14 MHz	7.14 MHz
JESD-30 code	R-PQCC-J32	R-PDIP-T28
JESD-609 code	e0	e0
memory density	36864 bit	36864 bit
Memory IC Type	OTHER FIFO	OTHER FIFO
memory width	9	9
Number of functions	1	1
Number of terminals	32	28
word count	4096 words	4096 words
character code	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	4KX9	4KX9
Exportable	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP
Encapsulate equivalent code	LDCC32,.5X.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum standby current	0.002 A	0.002 A
Maximum slew rate	0.12 mA	0.12 mA
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1

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