EPS13D2C1JG-66.000M
Series
RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Programmable Spread
Spectrum Oscillator
Frequency Stability
±100ppm Maximum over Operating Temperature Range
of -20°C to +70°C
Duty Cycle
50% ±10%
RoHS
Pb
Nominal Frequency
66.000MHz
EPS13D2 C 1 J G -66.000M
Spread Spectrum
-0.50% Down Spread
Output Control Function
Power Down
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability
66.000MHz
±100ppm Maximum over Operating Temperature Range of -20°C to +70°C (Inclusive of all conditions:
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, Shock, and Vibration.)
±5ppm First Year Maximum
3.3Vdc ±0.3Vdc
-0.5Vdc to +7.0Vdc
30mA Maximum (Unloaded; Vdd=3.3Vdc)
Vdd-0.4Vdc Minimum (IOH=-8mA)
0.4Vdc Maximum (IOL=+8mA)
2.7nSec Maximum (Measured at 20% to 80% of Waveform)
50% ±10% (Measured at 50% of Waveform)
15pF Maximum
CMOS
Power Down (High Impedance Internal Pull Down Resistor of 100kOhms Typical on Pad 3, Internal Pull Up
Resistor of 100kOhms Typical on Pad 1)
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output
350nSec Maximum
3mSec Maximum
50µA Maximum (Unloaded; Pad 1=Ground; Vdd=3.3Vdc)
-0.50% Down Spread
30kHz Minimum, 31.5kHz Typical, 33kHz Maximum
400pSec Maximum (Cycle to Cycle; Spread Spectrum-On; Vdd=3.3Vdc)
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Supply Voltage
Maximum Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Output Control Function
Power Down Input Voltage (Vih and
Vil)
Power Down Output Disable Time
Power Down Output Enable Time
Standby Current
Spread Spectrum
Modulation Frequency
Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 1 of 5
EPS13D2C1JG-66.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Power Down
Case/Ground
Output
Supply Voltage
5.00
±0.15
4
7.00
±0.15
5.08
±0.15
3
1.60 ±0.20
MARKING
ORIENTATION
3.1
1.6
All Tolerances are ±0.1
2.20
±0.15
1
2
1.4 ±0.2
3
4
LINE MARKING
3.68
±0.15
2
1.4 ±0.1
1
2
3
ECLIPTEK
66.000M
SXXYZZ
S=Configuration Designator
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.0 (X4)
Solder Land
(X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 2 of 5
EPS13D2C1JG-66.000M
OUTPUT WAVEFORM & TIMING DIAGRAM
POWER DOWN INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
OUTPUT DISABLE
(LOGIC LOW)
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State or
Power Down
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 3 of 5
EPS13D2C1JG-66.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 4 of 5
EPS13D2C1JG-66.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 5 of 5
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