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HCHP2208K2154DBPT131

Description
Fixed Resistor, Metal Glaze/thick Film, 0.75W, 2150000ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2208,
CategoryPassive components    The resistor   
File Size152KB,9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

HCHP2208K2154DBPT131 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 2150000ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2208,

HCHP2208K2154DBPT131 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid966435395
Reach Compliance Codeunknown
Country Of OriginFrance
ECCN codeEAR99
YTEOL5.21
structureChip
JESD-609 codee0
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length5.58 mm
Package formSMT
Package width1.91 mm
method of packingTape, Paper
Rated power dissipation(P)0.75 W
GuidelineMIL-R-55342D
resistance2150000 Ω
Resistor typeFIXED RESISTOR
seriesHCHP HYBRID
size code2208
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tolerance0.5%
Operating Voltage200 V
CHP, HCHP
Vishay Sfernice
High Stability Resistor Chips (< 0.25 % at Pn at 70 °C during 1000 h)
Thick Film Technology
FEATURES
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at + 70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform
MIL-R-55342 D.
to
specifications
NFC
83-240
and
Robust terminations
Large ohmic value range 0.1
Ω
to 100 MΩ
Tight tolerance to 0.5 %
CHP: Standard passivated version for
industrial, professional and military applications
HCHP: For high frequency applications
ESCC approved see CHPHR
SMD wraparound chip resistor
Halogen-free according to IEC 61249-2-21 definition
Compliant to RoHS directive 2002/95/0EC
Sputtered Thin Film terminations, with nickel barrier, are very
convenient for high operating conditions. They can withstand
thousands of very severe thermal shocks.
B (W/A), N (W/A) and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
DIMENSIONS
in millimeters (inches)
A
D
D
C
D
A
D
C
E
E
B
A
B
VALUE
TOL.
VALUE
TOL.
1.27
0.152
0.60
0502
0.127 (0.005)
(0.050)
(0.006)
(0.024)
1.27
0.152
1.27
0.127 (0.005)
0505
(0.050)
(0.006)
(0.050)
1.52
0.152
0.85
0603
0.127 (0.005)
(0.060)
(0.006)
(0.033)
0705/
1.91
0.152
1.27
0.127 (0.005)
0805
(0.075)
(0.006)
(0.050)
2.54
0.152
1.27
0.127 (0.005)
1005
(0.100)
(0.006)
(0.050)
3.05
0.152
1.60
1206
0.127 (0.005)
(0.120)
(0.006)
(0.063)
3.81
0.152
1505
1.32 (0.052)
0.127 (0.005)
(0.150)
(0.006)
5.08
0.152
2.54 (0.100)
0.127 (0.005)
2010
(0.200)
(0.006)
2.54
0.152
5.08 (0.200)
0.127 (0.005)
1020
(0.100)
(0.006)
5.58
0.152
2208
1.91 (0.075)
0.127 (0.005)
(0.220)
(0.006)
6.35
0.152
3.06 (0.120)
0.127 (0.005)
2512
(0.250)
(0.006)
2.54
0.152
2.54 (0.100)
0.127 (0.005)
1010
(0.100)
(0.006)
* Pb containing terminations are not RoHS compliant, exemptions may apply
CASE
SIZE
www.vishay.com
54
C
VALUE
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5 (0.020)
0.5 (0.020)
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
D/E
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
For technical questions, contact:
sfer@vishay.com
Document Number: 52023
Revision: 25-Aug-09
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