datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> Y1617825R000C0W
PDF
Preview

Y1617825R000C0W

Description
Fixed Resistor, Metal Foil, 0.4W, 825ohm, 0.25% +/-Tol, -2,2ppm/Cel, 2512,
CategoryPassive components    The resistor   
File Size1MB，6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

Y1617825R000C0W Overview

Fixed Resistor, Metal Foil, 0.4W, 825ohm, 0.25% +/-Tol, -2,2ppm/Cel, 2512,

Y1617825R000C0W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid860318545
Reach Compliance Codecompliant
Country Of OriginIsrael
ECCN codeEAR99
YTEOL10
structureChip
JESD-609 codee0
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.64 mm
Package length6.32 mm
Package formSMT
Package width3.23 mm
method of packingWaffle Pack
Rated power dissipation(P)0.4 W
resistance825 Ω
Resistor typeFIXED RESISTOR
seriesVSMF
size code2512
technologyMETAL FOIL
Temperature Coefficient2 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Tolerance0.25%

Y1617825R000C0W Preview

VSMF Series (1206, 2010, 2512)
Vishay Foil Resistors
T eis i hr ci nuM t l FS ra eM u thR st whl x lTr i ai nCo2p /CnL aLet byf0 1 ( 0p m
hF H Pe ioB l ea ouf c - o n i ei o iF i e m t T,Rfp m°a do diSa io . % 0p )
rtg s k ® i
l
C p s r t eb e n o s ±
f l ±0 1
t
The First High Precision Bulk Metal
®
Foil Surface-Mount
Chip Resistor with Flexible Terminations,
TCR of ±2 ppm/°C and Load Life Stability of ±0.01% (100 ppm)
FEATURES
• Temperature coefficient of resistance (TCR):
±2.0 ppm/°C typical (–55°C to +125°C, +25°C ref.)
(see Table 1)
• Resistance range: 10 Ω to 125 kΩ (for higher and lower
values, please contact Application Engineering)
• Resistance tolerance: to ±0.01%
• Power rating: to 400 mW at +70°C
• Load life stability: to ±0.01% at 70°C, 2000 h at
rated power
•
Strain relief construction by flexible terminations
• Vishay Foil resistors are not restricted to standard
values; specific “as required” values can be supplied at
no extra cost or delivery (e.g. 1K2345 vs. 1K)
• Thermal stabilization time < 1 s (nominal value achieved
within 10 ppm of steady state value)
• Electrostatic discharge (ESD): at least to 25 kV
• Thermal EMF: 0.05 μV/°C
• Non inductive, non capacitive design
• Rise time: 1 ns effectively no ringing
• Current noise: 0.010 µV
RMS
/V of applied voltage
(<–40 dB)
• Voltage coefficient <0.1 ppm/V
• Non inductive: <0.08 µH
• Non hot spot design
• Prototype quantities available in just 5 working days or
sooner. For more information, please contact us.
• Terminal finish: lead (Pb)-free or tin/lead alloy
*
Note:
*
Pb containing terminations are not RoHS compliant,
exemptions may apply.
Top View
INTRODUCTION
Vishay Foil Resistors’ new VSMF model is targeted for
applications that are prone to high thermal stress or
mechanical stress; it features low TCR, excellent load life
stability, tight tolerance, excellent shelf-life stability, low
current noise, high speed, and low voltage coefficient—all
in the same resistor.
It is well known that chips of 1206 dimensions and
larger can occasionally develop cracks and even fall off
the printed circuit board, especially when exposed to
temperature cycling. These instances are due to stress-
inducing mishandling of the PC board (e.g., bending during
assembly), excess thermal gradients, or thermal shock.
The latter two can be divided into two categories:
1. Thermal stress induced by changes in ambient
temperature. Here, different coefficients of expansion
induce mechanical stress as PCB compression
imposes tension on the resistor (or vice versa).
2. Thermal stress caused by internal heat generation
(load). Here, power dissipation within the resistor
generates temperature differentials between the
resistor and the PCB, resulting in variable stresses.
Stress cycling due to these two phenomena causes
material fatigue and cracks.
Vishay Foil Resistors’ new VSMF series of surface-mount
chip resistors feature flexible terminations to prevent
cracking of the body of the chip or delamination from the
board, especially in resistors with high length-to-width
aspect ratios.
For applications with high thermal stresses, designers
typically use molded resistors with flexible terminations.
These are larger than chip resistors and require more real
estate on the PCB. Vishay Foil Resistors has developed
and patented a solution which permits direct replacement
of standard chips by chips with flexible terminations.
The Vishay Foil Resistors’ application engineering
department is available to advise and make
recommendations.
For non-standard technical requirements and special
applications, please contact foil@vishaypg.com.
Document No.: 63177
Revision: 07-Nov-2011
TABLE 1—TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)
(-55°C to +125°C, +25°C Ref.)
RESISTANCE
VALUE (Ω)
250 to 125K
100 to <250
50 to <100
25 to <50
10 to <25
TOLERANCE
(%)
±0.01
±0.02
±0.05
±0.1
±0.25
TYPICAL TCR AND
MAX. SPREAD (ppm/°C)
±2 ±2
±2 ±3
±2 ±3
±2 ±4
±2 ±6
Note
(1)
For tighter performances and lower values, please contact
Application Engineering.
www.vishayfoilresistors.com
1
For questions, contact
foil@vishaypg.com
VSMF Series (1206, 2010, 2512)
Vishay Foil Resistors
FIGURE 1—POWER DERATING CURVE
Percent of Rated Power
100
75
50
25
0
-75
TABLE 2—SPECIFICATIONS
CHIP SIZE
1206
2010
2512
RESISTANCE
RANGE (Ω)
10 to 25K
10 to 70K
10 to 125K
RATE POWER (mW)
AT +70°C
150
300
400
-55°C
+70°C
-50
-25
Ambient Temperature (°C)
0
+25
+50
+75
+100 +125 +150 +175
TABLE 3—PERFORMANCES
PARAMETERS
Working Temperature Range
Thermal Shock
Overload
Low Temp. Storage
PC board Flexion
Dielectric Withstanding Voltage
Insulation Resistance
Resistance to Soldering Heat
Moisture Resistance
Shock
Vibration, High Frequency
Storage Life
High Temperature Exposure
Load Life Stability
-65°C/30 min
⇔
+150°C/30 min, 5 cycles
Rated voltage x 2.5, 5 sec
-65°C, no load, 24 h → rated voltage, 45 min.
3 mm Bend, 60 sec
AC200 V, 1 min
DC100 V, 1 min
260°C, 10 sec
+65°C to -10°C, 90% RH to 98% RH, rated voltage, 
10 cycles (240 h)
100 G, 6 ms, Sawthooth Wave, X, Y, Z, 10 shocks
20 G, 10 Hz to 2000 Hz to 10 Hz, 20 min., X, Y, Z, 
each 2.5 h
15°C to 35°C, 15% RH to 75% RH, no load, 10000 h
150°C, no load, 100 h
70°C, rated power, 1.5 h ON, 0.5 h OFF, 2000 h
TEST CONDITIONS
MAXIMUM
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.01% (100 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.005% (50 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
TYPICAL
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.01% (100 ppm)
±0.01% (100 ppm)
±0.01% (100 ppm)
±0.0025% (25 ppm)
±0.005% (50 ppm)
±0.01% (100 ppm)
-65°C to +150°C
Over 10,000 MΩ
FIGURE 2—TRIMMING TO VALUES*
(Conceptual Illustration)
FIGURE 3—TYPICAL RESISTANCE/
TEMPERATURE CURVE
+ 150
+ 100
R
(ppm)
Interloop Capacitance
Reduction in Series
Current Path
Before Trimming
Current Path
After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
∆
R
+ 50
0
- 50
- 100
- 150
- 200
- 55 - 50
- 25
0
± 2 ppm/°C
+ 25
+ 50
+ 75 + 100 + 125
Mutual Inductance
Reduction due
to Change in
Current Direction
Note:
Foil shown in black, etched spaces in white
Ambient Temperature (°C)
* To acquire a precision resistance value, the Bulk Metal® Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked areas
are cut, producing progressively smaller increases in resistance.
This method eliminates “hot spots” and improves the long term
stability of the resistor.
www.vishayfoilresistors.com
2
For questions, contact
foil@vishaypg.com
Document No.: 63177
Revision: 07-Nov-2011
VSMF Series (1206, 2010, 2512)
Vishay Foil Resistors
TABLE 4—DIMENSIONS
in Inches (Millimeters)
Top View
L
W
D
CHIP
SIZE
1206
2010
2512
L
±0.005
(0.13)
0.126
(3.20)
0.198
(5.03)
0.249
(6.32)
W
±0.005
(0.13)
0.062
(1.57)
0.097
(2.46)
0.127
(3.23)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
±0.005
(0.13)
0.020
(0.51)
0.025
(0.64)
0.032
(0.81)
FIGURE 4—RECOMMENDED MOUNTING
T
1. IR and vapor phase reflow are recommended.
2. Avoid any cleaning agent that could attack epoxy
resins. Epoxy resins form an integral part of the resistor
construction.
3. Vacuum pick up is recommended for handling.
4. In case of using soldering iron, measurement precautions
should be taken to avoid damaging the resistor.
FIGURE 5—DEMONSTRATION OF FLEXIBLE TERMINATIONS
PCB Bending Test
The Effect of Bending on the Terminations
Standard SMD has been
cracked at solder connection
points or terminations
Vishay Foil Resistor—VSMF
has not been damaged due
to the unique flexible
terminations construction
Document No.: 63177
Revision: 07-Nov-2011
For questions, contact
foil@vishaypg.com
www.vishayfoilresistors.com
3
VSMF Series (1206, 2010, 2512)
Vishay Foil Resistors
FIGURE 6—THERMAL SHOCK
Thermal Shock
–65°C/30 min
+150°C/30 min,
300 cycle (5, 10, 50, 100, 200, 300), n=20
500
400
300
200
∆R (ppm)
100
0
–100 0
–200
–300
–400
–500
Number of Cycles
Average
50
100
150
200
250
300
FIGURE 7—LOAD LIFE
Load Life
70°C, Rated Power (0.3W), 1.5 hr/ON
0.5 hr/OFF, 2000 hr
Size 2010, 10 K ; n=30
200
150
100
∆R (ppm)
50
0
–50
–100
–150
–200
Time (hr)
Average
0
200
0
400
600
800
1000 1200 1400 1600 1800 2000
High Temperature Exposure
FIGURE 8—HIGH TEMPERATURE EXPOSURE
+150°C, No Load, 1000 hr, n=30
Size 2010, 10 K
250
200
150
100
50
0
0
–50
–100
–150
–200
–250
∆R (ppm)
100
200
300
400
500
600
700
800
900
1000
Time (hr)
Average
www.vishayfoilresistors.com
4
For questions, contact
foil@vishaypg.com
Document No.: 63177
Revision: 07-Nov-2011
VSMF Series (1206, 2010, 2512)
Vishay Foil Resistors
TABLE 5—GLOBAL PART NUMBER INFORMATION
DENOTES PRECISION
Y
VALUE
R
=
K
=k
(1)
NEW GLOBAL PART NUMBER: Y161512K7560T0R (preferred part number format)
CHARACTERISTICS
0
= standard
9
= lead (Pb)-free
1 to 999
= custom
7
5
6
0
T
0
R
Y
1
6
1
5
1
2
K
PRODUCT CODE
1615
= VSMF1206
1616
= VSMF2010
1617
= VSMF2512
RESISTANCE TOLERANCE
T
= ±0.01%
Q
= ±0.02%
A
= ±0.05%
B
= ±0.10%
C
= ±0.25%
PACKAGING
R
= tape and reel
W
= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1615 12K7560 T 0 R:
TYPE: VSMF1206
VALUES: 12.7560 k
ABSOLUTE TOLERANCE: 0.01%
TERMINATION: standard
PACKAGING: tape and reel
HISTORICAL PART NUMBER: VSMF1206 12K756 TCR2 T B T (will continue to be used)
VSMF1206
MODEL
VSMF1206
VSMF2010
VSMF2512
12K756
RESISTANCE
VALUE
12.756 k
TCR2
TCR
CHARACTERISTICS
T
TOLERANCE
T
= ±0.01%
Q
= ±0.02%
A
= ±0.05%
B
= ±0.10%
C
= ±0.25%
B
TERMINATION
S
= lead (Pb)-free
B
= tin/lead
T
PACKAGING
T
= tape and reel
W
= waffle pack
Note
(1 )
For non-standard requests, please contact application engineering.
Document No.: 63177
Revision: 07-Nov-2011
For questions, contact
foil@vishaypg.com
www.vishayfoilresistors.com
5
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Lightning protection wiring of generator-transformer unit

ATARI pulse width modulation regulated power supply circuit

Constant current source circuit diagram using 78XX

Single phase capacitor motor wiring

Adjustable flasher

Computer motherboard circuit diagram 830_54

DC/DC 24V to 5V
There is a project to convert 24V to 5V and I plan to use Ti's TPS54331, but the customer requires that this module must be able to withstand 3kv AC. Could you please tell me how to achieve this?...
rhoda_yao Power technology
[GD32E503 Review] Part 3: Screen Code Analysis
1. Introduction After a long time, I finally took the opportunity to write a review today while my wife and colleagues were having a party. Haha, I have no choice~ 2. Screen program download The envir...
PowerWorld Domestic Chip Exchange
PIC microcontroller key recognition program
I am working on a project, in which I need to write a key program. In the PIC microcontroller, there are six keys in total, and each key must have this function: short press (2s) to add and subtract. ...
yanjianguo Microchip MCU
How capacitive isolation solves key challenges in AC motor drives
Signal and power isolation helps ensure stable operation of AC motor drive systems and protect operators from high voltage hazards. But not all isolation technologies meet all needs, especially when i...
alan000345 TI Technology Forum
The GPRS module uses AT commands to make calls, but there is no sound from the headset
We use ARM to control the GPRS module and use the corresponding AT commands to implement the calling function. After inserting the SIM card, if there is an incoming call or a phone call, it seems to b...
243663934 Embedded System
What books should I read about low-level drivers?
I will start working on it next month. I have never worked on low-level drivers before, so I want to make some preparations in advance. I only know that the development environment is linux+arm, and i...
hailangties Embedded System
Shortcut:   E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components

  1. MM-4J2-100-PS1-992E-KN14
  2. TVP02RW2529PALC
  3. MMCEVB2107
  4. NMP1K2-HE#KHE-00
  5. HBK471MBFCRAKR
  6. SP00CE-16-8PZ
  7. DDF-E9S-KJ-300
  8. CR-06DLA--137R
  9. FR2A-AU_A_00001
  10. 3.0SMCJ26C_R1_10001
  11. 1N5229D
  12. C6500HF-8P-R

Popular Articles

  1. Being at the forefront of automotive electronics, where will the automotive industry head?
  2. Wafer foundry orders cut in Q4? Why does the industry's view differ from Morgan Stanley's?
  3. To seize overseas lithium resources, it is reported that CATL bids for a Canadian lithium mining company for US$300 million
  4. GNU Freestanding (Naked) C ARM cross-development environment creation and testing
  5. How to Design an Accurate DC Power Supply
  6. MCU stepper motor driver ULN2003 28BYJ-48 5-wire 4-phase motor
  7. How to operate the pressure calibrator
  8. Silicon-based lithium battery that can increase power storage capacity ten times - coming to cars soon
  9. Migrate RT2870 wireless network card driver to s3c2416
  10. Application of Fluke ii900 ultrasonic partial discharge imager in partial discharge of high-voltage electrical equipment

Technical ResourceMore

  1. Detailed description of uCOS-II porting on STM32 platform
  2. Flexible Printed Circuit Board (FPC) Design Specifications
  3. Follow Me Season 3 Episode 4 Task Source Code Submission
  4. VC++ program source code to read serial port data and draw real-time curves
  5. \"C Programming Language (2nd Edition) Exercises and Answers\" Chinese PDF clear version
  6. Modern motor control technology
  7. FPGA-Based Prototyping Methodology Manual
  8. i2c bus protocol (Chinese version pdf)
  9. [Follow me Season 3 Episode 4] Infineon CY8CPROTO-063-BLE Development Board Full Task Practical Source Code
  10. 51 MCU detailed tutorial (all 28 lessons)

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 552  1936  749  1085  2877  12  39  16  22  58 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号