SPECIFICATION
•
Supplier : Samsung electro-mechanics
•
Product : Thick - Film chip RESISTOR
A. Samsung Part Number
RC 0603
①
①
Code designation
②
Dimension
③
Resistancs tolerance
④
Nominal resistance value
②
G
③
***
④
CS
⑤
•
Samsung P/N:
•
Description :
RC0603G***CS
0603, ±2%, (1Ω~1㏁), 1/20W
Samsung Thick - Film Chip Resistor
0603 (mm code)
±2 %
※3digits
-Left 2 digits : Resistance value, Right 1 digits : Exponential number of 10.
ex) 101 : 10×10
1
= 10×10 = 100Ω
※4digits
-Left 3 digits : Resistance value, Right 1 digits : Exponential number of 10.
ex) 4222 : 422×10
2
= 422×100 = 42.2㏀
Read alphabet "R" as decimal point
"000" : Jumper(0Ω)
ex) 3R7 : 3.7 = 3.7Ω / 88R7 : 88.7 = 88.7Ω
L:
0.6
± 0.03
mm
W :
T :
0.3
± 0.03
mm
mm
0.23 ± 0.03
⑤
Packing code
7" Reel packaging
B. Samsung Reliablility Test and Judgement condition
Judgement
Resistor
Direct Current
Resistance
Short-time
Overload
Intermittent
Overload
Dielectric
Withstanding Voltage
Insulation
Resistance
■
J-Grade
Temperature
Characteristic
1Ω≤R<10Ω:+300/-200ppm/℃
10Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm)
1MΩ<R≤10MΩ:±300ppm/℃
■
F-Grade
10Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm)
Solderability
Coverage: 95%≤ each termination.
Over 1,000MΩ
Within the regulated resistance
tolerance.
Less than ±(1%+0.1Ω)of the initial value
No evidence of mechanical damage
Less than ±(3%+0.1Ω)of the initial value
No evidence of mechanical damage
No evidence of mechanical damage
50mΩ Max
50mΩ Max
Test condition
Jumper
50mΩ Max
Resistor
Voltage apply Within 5 sec
Jumper
Apply 2.5 times rated voltage for 5sec Max Surge
Current
2.5 times of rated voltage.
1 sec On, 25 sec Off / 10,000cycles
Apply Voltage for 1minute
0603:50v
1005,1608:100v
Other: 500v
Test Temperature(℃) 20℃→-55℃/20℃→125℃
Max Surge
Current
T.C.R(ppm/℃
)
=
R
−
R
0
1
×
×
10
6
R
0
T
−
T
0
T
0
: 20 ± 2℃, R0 : Resistance at T0 (Ω)
T : Test temperature , R : Resistance at T (Ω)
Solder Temp : 245℃
Dipping time : 3 sec
Judgement
Bending test
Adhesive strength
of termination
Resistance to
soldering heat
Anti-Vibration
test
Temperature
cycle
Load life
Low Temp.
Exposure
High Temp
Exposure
Moisture
Resistance
Less than ±(1%+0.05Ω)of the initial value
No evidence of mechanical damage
Less than ±(1%+0.05Ω)of the initial value
No evidence of mechanical damage
Less than ±(1%+0.1Ω)of the initial value
No evidence of mechanical damage
Less than ±(3%+0.1Ω)of the initial value
No evidence of mechanical damage
Less than ±(3%+0.1Ω)of the initial value
No evidence of mechanical damage
Less than ±(3%+0.1Ω)of the initial value
No evidence of mechanical damage
Less than ±(3%+0.1Ω)of the initial value
No evidence of mechanical damage
50mΩ Max
50mΩ Max
50mΩ Max
50mΩ Max
50mΩ Max
50mΩ Max
50mΩ Max
Less than ±(0.5%+0.05Ω)of the initial value 50mΩ Max
No evidence of mechanical damage
No mechanical damage or sign of disconnection
for 5sec.
Test condition
3mm of bending shall be applied
Test strengh : 5N
Test time: Applying pressure for 10seconds
260±5℃ , 10 sec
Test amplitude : 1.5mm
Frequency 10㎐-55㎐-10㎐ / 2hr in x,y,z direction.
100cycles, -55℃/30min
↔125℃/30min
sweep time:5min
Test voltage: rated voltage / 70±2℃
1,000hours(90min:On , 30min:Off)
Dwell in -55℃ chamber without loading
for 1,000hours
Dwel in 125℃ or 155℃ chamber without loading
for 1,000hours
Test voltage: rated voltage / 40±2℃
1,000hours(90min:On,30min:Off) / 90~95% RH
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the samsung chip RESISTOR catalogue.
Microcontroller MCU
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