3-Axis Digital Compass IC
HMC5843
The Honeywell HMC5843 is a surface mount multi-chip module designed
for low field magnetic sensing with a digital interface for applications such
as low cost compassing and magnetometry. The HMC5843 includes our
state of the art 1043 series magneto-resistive sensors plus Honeywell
developed ASIC containing amplification, strap drivers, offset cancellation,
12-bit ADC and an I C serial bus interface. The HMC5843 is in a 4.0 by 4.0
by 1.3mm surface mount leadless chip carrier (LCC). Applications for the
HMC5843 include Consumer Electronics, Auto Navigation Systems,
Personal Navigation Devices, and Magnetometers.
The HMC5843 utilizes Honeywell’s Anisotropic Magnetoresistive (AMR) technology that provides advantages over other
magnetic sensor technologies. The sensors feature precision in-axis sensitivity and linearity, solid-state construction with
very low cross-axis sensitivity designed to measure both direction and magnitude of Earth’s magnetic fields, from tens of
micro-gauss to 6 gauss. Honeywell’s Magnetic Sensors are among the most sensitive and reliable low-field sensors in the
industry.
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Honeywell continues to maintain product excellence and performance by introducing innovative solid-state magnetic
sensor solutions. These are highly reliable, top performance products that are delivered when promised. Honeywell’s
magnetic sensor solutions provide real solutions you can count on.
FEATURES
3-Axis Magnetoresistive Sensors and
ASIC in a Single Package
Low Cost
4.0 x 4.0 x 1.3mm Low Height Profile
LCC Surface Mount Package
Low Voltage Operations (2.5 to 3.3V)
Built-In Strap Drive Circuits
I C Digital Interface
Lead Free Package Construction
Wide Magnetic Field Range (+/-6 Oe)
Available in Tape & Reel Packaging
Fast 116 Hz Maximum Output Rate
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BENEFITS
for Highly Integrated Products. Just Add a Micro-
Small SizeInterface, Plus Two External SMT Capacitors
Controller
Designed for High Volume, Cost Sensitive OEM Designs
Easy to Assemble & Compatible with High Speed SMT Assembly
Compatible for Battery Powered Applications
Set/Reset and Offset Strap Drivers for Degaussing, Self Test, and
Offset Compensation
Popular Two-Wire Serial Data Interface for Consumer Electronics
Complies with Current Environmental Standards
Sensors Can Be Used in Strong Magnetic Field Environments
High Volume OEM Assembly
Enables Pedestrian Navigation and LBS Applications
HMC5843
SPECIFICATIONS
(
* Tested at 25°C except stated otherwise.)
Characteristics
Power Supply
Supply Voltage
Current Draw
AVDD Referenced to AGND
DVDD Referenced to DGND
Sleep Mode (dual supply)
Idle Mode (dual supply)
Measurement Mode (10 Hz averaged)
Dual supply (AVDD = 2.5V, DVDD = 1.8V)
Sleep Mode (single supply)
Idle Mode (single supply)
Measurement Mode (10 Hz averaged)
Single supply (AVDD = 2.5V)
Performance
Field Range
Mag Dynamic Range
Resolution
Linearity
Cross-Axis Sensitivity
Disturbing Field
Output Rate
Measurement Period
Turn-on Time
Gain Tolerance
I C Address
2
Conditions*
Min
2.5
1.6
-
-
-
-
-
-
Typ
Max
3.3
Units
Volts
Volts
µA
µA
mA
µA
µA
mA
1.8
2.5
240
0.8
110
340
0.9
2.0
-
-
-
-
-
-
Full scale (FS) – total applied field
3-bit gain control
AVDD=3.0V, GN
Full scale input range
Cross field = 0.5 gauss,
Happlied = ±3 gauss
Sensitivity starts to degrade.
Use S/R pulse to restore sensitivity.
Refer to Configuration Register A section
Output Rate = 50Hz (10Hz typ.)
All gain/dynamic range settings
7-bit address
8-bit read address
8-bit write address
-4
±0.7
±1.0
7
+4
±4.0
0.1
±0.2%
20
10
-
200
±5
0x1E
0x3D
0x3C
116
10
gauss
gauss
milli-gauss
±% FS
%FS/gauss
gauss
Hz
msec
µs
%
hex
hex
hex
I C Rate
I C Bus Pull-up
I C Hysteresis
2
2
2
Controlled by I C Master
Internal passive resistors
Hysteresis of Schmitt trigger inputs on SCL
and SDA - Fall (DVDD=1.8V)
Rise (DVDD=1.8V)
2
-10
50
0.603
1.108
±0.55
+10
%
kilo-ohms
Volts
Volts
gauss
Self Test
General
ESD Voltage
Operating Temperature
Storage Temperature
Weight
Reflow Classification
Positive and Negative Bias Mode
Human Body Model (all pins)
Machine Model (all pins)
Ambient
Ambient, unbiased
Nominal
MSL 3, 260 C Peak Temperature
-30
-40
700
170
85
125
50
V
°C
°C
milli-grams
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HMC5843
Absolute Maximum Ratings
(* Tested at 25°C except stated otherwise.)
Characteristics
Supply Voltage AVDD
Supply Voltage DVDD
Min
-0.3
-0.3
Max
5
2
Units
Volts
Volts
PIN CONFIGURATIONS
(Arrow indicates direction of applied field that generates a positive output voltage after a SET pulse.)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Name
SCL
SDAP
SCLP
NC
NC
OFFP
OFFN
NC
SETP
SETN
SVDD
DGND
C1
SETC
DVDD
VREN
AGND
AVDD
DRDY
SDA
Description
Serial Clock – I2C Master/Slave Clock – up to 400kbps I2C Speed
Serial Data Pull-up Resistor – 50k-ohm to VDD
Serial Clock Pull-up Resistor – 50k-ohm to VDD
No Connection
No Connection
Offset Strap Positive
Offset Strap Negative
No Connection
Set/Reset Strap Positive – S/R Capacitor (C2) Connection – Strap Side
Set/Reset Strap Negative – Test Point
Sensor Supply – Test Point
Digital Supply Ground/Return
Reservoir Capacitor (C1) Connection – 4.7uf to GND
S/R Capacitor (C2) Connection – Driver Side – Driver Side to 0.22uf
Digital Positive Supply – +1.62 to +1.98 volts input when used
Voltage Regulator Enable, (GND = Dual Supply, AVDD = Single Supply)
Analog Supply Ground/Return
Analog Positive Supply – +2.4 to +3.3 volts input
Data Ready – Test Point
Serial Data – I2C Master/Slave Data – up to 400kbps I2C Speed
Table 1: Pin Configurations
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HMC5843
SDAP
SDAP
2
SCLP
SCL
1
TP1
TP1
4
TP0
3
5
SDA 20
DRDY 19
Z
AVDD 18
AGND 17
VREN 16
X
Y
6
7
8
9
10
OFFP
OFFN
NC
SETP
SETN
15
14
13
12
11
HMC5843 – bottom view
DVDD
DVDD
SETC
C1
C1
DGND
SVDD
SVDD
PACKAGE OUTLINES
PACKAGE DRAWING HMC5843 (20-PIN LPCC, dimensions in millimeters)
Pin 1
D3
D2
A
Sym
A
D
D2
Min
1.20
Nom
-
4.0 BSC
2.25
0.25 x 20 pins
4.0 BSC
2.25
0.50 Basic
0.40 x 20 pins
Max
1.46
E2
E
D3
E
E2
e
L
L
D
e
HMC5843 – bottom view
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HMC5843
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC5843.
PCB Pad Definition and Traces
The HMC5843 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.40mm by
0.25mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Size the traces between the HMC5843 and the external
capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
This device is classified as MSL 3 with 260 C peak reflow temperature. A baking process (125 C, 24 hrs) is required if
device is not kept continuously in a dry (< 10% RH) environment before assembly. No special profile is required for the
HMC5843 and compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends the
adherence to solder paste manufacturer’s guidelines. The HMC5843 may be reworked with soldering irons, but extreme
care must be taken not to overheat the copper pads from the part’s fiberglass substrate. Irons with a tip temperature no
greater than 315°C should be used. Excessive rework risks the copper pads pulling away into the molten solder.
INTERNAL SCHEMATIC DIAGRAM
HMC5843
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