Product Datasheet
ConnectCore
™
9M
Compact ARM9 Core Module
High-performance ARM9 core module with complete
embedded platform support combines processor per-
formance, low power requirements and rich peripheral
support in an ultra-compact form factor.
120-pin Connector
USB 1.1
Device
2 USB
1.1 Host
Audio
Camera
Memory
Controller
16/32/
64/128MB
SDRAM
32/64/128
512/1024 MB
NAND Flash
10 Mbps
Ethernet
(optional)
UART 1-3
ARM920T
400 MHz
SPI
Serial
EEPROM
IC
2
RTC
LCD
Controller
Interrupt
Controller
Touchscreen
Interface
IS
2
JTAG
120-pin Connector
Features/Benefits
• High-performance core processor
module in compact form factor
• Powerful 32-bit RISC processor
with on-chip peripheral options
• 300/400 MHz Samsung S3C2440
microprocessor with ARM920T core
• Very low-power operation
modes with Dynamic Voltage
Scaling
• Up to 2 GB Flash and 512 MB
SDRAM
• Optional 10 Mbit Ethernet
MAC/PHY
• Strong multimedia capabilities
with integrated LCD and
touch screen controller and
audio interfaces
• USB host/device support
• Memory/expansion card
interfaces
• Complete embedded software
platform offering with support
and design services
• Microsoft Windows CE and Linux
Development Kits available
Overview
The ConnectCore 9M module is the ideal solution for applications that require low-power
operation: mobile, battery operated devices or those located in remote locations without
readily available power. The module requires just 26 mA for normal operation at 3.3V,
and can be put in idle mode where it draws just 2.6 mA.
The module combines low-power operation with a powerful ARM9 microprocessor at speeds
up to 400 MHz with a wide array of peripherals. The LCD controller provides support for
both TFT and STN LCDs, and an integrated touch screen controller, making it perfect for
embedded applications that include a user interface. In addition, the module provides on-chip
audio capabilities, sophisticated power management options, optional network connectivity
and complete embedded software platform flexibility. An external 32-bit address/data bus
interface provides additional flexibility and almost unlimited design freedom.
Whether you want to leverage the feature-complete selection of the high-level software
components and applications in Microsoft
®
Windows
®
CE, or take advantage of the open
Linux
®
environment with its community support and comprehensive software library, Digi
offers a solution that meets your requirements while also dramatically shortening traditional
time-to-market by minimizing the overall software and hardware designs risks.
Complete LxNETES™ (Linux for NETworked Embedded Systems) and Microsoft
Windows CE Development Kits with module, development board, driver source code,
documentation, Flash programming tools, cables and accessories are available for
evaluation and development use. In addition, we offer professional support and product
design services to assist you with your project-specific needs.
www.digi.com
Features/Specifications
HARDWARE
• 32-bit Samsung S3C2440 ARM920T
high-performance RISC processor @
400 or 300 MHz
• Up to 2 GB NAND Flash and 512 MB
SDRAM on-board
• 1024-bit 1-Wire
®
EEPROM
• Optional 10 Mbps Ethernet MAC/PHY
(Cirrus Logic CS8900A)
• On-chip LCD controller for TFT/STN LCD
panels
- Up to VGA (640x480) resolution w/up
to 24bpp color depth
• On-board USB 1.1 host/device
- Full speed (12 Mbps) and low speed
(1.5 Mbps) modes
• 3 RS-232 interfaces
• SD/SDIO Card interface
• One I
2
C bus interface w/fast mode
(400 KHz) support
• I
2
S interface and AC’97 audio controller
• 32-bit external memory bus interface
• Up to 75 GPIO port options
• On-board JTAG interface
DEVELOPMENT KITS
• Linux
- LxNETES 3.x CD
o GNU toolchain
o Linux kernel 2.6.x w/patches
o BSP source code
o Boot loader w/source files
o Sample files and documentation
- ConnectCore 9M module
- Development board
- TFT LCD panel w/touch screen
- Power supply and cords
- JTAG booster and adapter
o Flash programming/verification
o I
2
C device access
o CPU signal tests
- Optional technical support services
• Microsoft Windows CE 5.0
- Microsoft Windows CE BSP CD
o BSP source code
o Boot loader w/source files
o Microsoft QFEs
o Sample files and documentation
- ConnectCore 9M module
- Development board
- TFT LCD panel w/touch screen
- Power supply and cords
- JTAG booster and adapter
o Flash programming/verification
o I
2
C device access
o CPU signal tests
- Optional technical support services
POWER
REQUIREMENTS
• 3.3VDC @ 26 mA / 180 mA (min/max)
• 3.3VDC @ 2.6 mA idle mode
ETHERNET INTERFACE
• Standard: IEEE 802.3
• Physical layer: 10 Base-T
• Data rate: 10 Mbps (auto-sensing)
• Mode: Full duplex
DIMENSIONS
• Length: 2.362 in (6.00 cm)
• Width: 1.732 in (4.4 cm)
• Height: 0.393 in (1.00 cm)
44.00
10.00
2.40
24.00
2x ÿ2.20
ENVIRONMENTAL
• Storage temperature:
-50° C to 125° C (-58° F to 257° F)
• Operating temperature:
-25° C to 75° C (-13° F to 167° F)
• Relative humidity:
5% to 90% (non-condensing)
• Altitude: 12,000 feet (3658 meters)
XXXXXXXX
XXX XXXX
+
X1
60.00
55.20
+
+
+
X2
MAC
00-04-F3
XX-XX-XX
MODEL......................PART NUMBERS
Model
ConnectCore 9P 2440 - 400 MHz, 32/32
(No Ethernet)
ConnectCore 9P 2440 - 400 MHz, 32/32
(10 MBit Ethernet)
LxNETES 3.2 Development Kit
Microsoft Windows CE 5.0 Development Kit
3.75
1.30
North America
FS-3007
FS-372
FS-9071
FS-9093
International
FS-3007
FS-372
FS-9071
FS-9093
max 3.0mm
max 2.2mm
6.00
35.60
Please contact us for additional part number information, availability of processor speed
grade population options, custom module populations, and our complete professional
design/support services offering.
DIGI SERVICE AND SUPPORT -
You can purchase with confidence knowing that Digi is here
to support you with expert technical support and a strong five-year warranty. www.digi.com/support
W
HEN
M
ATTERS™
Digi International,
the leader in device networking for business, develops reliable
products and technologies to connect and securely manage local or remote electronic
devices over the network or via the web. With over 20 million ports shipped worldwide
since 1985, Digi offers the highest levels of performance, flexibility and quality.
Digi International
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Minnetonka, MN 55343
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email: info@digi.com
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Tokyo 150-0031, Japan
PH: +81-3-5428-0261
FX: +81-3-5428-0262
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(HK) Limited
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191 Java Road
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www.digi.cn
www.digi.com
© 2006-2008 Digi International Inc.
Digi, Digi International, the Digi logo, the When Reliability Matters logo, ConnectCore and LxNETES are trademarks or registered trademarks
of Digi International, Inc in the United States and other countries worldwide. ARM is a trademark of ARM Limited. All other trademarks are the
property of their respective owners.
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