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AR235RAG8N7GST

Description
General Purpose Inductor, 0.0087uH, 2%, 1 Element, Ceramic-Core, SMD, CHIP, 0402
CategoryPassive components    inductor   
File Size150KB,3 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AR235RAG8N7GST Overview

General Purpose Inductor, 0.0087uH, 2%, 1 Element, Ceramic-Core, SMD, CHIP, 0402

AR235RAG8N7GST Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid8233056160
Reach Compliance Codecompliant
ECCN codeEAR99
core materialCERAMIC
DC Resistance0.07 Ω
Nominal inductance(L)0.0087 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Number of functions1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
Minimum quality factor (at nominal inductance)26
Maximum rated current0.7 A
self resonant frequency3400 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance2%
0402 CHIP INDUCTORS
Outgassing Compliant Chip Inductors
AR235RAG
Higher Q and lower DCR than other 0402 inductors
Very high SRF values – as high as 16 GHz
Excellent current handling capability – up to 2300 mA
High temperature materials allow operation in ambient
temperatures up to 155°C.
Passes NASA low outgassing specifications
Standard tin-lead (Sn-Pb) terminations ensures the best
possible board adhesion. Note: Nickel barrier termination
(tin-lead over tin over nickel over silver-platinum-glass frit,
termination code P) is recommended for hand soldering
applications.
Core material
Ceramic
Terminations
Tin-lead (63/37) over tin over nickel over silver-plati-
num-glass frit. Other terminations are also available.
Weight
0.65 – 1.3 mg
Ambient temperature
–65°C to +125°C with
Imax
current
Maximum part temperature
+155°C (ambient + temp rise)
Storage temperature
Component: –65°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +125 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Typical Q vs Frequency
50
45
40
39 nH
Inductance (nH)
35
30
25
20
15
10
5
0
19 nH
11 nH
5.6 nH
2.0 nH
27 nH
1
10
100
1000
10000
Frequency (MHz)
Typical L vs Frequency
120
110
100
90
80
70
60
50
40
30
20
10
0
5.6 nH
2.0 nH
11 nH
27 nH
19 nH
39 nH
B*
overall
C*
D
H
I
J
I
F
A*
G
F
Q Factor
Enhanced crush-resistant packaging
2000 per 7″ reel.
Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing
1
10
100
1000
10000
Frequency (MHz)
Suggested
Land Pattern
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
*Dimensions are before solder application.
For maximum overall dimensions including
solder, add 0.0025 in / 0.064 mm to B and
0.006 in / 0.15 mm to A and C.
1–51 nH
A max
0.045
1,14
A max
0.044
1,12
F
0.008
0,20
B
0.020 – 0.028
0,51 – 0,071
B
0.020 – 0.028
0,51 – 0,071
G
0.024
0,61
®
C max
0.024
0,61
C max
0.026
0,66
I
0.014
0,36
inches
mm
inches
mm
J
0.024
0,61
inches
mm
Document AR526-1 Revised 08/21/18
56–220 nH
D
0.010
0,25
E
0.020
0,51
H
0.026
0,66
© Coilcraft, Inc. 2018
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
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