|
PGA5807EVM |
PGA5807RGCR |
PGA5807RGCT |
| Description |
RF Development Tools |
RF Front End Integrated 8-channel AFE with LNA, PGA, and LPF 64-VQFN -40 to 85 |
RF Front End Integrated 8Ch AFE |
| Is it lead-free? |
- |
Lead free |
Lead free |
| Is it Rohs certified? |
- |
conform to |
conform to |
| Maker |
- |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
- |
QFN |
QFN |
| package instruction |
- |
PLASTIC, VQFN-64 |
PLASTIC, VQFN-64 |
| Contacts |
- |
64 |
64 |
| Reach Compliance Code |
- |
compliant |
compliant |
| JESD-30 code |
- |
S-PQCC-N64 |
S-PQCC-N64 |
| JESD-609 code |
- |
e4 |
e4 |
| length |
- |
9 mm |
9 mm |
| Humidity sensitivity level |
- |
3 |
3 |
| Number of functions |
- |
1 |
1 |
| Number of terminals |
- |
64 |
64 |
| Maximum operating temperature |
- |
85 °C |
85 °C |
| Minimum operating temperature |
- |
-40 °C |
-40 °C |
| Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
- |
HVQCCN |
HVQCCN |
| Package shape |
- |
SQUARE |
SQUARE |
| Package form |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
| Maximum seat height |
- |
1 mm |
1 mm |
| Nominal supply voltage |
- |
3.3 V |
3.3 V |
| surface mount |
- |
YES |
YES |
| Telecom integrated circuit types |
- |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
| Temperature level |
- |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
- |
NO LEAD |
NO LEAD |
| Terminal pitch |
- |
0.5 mm |
0.5 mm |
| Terminal location |
- |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
- |
9 mm |
9 mm |
| Base Number Matches |
- |
1 |
1 |