June 2013
Passive components sales offices
●
Head office
206, Cheomdansaneop Road,
Yeongtong-gu, Suwon-city,
Gyeonggi province, Korea,
443- 743
Europe
Te l:+82- 31- 210 - 6328
E-mail:james.pyun@samsung.com
America
Te l:+82- 31- 210 - 6803
E-mail:wesley.roh@samsung.com
Asia
Te l:+82 - 31- 210 - 6791
E-mail:peter_kim@samsung.com
Domestic
Te l:+82- 31- 210 - 5074
E-mail:boungho.lee@samsung.com
●
Philippines Plant (Philippines)
Block No.5, Calamba Premiere
International Park, Batino, Calamba,
Laguna, Manila, Philippines 4027
Te l:+63 - 49- 545- 0422
E-mail:donna@samsung.com
●
America sales office
Irvine Office
3333 Michelson Drive,
Suite 500, Irvine, CA 92612, USA
Tel: 1-949-797-8016
E-mail: andrew.skelly@samsung.com
Asia sales offices
Shenzhen Office
46 F, New World Center,
Yitian Road, Futian District,
Shenzhen, 518026 China
Te l:86 - 755 - 8608- 5571
E-mail:jackson.xian@samsung.com
Shanghai Office
Rm. 1211, Shanghai International
Trade Center, No. 2201 Yan an(W) Rd.,
Shanghai, 200335 China
Te l:86 - 21- 6270 - 4168(274)
E-mail:dennis.cha@samsung.com
HongKong Office
8/F.,Central Plaza, 18 Harbour Road,
Wanchai, Hongkong, China
Te l:852-28626344
E-mail:vivianchan@samsung.com
Qingdao Office
Rm 1201. Growne Plaza Qingdao 76,
Xiang Gang Zhong Rd, Qingdao,
266071 China
Te l:86 - 532 - 85779102
E-mail:zhengguo.cui@samsung.com
Taiwan Office
9F - 1, Np. 399 Ruey Kuang Rd., Neihu
District, Taipei City, Taiwan, 114
Te l:886 - 2 - 2656 - 8356
E-mail:kevin0130.wang@samsung.com
Singapore Office
3 Church Street Samsung Hub,
#23-02 Singapore 049483
Te l:65-6833 - 3228
E-mail:winson.yeong@samsung.com
Bangkok Office
23rd Floor, Lake Rajada Office Complex
193/89 Rachadapisek Road,
Khet Klongtoey, Bangkok 10110, Thailand
Te l:66 - 2- 661- 8004~5
E-mail:yangshin.yi@samsung.com
●
Europe sales offices
Frankfurt Office
Samsung Haus, Am Kronberger Hang 6,
D-65824 Schwalbach/Ts. Germany
Te l:49 - 6196 - 66 - 7255
E-mail:frank.goebel@samsung.com
Hungary Office
H-2310, Leshegy utca 2-4,
Szigetszentmiklos, Pest megye, Hungary
Te l:36 - 24 - 551- 148
E-mail:jun21c.lee@samsung.com
●
●
Manufacturing sites
Suwon Plant (Korea)
206, Cheomdansaneop Road,
Yeongtong-gu, Suwon-city,
Gyeonggi province, Korea,
443- 743
Te l:+82- 31- 210-5074
E-mail:boungho.lee@samsung.com
Busan Plant (Korea)
1623 - 2, Songjeong- dong,
Gangseo- gu, Busan, Korea,
618 - 270
Te l:+82- 51- 970 - 7671
E-mail:kyc.kweon@samsung.com
Tianjin Plant (China)
27, Heiniucheng- Road, Hexi District,
Tianjin, 300210 China
Te l:+86 - 22 - 2397- 9000(310)
E-mail:moohantop.Park@samsung.com
High Tech (China)
Xiqing Dist. Micro-Electronics
Industrial Park, Jingang Highway,
Tianjin, China 300485
Tel:+ 022- 23979000- 313
E-mail: enhao.song@samsung.com
Binhai Plant(China)
80, XiaQing Road, West area of
BinHai development zone,
TianJin, 300458, China
Te l:+86- 22- 6686- 3333(1300)
E-mail:sk1000.kim@samsung.com
Domestic Distributors
Korchip Corporation
817-38, Anyang 2- dong, Manan- gu,
Anyang-city, Gyeonggi province,
Korea, 430-812
Te l:+82 - 31- 361- 8100
E-mail:itasap@korchip.com
SAMT
Daekyung Bldg., 983-10, Daechi-dong,
Gangnam-gu, Seoul, Korea
Te l:+82- 2- 3458- 9000
E-mail:info@isamt.com
CHUNGMAC
301 Gwonseon Medivill, 544-14
Gokbanjeong-dong, Gwonseon-gu,
Suwon-si, Gyeonggi-do Korea
Te l:+82- 31- 234- 2367~8
E-mail:webmaster@chungmac.co.kr
YOUNGDUK
Gasan-Dong 632, Seobusaetgil,
Geumcheon-Gu, Seoul, Korea
Te l:+82- 2- 2107- 7860
E-mail:siyang1109@gmail.com
All information indicated in this catalog is as of June 2013
* The specifications and designs contained herein may be subject to change without notice.
CONTENTS
Operation Notes
Example of Land Pattern Design
Recommended Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms(RUT Series)
Ultra Low Ohms(RU Series)
Ultra Low Ohms(RUK Series)
Ultra Low Ohms(RJ Series)
Arrays(CONVEX Type)
Arrays(CONCAVE Type)
4
5
6
7
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
We, Samsung, declare that our component Chip Resistor is produced in accordance
with EU RoHS directive.
1. RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
Arrays(FLAT Type)
Anti-Sulfur Resistors
Attenuator
Characteristics Performance
Packaging
Standard Resistance Value
2. No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com, http://www.semlcr.com]
Operation Notes
Applications
•Chip
resistors are designed for general electronic devices
such as home appliances, computer, mobile communications,
digital circuit, etc. If you require our products with high
reliability-performing at more than 125℃ or below -55℃- for
medical equipments, aircrafts, high speed machines, military
usage, and items that can affect human life or if you need to
use in specific conditions (corrosive gas atmosphere like H
2
S
etc.), please contact us beforehand.
•Normal
operation temperature ranges (℃): -55℃~+155℃
•Others
(rectangular, array_Flat type, trimmable) : -55℃~+125℃
•Although
resistor body is coated, sharp excessive impact
should be avoided to prevent damages and adverse effects
on characteristics (resistor value, open circuited, T.C.R.).
Example of Land
Pattern Design
Storage
To maintain proper quality of chip components, the following
precautions are required for storage environment, method and
period.
•
Storage Environment
- Make sure that the ambient temperature is within 5℃~40℃
and the ambient humidity is within 20~70%RH.
- Chip components may be deformed, if the temperature of
packaged components exceeds 40℃.
- Do not store where the soldering properties can be
deteriorated by harmful gas such as sulphurous gas,
chlorine gas, etc.
- Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating.
- The remaining unused chips should be put in the original
bag and sealed again or store in a desiccator containing a
desiccating agent.
•Storage
Time Period
Stored chip components should be used within 6 months
after receiving the components. If 6 months or more have
elapsed, please check the solderability before actually using.
Example of Land Pattern Design
When designing P.C.B, the shape and size of the solder lands must allow a proper amount of solder to form under the resistor.
The amount of solder formed at the end terminations has direct effect on the possibility of chip crack.
The more the amount of solder and stress, the more the possibilities of chip crack.
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
A
For Chip Type
: Land Pattern
C
: Chip Resistor
A
B
Mounting
Please give more attention not to press the chip owing to the
nozzle's improper height when it is mounted on PCB.
(Excessive pressure may cause exterior damage, change in
resistance, circuit open, etc.)
•Reflow
soldering
Type
0402
0603
1005
1608
2012
3216
3225
5025
6432
(UNIT: mm)
•
Reflow soldering
(RU,RUW,RUK)
Type
1005
1608
2012
3216
3225
5025
6432
(UNIT: mm)
•Flow
soldering
Type
1005
1608
2012
3216
3225
5025
6432
(UNIT: mm)
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
A
0.17
0.37
0.6
0.8
0.9
1.3
1.3
1.4
1.4
B
0.20
0.28
0.5
0.8
1.4
1.8
1.8
3.3
4.6
2A+B
0.54
1.02
1.7
2.4
3.2
4.4
4.4
6.1
7.4
C
0.18
0.29
0.5
0.8
1.2
1.5
2.4
2.4
3.0
A
0.8
0.8
0.9
1.7
1.7
2.15
2.3
B
0.5
0.5
0.8
1.2
1.2
1.8
3.0
2A+B
2.1
2.1
2.6
4.6
4.6
6.1
7.6
C
0.5
0.8
1.2
1.4
2.6
2.6
3.3
A
0.7
0.9
1.0
1.4
1.4
1.5
1.5
B
0.5
0.8
1.4
1.8
1.8
3.3
4.6
2A+B
1.9
2.6
3.4
4.6
4.6
6.3
7.6
C
0.5
0.8
1.3
1.6
2.6
2.5
3.2
Safety precautions
•These
products are designed and produced for applying
to the ordinary electronic equipments.
(AV equipment, OA equipment,Telecommunication
equipment, etc)
•Consult
with our sales department before applying
in the devices that require extremely high
reliability such as medical equipments, transport
equipments, aircrafts/spacecrafts, nuclear power
controllers, fuel controllers, car equipments including
car accessories and other safety devices.
•Following
special environments, and such
environmental conditions may affect the performance
of the product. Please verify the performance
and reliability thoroughly prior to use.
a) Using in various type of Liquid including water,
oil, organic solvent and other chemicals.
b) Using in the places where the products are exposed
to direct sunlight, sea wind, corrosive
gases (including Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
),
static electricity, electromagnetic waves and dusty air.
c) Using close to heat generating components or
other flammable items.
d) Using in the places that is sealed or coated
with resins or other coating materials after
soldering.
e) Using in places subject to dew condensation.
•These
products are not radiation resistant.
•The
company is not responsible for any problems
resulting from using of the products under the
conditions not recommended herein.
•The
company should notify any safety issues of the
products to the customer. And the safety of the
products should be monitored by the customer
periodically.
Cleaning
After Soldering Cleaning, soldering flux & Ionic cleaning
liquid should be avoided on product.
If any possibility on product, please take a test before usage.
Caution for Chip Resistor
Seperation from PCB.
Chip resistor installation on PCB is a similar phenomenon on
to a chocolate chip on top of a cake.
PCB has enough flexibility on outer force but Chip resistor
can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separating a Chip resistor from a PCB,
beware of any crack on the chip.
For Array Type
•Convex
type
P
2
P
1
E
: Land Pattern
D
: Chip Resistor
D
•Concave
type
P
E
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Others
•Manual
work
Whenever separating chip resistor from PCB, do not re-use
the chip resistor for circuit safety.
Electrical specification of chip resistors can be changed
by soldering iron after separation.
Re-use of separated chip resistor should be prohibited.
•Do
not use more than rated voltage.
(Please check the contents of each product)
A
B
C
(UNIT: mm)
A
B
C
(UNIT: mm)
Type
062P
064P
10AT
102P
104P
164P
A
0.20
0.20
0.4
0.4
0.7
0.7
B
0.20
0.20
0.4
0.4
0.3
0.5
C
0.30
0.20
0.25
0.25
0.2
0.3
D
0.30
0.30
0.5
0.5
0.5
0.9
E
0.30
0.30
0.5
0.5
0.5
0.8
P
1
0.6
0.5
0.65
0.65
0.55
0.9
P
2
-
0.5
-
0.5
0.8
Type
102P
104P
A
0.3
0.3
B
0.3
0.3
C
0.2
0.2
D
0.5
0.5
E
0.4
0.4
P
0.5
0.5
Characteristics
Performance
Packaging
Standard
Resistance Value
•This
is the recommended land pattern for designing PCB.
This pattern does not guarantee any characteristic of other product.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
4
5
Recommended Soldering
Conditions
Abstract
•There
are 3 soldering methods.
- Flow(wave) soldering.
- Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.)
- Iron soldering.
Wave Soldering
Single Wave
Double Waves
Total Heating
Infrared Ray
Convection/Infrared
Hot Air
Hot Plate
Laser
Optical Beam
Air Heater
General Structure
Reflow Soldering
•
Pre-heating and cooling
In the reflow soldering method, a full pre-heating at the proper
temperature is necessary to dry and activate solder paste.
Tomb-stoning can be reduced by preheating at 150~180℃ for
more than 1 minute. Also when cooling is done by dipping into
solvent, care should be taken to keep the temperature difference
within 150℃.
•Standard
Reflow Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the right graph. This prevents the terminations from leaching
and characteristics from deteriorating. When soldering is
repeated, the allowed time is the accumulated time.
Pre-heating
260±5℃
10 sec. max.
Gradual Cooling
in the air
Soldering
Temp.(℃)
200℃
150℃
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
217℃
Soldering Methods
Reflow Soldering
Time(sec.)
< Reflow Soldering>
Local Heating
Iron Soldering
•Standard
solder amount
When a PCB is warped, mechanical stress applied to the chip should be reduced, and to do so, care should be taken not to use
excessive amount of solder on the PCB. In the case of the reflow method, the thickness of the coated solder paste is controlled to
prevent excessive solder. The thickness of solder paste should be 100~300㎛.
•
Tombstoning and Prevention
When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break
away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon.
- Preventing tombstoning
Keep land size as small as possible.
Keep the pre-heating conditions properly
( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.)
Keep the solder paste quantity not too much and uniform for every lands.
Keep the position of chips properly.
At around the soldering temperature, keep minimum difference of the temperature between the electrodes of a chip.
General
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Since Chip resistors come into direct contact with melted solder during soldering, it is exposed to potential mechanical stress caused
by the sudden temperature change. The chip resistors may also be subject to silver migration and flux contamination.
Flow(wave) Soldering
•Features
There are two types of soldering methods in flow(wave) soldering.
One is single wave soldering, and the other is a double waves
soldering. However, double waves soldering is mainly used. This
method is designed for continuous and multiple dipping process by
using primary and secondary wave, having completely different
waveforms and characteristics.
With the primary wave, a comparatively strong jet flow is used
to remove the flux gas and to solder.
With the secondary wave, it is used to remove excessive solder.
With the primary wave, the solder flows into a very small gap
between components and air bubbles remaining on the soldered
joint are removed.
With the secondary wave, the peel back is used to prevent bridging.
PCB
solder
Iron Soldering
When using a soldering iron or any other soldering operation, the permissible temperature and time should not exceed
that of the reflow soldering. In order to prevent the external terminations from leaching and characteristics from deteriorating,
the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering
iron and correcting with a soldering iron can be performed right under following conditions.
Primary wave
Secondary wave
•Preheating
If a chip component is heated suddenlyduring soldering, it may
crack by the thermal shock caused by the temperature difference
between the surface and the inside of the chip. To prevent this,
a full preheating is necessary. In case of wave soldering, the
temperature difference between solder and surface of the
component should be kept within 150℃. Also when cooling is
done by dipping into solvent, care should be taken to keep the
temperature difference within 150℃.
•Standard
Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the graph at right. An excessively long soldering time or high
soldering temperature results in leaching of outer terminations.
When a PCB is warped, mechanical stress applied to the chip
will be increased and might cause chip crack, especially if there
is a big amount of solder on the chip. So, care should be taken
not to use excessive amount of solder on the PCB.
For the flow(wave) soldering, the solder amount can be
controlled by land size.
Item
Pre-heating
Soldering
Temp.(℃)
△T
( )1206(3216)
and below
Ⅰ
:150℃ max.
Condition
350℃ Max.
20-Watt Max.
Ø3mm
Max.
Do not directly touch the chip by the tip of the iron.
260±5℃
5 sec. max.
Gradual Cooling
in the air
Temperature at tip
Soldering iron output
End of soldering iron
Note
Pre-heating
Temp.(℃)
General Structure of the Chip Resistor
Time(sec.)
< Flow Soldering>
Characteristics
Performance
No.
Name
Ceramic Substrate
Inner Electrode
Resistor
Glass Coat
Protective Coat
Terminal Coat
Ni Plate
Sn Plate
Main Substance
Al
2
O
3
Ag
RuO
2
Bi
2
O
3
, SiO
2
Polymer / Glass
Ni-Cr Alloy /Ag
Ni
Sn
120 sec. min.
Packaging
Standard
Resistance Value
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
6
7
General
Feature
•Very
small, thin, and light weight.
•Both
flow and reflow soldering are applicable.
•Very
low inductance.
•Suitable
size and packaging for surface mount assembly.
•
Lead-free terminal.
•PbO(lead
oxide) is included in the glass of our product which is
prescribed on RoHS appendix as an exemption.
Specification
Type
RC 0402
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
Power
Rating
(W)
1/32
1/20
1/16
1/10
1/8
1/4
1/3
2/3
1
Working Overload
Voltage Voltage
(MAX)
(MAX)
15(V)
25(V)
50(V)
150(V)
200(V)
30(V)
50(V)
100(V)
300(V)
400(V)
TCR (ppm/℃)
1~99Ω: ±300
100~1 : ±250
1~9.9Ω:+300,-200
10Ω~1
:±100
(0603: ±250)
1.1 ~10
:±300
Resistance
Range (Ω)
1Ω~1
Rated
Ambient
Temperature
Rated
Working
Temperature
-55℃~+125℃
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
Application
•General
purpose.
•Home
Appliances.
(DVD, Digital TV, Digital Camera, Audio, Tunner).
•For
Computers & Communications.
(Notebook, Memory Module, Mobile, Network Equipment, etc).
70℃
1Ω~10
-55℃~+155℃
General Structure
General
Precision
•Rated
voltage (V) = Rated power(W)×Nominal resistance value (Ω)
Rated voltage should be lower than (MAX) working voltage.
√
Structure and Dimensions
Power Derating Curve
W
H
100
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Operation area
40
20
0
-55
-30
0
30
60
70
155
103
l
1
L
<Top View>
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to derating curve in case of the 'Jumper')
<0402, 0603>
100
Percentage of the rated
dissipation(%)
80
60
<1005, 1608, 2012, 3216, 3225, 5025, 6432>
Percentage of the rated
dissipation(%)
I
2
<Side View>
(UNIT: mm)
80
60
40
20
0
-55
-40
0
40
70
125
Operation area
Type
RC0402
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
Inch
01005
0201
0402
0603
0805
1206
1210
2010
2512
L
0.40
±0.02
0.60
±0.03
1.00
±0.05
1.60
±0.10
2.00
±0.15
3.20
±0.15
3.20
±0.20
5.00
±0.20
6.30
±0.20
W
0.20
±0.02
0.30
±0.03
0.50
±0.05
0.80
±0.10
1.25
±0.15
1.60
±0.15
2.55
±0.20
2.50
±0.20
3.20
±0.20
H
0.13
±0.02
0.23
±0.03
0.35
±0.05
0.45
±0.10
0.50
±0.10
0.55
±0.10
0.55
±0.10
0.55
±0.10
0.55
±0.10
I
1
0.10
±0.03
0.10
±0.05
0.20
±0.10
0.30
±0.20
0.40
±0.20
0.45
±0.20
0.45
±0.20
0.60
±0.20
0.60
±0.20
I
2
0.10
±0.03
0.15
±0.05
0.25
±0.10
0.35
±0.10
0.35
±0.20
0.40
±0.20
0.40
±0.20
0.60
±0.20
0.60
±0.20
Average
Weight
0.04㎎
0.15㎎
0.6㎎
2.1㎎
4.9㎎
9.5㎎
16㎎
26㎎
41㎎
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
90
120
150
Ambient Temperature(℃)
80
120
Ambient Temperature(℃)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Marking
•
3 digits indication
(E-24 series)
- Left 2 digits represent
significant figures.
- Last 1 digit represents
exponential number of 10.
- Example:
103
Left 2 digits:
10
Last 1 digit:
3
103
=
10×10
3
Ω
=
10000Ω=10kΩ
IEC Code System (E-96, E-24)
•
4 digits indication
(E-96 series)
- Left 3 digits represent
significant figures.
- Last 1 digit represents
exponential number of 10.
- Example:
1002
Left 3 digits:
100
Last 1 digit:
2
1002
=
100×10
2
Ω
=
10000Ω=10k
Ω
E-96
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
E-24
10
E-96
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
301
309
E-24
18
E-96
316
324
332
340
348
357
365
374
383
392
402
412
422
432
442
453
464
475
487
499
511
523
536
549
E-24
33
E-96
562
576
590
604
619
634
649
665
681
698
715
732
750
768
787
806
825
845
866
887
909
931
953
976
E-24
56
Anti-Sulfur
Resistors
Attenuator
Parts Numbering System
•The
part number system shall be in the following format
RC
Code Designation
2012
Dimension & Size Code
0402: 0.4×0.2(㎜) - 01005(inch)
0603: 0.6×0.3(㎜) - 0201(inch)
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
3225: 3.2×2.5(㎜) - 1210(inch)
5025: 5.0×2.5(㎜) - 2010(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
J
Tolerance
100
Resistance Value
CS
Packaging Code
11
20
36
39
62
68
12
13
Characteristics
Performance
Packaging
22
75
24
43
RC: Chip Resistor
F : ±1%
G : ±2%
J : ±5%
K : ±10%
3 or 4 digits coding system
(IEC coding system)
3digits (E-24 series)
4digits (E-96 series)
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
AS: Tape Packaging 13"
103
1002
82
Standard
Resistance Value
15
16
47
51
27
•
0603, 1005 type: No marking.
•
0603, 1005, 1608 type:
No marking.
91
30
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
8
9
NXP MCU
京公网安备 11010802033920号
EEWORLD
