KTR series
●
Datasheet
Derating curve
When the ambient temperature exceeds 70°C, power dissipation must be adjusted according to the derating curves below.
■
KTR03/10/18/25
●
Characteristics
T items
est
Guaranteed >
Resistor type
See P.1
See P.1
±(2.0
％＋
0.1Ω)
Anew uniform coating of minimum
of 95% of the surface being
immersed and no soldering
damage.
±(1.0
％＋
0.05Ω)
No remarkable abnormality on the appearance.
±(1.0
％＋
0.05Ω)
±(3.0
％＋
0.1Ω)
±(3.0
％＋
0.1Ω)
±(3.0
％＋
0.1Ω)
±(1.0
％＋
0.05Ω)
±(1.0
％＋
0.05Ω)
Without mechanical damage such as breaks.
T conditions
est
20
℃
Measurement
：
+25/-55, +25/+125
℃
T voltage is the smaller one of
①
or
②
est
①
Rated voltage(current)×2.5
，
2s
②
Maximum overload voltage
※
Rosin-ethanol solution(25% weight)
Soldering condition
：
245±5
℃
Duration of immersion
：
2.0±0.5s
Soldering condition
：
260±5
℃
Duration of immersion
：
10±1s
T temp
：
-55
℃½
+125
℃
5cycle
est
40
℃，
93
％
(Relative humidity)
T time
：
1,000h
est
Rated voltage(current),70
℃
1.5h:ON
－
0.5h:OFF
T time
：
1,000h
est
155
℃
T time
：
1,000h
est
23±5
℃
Immersion cleaning,
Solvent: 2-propanol
-
Compliance Standard(s) : IEC60115-8
JISC 5201-8
Resistance
Variation of resistance
with temperature
Overload
Solderability
Resistance to
soldering heat
Rapid change of
temperature
Damp heat, steady state
Endurance at 70
℃
Endurance
Resistance to solvent
Bend strength of
the end face plating
※
Maximum overload voltage (T voltage)
est
KTR03
500V
KTR10
800V
KTR18
1000V
KTR25
1200V
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© 2016 ROHM Co., Ltd. All rights reserved.
3/4
2018.09 - Rev.F
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
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(Note1) Medical Equipment Classification of the Specific Applications
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CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
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2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
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[h] Use of the Products in places subject to dew condensation
The Products are not subject to radiation-proof design.
Please verify and confirm characteristics of the final or mounted products in using the Products.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
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De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
Confirm that operation temperature is within the specified range described in the product specification.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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(Note 1)
3.
4.
5.
6.
7.
8.
9.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
2.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
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Rev.003
Microcontroller MCU
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