Freescale Semiconductor
Technical Data
Document Number: MC33886
Rev 10.0, 01/2014
5.0 A H-Bridge
The 33886 is a monolithic H-Bridge ideal for fractional horsepower
DC-motor and bi-directional thrust solenoid control. The IC
incorporates internal control logic, charge pump, gate drive, and low
R
DS(ON)
MOSFET output circuitry. The 33886 is able to control
continuous inductive DC load currents up to 5.0 A. Output loads can
be pulse width modulated (PWM-ed) at frequencies up to 10 kHz.
A Fault Status output reports undervoltage, short-circuit, and
overtemperature conditions. Two independent inputs control the two
half-bridge totem-pole outputs. Two disable inputs force the H-Bridge
outputs to tri-state (exhibit high-impedance).
The 33886 is parametrically specified over a temperature range of
-40
C
T
A
125
C,
5.0 V
V+
28 V. The IC can also be operated
up to 40 V with derating of the specifications. The IC is available in a
surface mount power package with exposed pad for heatsinking. This
device is powered by SMARTMOS technology.
33886
H-BRIDGE
Features
• 5.0 V to 40 V continuous operation
• 120 m R
DS(on)
H-Bridge MOSFETs
• TTL / CMOS compatible Inputs
• PWM frequencies up to 10 kHz
• Active current limiting via internal constant off-time PWM (with
temperature-dependent threshold reduction)
• Output short-circuit protection
• Undervoltage shutdown
• Fault status reporting
VW SUFFIX (PB-FREE)
98ASH70702A
20-PIN HSOP
Applications
• Automotive systems
• DC motor control in industrial and robotic systems
• DC motor and actuator control in boats, RVs, and
marine systems
• Appliance and white goods electrical actuators
• Powered machine and hand tools
• Antenna rotors and dish positioning systems
5.0 V
CCP
33886
V+
OUT1
V+
MCU
IN
FS
Motor
IN1
IN2
D1
D2
OUT2
PGND
GND
OUT
OUT
OUT
OUT
Figure 1. 33886 Simplified Application Diagram
© Freescale Semiconductor, Inc., 2007 - 2014. All rights reserved.
1
Orderable Parts
Table 1. Orderable Part Variations
Part Number
MC33886PVW/R2
Temperature (T
A
)
-40 to 125 °C
Package
20 HSOP
33886
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
CCP
VPWR
CCP
V+
Charge
Pump
(each)
80
uA
80
A
5.0 V
Regulator
Current Limit,
Current Limit,
Overcurrent
Short-circuit
Sense
Sense Circuit
Circuit
OUT1
Gate Drive
OUT2
Over
Over-
temperature
temperature
Undervoltage
Undervoltage
IN1
IN2
D1
D2
25
A
Control
25 uA
Logic
FS
AGND
PGND
Figure 2. 33886 Simplified Internal Block Diagram
33886
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
PIN CONNECTIONS
AGND
FS
IN1
V+
V+
OUT1
OUT1
DNC
PGND
PGND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DNC
IN2
D1
CCP
V+
OUT2
OUT2
D2
PGND
PGND
Table 2. 33886 Pin Definitions
Figure 3. 33886 Pin Connections
A functional description of each pin can be found in the Functional Pin Description section beginning on
page 16.
Pin Number
1
2
Pin Name
AGND
FS
Formal Name
Analog Ground
Fault Status for H-
Bridge
Logic Input Control 1
Low-current analog signal ground.
Open drain active Low Fault Status output requiring a pull-up resistor to 5.0 V.
Definition
3
4, 5, 16
6, 7
8, 20
IN1
V
+
OUT1
DNC
True logic input control of OUT1 (i.e., IN1 logic High = OUT1 logic High).
Positive Power Supply Positive supply connections.
H-Bridge Output 1
Do Not Connect
Output 1 of H-Bridge.
Either do not connect (leave floating) or connect these pins to ground in the application.
They are test mode pins used in manufacturing only.
Device high-current power ground.
Active Low input used to simultaneously tri-state disable both H-Bridge outputs. When
D2 is logic Low, both outputs are tri-stated.
Output 2 of H-Bridge.
9 –12
13
PGND
D2
Power Ground
Disable 2
14, 15
17
18
OUT2
CCP
D1
H-Bridge Output 2
Charge Pump Capacitor External reservoir capacitor connection for internal charge pump capacitor.
Disable 1
Active High input used to simultaneously tri-state disable both H-Bridge outputs. When
D1 is logic High, both outputs are tri-stated.
True logic input control of OUT2 (i.e., IN2 logic High = OUT2 logic High).
19
IN2
Logic Input Control 2
33886
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Supply Voltage
Input Voltage
(1)
FS Status Output
(2)
Continuous Current
(3)
ESD Voltage for VW Package
Human Body Model
(4)
Machine Model
(5)
Storage Temperature
Ambient Operating Temperature
(6)
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow
(7)
,
(8)
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W)
(9)
Notes
1.
2.
3.
4.
5.
6.
7.
8.
V
ESD1
V
ESD2
T
STG
T
A
T
J
T
PPRT
R
JB
±2000
±200
-65 to 150
-40 to 125
-40 to 150
Note 7.
~5.0
C
C
C
°C
C/W
Symbol
V+
V
IN
V
FS
I
OUT
Value
40
-0.1 to 7.0
7.0
5.0
Unit
V
V
V
A
V
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.
Continuous current capability so long as junction temperature is
150
C.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
9.
33886
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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