KTR series
●
Datasheet
Derating curve
When the ambient temperature exceeds 70°C, power dissipation must be adjusted according to the derating curves below.
■
KTR03/10/18/25
●
Characteristics
T items
est
Guaranteed >
Resistor type
See P.1
See P.1
±(2.0
％＋
0.1Ω)
Anew uniform coating of minimum
of 95% of the surface being
immersed and no soldering
damage.
±(1.0
％＋
0.05Ω)
No remarkable abnormality on the appearance.
±(1.0
％＋
0.05Ω)
±(3.0
％＋
0.1Ω)
±(3.0
％＋
0.1Ω)
±(3.0
％＋
0.1Ω)
±(1.0
％＋
0.05Ω)
±(1.0
％＋
0.05Ω)
Without mechanical damage such as breaks.
T conditions
est
20
℃
Measurement
：
+25/-55, +25/+125
℃
T voltage is the smaller one of
①
or
②
est
①
Rated voltage(current)×2.5
，
2s
②
Maximum overload voltage
※
Rosin-ethanol solution(25% weight)
Soldering condition
：
245±5
℃
Duration of immersion
：
2.0±0.5s
Soldering condition
：
260±5
℃
Duration of immersion
：
10±1s
T temp
：
-55
℃½
+125
℃
5cycle
est
40
℃，
93
％
(Relative humidity)
T time
：
1,000h
est
Rated voltage(current),70
℃
1.5h:ON
－
0.5h:OFF
T time
：
1,000h
est
155
℃
T time
：
1,000h
est
23±5
℃
Immersion cleaning,
Solvent: 2-propanol
-
Compliance Standard(s) : IEC60115-8
JISC 5201-8
Resistance
Variation of resistance
with temperature
Overload
Solderability
Resistance to
soldering heat
Rapid change of
temperature
Damp heat, steady state
Endurance at 70
℃
Endurance
Resistance to solvent
Bend strength of
the end face plating
※
Maximum overload voltage (T voltage)
est
KTR03
500V
KTR10
800V
KTR18
1000V
KTR25
1200V
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3/4
2018.09 - Rev.F
Notice
Precaution on using ROHM Products
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,
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CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
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2
,
H
2
S, NH
3
, SO
2
, and NO
2
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Please verify and confirm characteristics of the final or mounted products in using the Products.
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confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
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the range that does not exceed the maximum junction temperature.
Confirm that operation temperature is within the specified range described in the product specification.
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(Note 1)
3.
4.
5.
6.
7.
8.
9.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
2.
For details, please refer to ROHM Mounting specification
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