F-214
ERM8–013–05.0–S–DV–DS–L–TR
™
ERM8–030–02.0–S–DV–TR
ERM8–060–05.0–L–DV–TR
(0,80 mm) .0315"
ERM8 SERIES
RUGGED HIGH SPEED HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERM8
Insulator Material:
Black LCP
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
2.2 A per per pin
(1 pin powered per row)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
200 VAC max
RoHS Compliant:
Yes
Board Mates:
ERF8
Cable Mates:
ERCD, ERDP
MATED HEIGHT*
ERM8
LEAD
STYLE
ERF8 LEAD STYLE
Hot Swap
option
Designed for Rugged
Micro pitch applications
–05.0
(7,00) .276
(10,00) .394
(13,00) .512
(14,00) .551
–07.0
(9,00) .354
(12,00) .472
(15,00) .591
(16,00) .629
–02.0
–05.0
–08.0
–09.0
(1,50 mm)
.059"
NOMINAL
WIPE
*Processing conditions will affect mated height.
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (005-030)
(0,12 mm) .005" max (040-060)
(0,15 mm) .006" max (070-075)
Rated @ 3dB Insertion Loss
with PCB effects*
w/o PCB effects**
Single-Ended Signaling
10.5 GHz / 21 Gbps
12 GHz / 24 Gbps
Differential Pair Signaling
9.5 GHz / 19 Gbps
15.5 GHz / 31 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?ERM8 or contact sig@samtec.com
ERM8/ERF8
7 mm Stack Height
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
ERM8
POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
DV
OTHER OPTION
TR
–TR
ls
toco d
Pro orte
Supp
notes at
Download app ppnote
om/a
www.samtec.c mtec.com
@ sa
Contact SIG n protocols
o
for questions
100 GbE
®
s
PCI Expres
–005, –010, –011,
–013, –020, –025,
–030,–035 –040,
–049, –050, –060,
–070, –075, –100
(8,91)
.351
Specify
LEAD
STYLE
from
chart
(5,70)
.224
–L
= 10µ"
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
–L, –DS, –EGP, –EGPS, –DSP and –DSS only
available in Lead Style –05.0
(–DS, –DSP & –DSS are Hot swappable)
= Tape
& Reel
Packaging
= Differential Pair
(–013, –025 Positions only)
–DS
–K
–S
= 30µ"
(0,76 µm)
Gold on
contact,
Matte Tin
on tail
= (4,00 mm) .157" DIA
Polyimide Film Pick & Place Pad
Specify –L, –EGP, EGPS, –DSP or –DSS
= Latching
(–05.0, –08.0, –09.0, lead styles only)
(7,20)
.283
–EGPS
APPLICATIONS
STANDARD
™
–L
SERIES
–L
POS. PART NOs.
NEXUS5001 .org
11
POWER.org
™
17
20
ARM/HSSTP
NEXUS5001
™
.org
23
POWER.org
™
35
LEAD
STYLE
ASP-137968-01 ERM8-DV
ASP-137972-01 ERM8-DV
ASP-130365-01 ERM8-DV
ASP-130366-01 ERM8-DV
ASP-135020-01 ERM8-DV
No. of Positions x
(0,80) .0315 + (6,00) .236
–L & –EGP = No. of Positions x
(0,80) .0315 + (9,00) .354
–EGPS = No. of Positions x
01
(0,80) .0315 + (10,00) .394
(10,80)
.425
= Extended Guide Post
(–05.0 lead style only)
–EGP
–EGP
A
(1,61) .063
(4,61) .181
(7,61) .300
(8,61) .339
B
(5,97) .235
(8,91) .351
(11,91) .469
(12,91) .508
02
(3,25) (5,60)
.128 .220
(3,20)
.126
(1,07)
.042
(0,80)
.0315
(1,32)
.052
DIA
(5,60)
.220
= Extended Guide Post Shield
(–05.0 lead style only)
(–010, –020, –025, –030 Positions only)
–EGPS
–DSP
–DSS
–02.0
–05.0
–08.0
–09.0
Note:
Patented
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(1,10)
.043
B
A
= Differential Pair + Extended Guide Post
(–013 & –025 Positions only)
= Differential Pair + Extended Guide Post Shield
(–025 positions only)
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