PHC084-3L1110-H datasheet, PDF

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PHC084-3L1110-H: DescriptionIC Socket, PGA84, 84 Contact(s); CategoryThe connector socket; File Size141KB，2 Pages; ManufacturerThomas & Betts Corporation; Websitehttp://www.tnb.com/

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PHC084-3L1110-H Overview

IC Socket, PGA84, 84 Contact(s)

PHC084-3L1110-H Parametric

Parameter Name	Attribute value
Maker	Thomas & Betts Corporation
Reach Compliance Code	unknown
ECCN code	EAR99
Device slot type	IC SOCKET
Type of equipment used	PGA84
Shell material	MYLAR
Manufacturer's serial number	PHC
Number of contacts	84
Base Number Matches	1

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PHC Holtite Series

Zero Profile Mylar Carrier PGA Sockets

FEATURES:

PERFORMANCE SPECIFICATIONS:

MECHANICAL

Vibration ........................ Passed MIL-STD-202, Method 204, 20 G’s

Durabilty ........................ Passed MIL-STD-1344, Method 2016, 50 cycles

Solderability .................. Passed MIL-STD-202F, Method 208

Insertion Force (5P) ...... 92 Grams (3.2 oz.) average with .018" (0,46) dia.

pol. steel pin and .043" (1,09) plated thru hole

Withdrawal Force (5P) .. 103 Grams (3.6 oz.) average with .018" (0,46) dia.

pol. steel pin and .043" (1,09) plated thru hole

Contact Retention

in Board ...................... 7.5 Lbs. per line average

ELECTRICAL

Contact Resistance ........ 10 Milliohms

Contact Rating .............. 3 Amps

ENVIRONMENTAL

Humidity ........................ Passed MIL-STD-202, Method 106

Thermal Shock .............. Passed MIL-STD-202, Method 107, Cond. F

Operation Temperature .. Gold inner contact -55°C to +125°C,

Tin/lead inner contact -55°C to +105°C

Insertion Force (27P) .... 57 Grams (2.2 oz.) average with .018" (0,46) dia.

pol. steel pin and a .039" (0,99) plated thru hole

Withdrawal Force(27P) 30 Grams (1.1 oz.) average with .018" (0,46) dia.

pol. steel pin and a .039" (0,99) plated thru hole

For performance specifications on 6P Holtites

, please consult factory

The PHC Series of Holtite

Zero Profile pin grid solderless sockets are

designed to press fit into the plated through hole of a printed wiring board.

This unique design allows the plated through hole to become the component

socket. The elimination of soldering and insulator material gives the lowest

mounting profile possible for the pin grid array and the maximum visibility

to the circuit traces on the PCB for inspection and testing purposes.

• Low insertion and withdrawal force contacts available

• The profile of the printed wiring board with the Holtite

contact installed

offers the lowest socketing profile, permitting card rack spacing as low

as .400" (10,16)

• Precision machined, tapered entry, four-finger contact

• Retains minimum component lead lengths

• Maximum heat dissipation

• Removes artwork design restrictions

• Immediate conversion to the Holtite

system

MATERIAL SPECIFICATIONS:

Carrier ............................ Mylar

Contact .......................... Beryllium copper

Plating ............................ Gold or tin/lead

HOW TO ORDER

PHC

Number of

Contacts

Plating Options

- Gold

- Tin/Lead

Holtite

Selection

(Table 1)

Grid size

Footprint

Options

(Pg. D23)

Part Number Example:

PHC068-2E1333-H

Quality & Innovation From The

Product Group

Thomas & Betts

1555 Lynnfield Road

Memphis, TN 38119

(901) 682-8221 FAX (901) 537-8805

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