2) Highly reliable chip resistor Ruthenium oxide dielectric offers superior resistance to the elements.
3) Electrodes not corroded by soldering
Thick film makes the electrodes very strong.
4) Leading the world in development and mass production.
Since start of production in 1976 (first in the wold), this component has established a solid reputation as a
general–purpose chip resistor.
5) ROHM resistors have approved ISO–9001 certification.
Design and specifications are subject to change without notice. Carefully check the specification sheet before using or
ordering it.
Ratings
Item
Rated power
Conditions
Power must be derated according to the power derating curve in
Figure 1 when ambient temperature exceeds 70
°
C.
100
80
60
40
20
0
Specifications
0.25W (1 / 4W)
at 70
°
C
POWER LOAD (%)
−55
0
70
100
155
AMBIENT TEMPERATURE
(°C)
Fig.1
Rated voltage
The voltage rating is calculated by the following equation.
If the value obtained exceeds the limiting element voltage,
the voltage rating is equal to the maximum operating voltage.
E: Rated voltage (V)
E= P×R
P: Rated power (W)
R: Nominal resistance (Ω)
Limiting element voltage
200V
Nominal resistance
Operating temperature
See Table 1.
−55
°
C
to
+155
°
C
Rev.B
1/5
MCR18
Resistors
Jumper type
Resistance
Rated current
Table 1
Max. 50mΩ
2A
Resistance tolerance
F (±1%)
J (±5%)
Resistance range
(Ω)
Resistance temperature coefficient
(ppm /
°C)
Operating temperature
−55°
C
to
+155°
C
10
≤
R
≤
2.2M (E24,96)
1.0
≤
R
<
2.2
2.2
≤
R
<
10
10
≤
R
≤
10M
(E24)
(E24)
(E24)
±100
500±350
±500
±200
Before using components in circuits where they will be exposed to transients such as pulse loads (short–duration, high–level loads), be certain to evaluate the
component in the mounted state. In addition, the reliability and performance of this component cannot be guaranteed if it is used with a steady state voltage that
is greater than its rated voltage.
Characteristics
Item
Resistance
Variation of resistance
with temperature
Overload
±
(2.0%+0.1Ω)
Guaranteed value
Resistor type
Jumper type
J :
±5%
F :
±1%
Max. 50mΩ
Test conditions (JIS C 5201-1)
JIS C 5201-1 4.5
JIS C 5201-1 4.8
Measurement :
−55
/
+25
/
+125°C
JIS C 5201-1 4.13
Rated voltage (current)
×2.5,
2s.
Maximum overload voltage : 400V
JIS C 5201-1 4.17
Rosin·Ethanol (25%WT)
Soldering condition : 235±5°C
Duration of immersion : 2.0±0.5s.
JIS C 5201-1 4.18
Soldering condition : 260±5°C
Duration of immersion : 10±1s.
JIS C 5201-1 4.19
Test temp. :
−55°C
to
+125°C
5cyc
JIS C 5201-1 4.24
40°C, 93%RH
Test time : 1,000h to 1,048h
JIS C 5201-1 4.25.1
Rated voltage (current), 70°C
1.5h : ON
−
0.5h : OFF
Test time : 1,000h to 1,048h
JIS C 5201-1 4.25.3
155°C
Test time : 1,000h to 1,048h
JIS C 5201-1 4.29
23±5°C, Immersion cleaning, 5±0.5min.
Solvent : 2-propanol
JIS C 5201-1 4.33
See Table.1
Max. 50mΩ
Solderability
A new uniform coating of minimum of
95% of the surface being immersed
and no soldering damage.
±
(1.0%+0.05Ω)
Max. 50mΩ
No remarkable abnormality on the appearance.
±
(1.0%+0.05Ω)
±
(3.0%+0.1Ω)
Max. 50mΩ
Max. 100mΩ
Resistance to
soldering heat
Rapid change of
temperature
Damp heat, steady state
±
(3.0%+0.1Ω)
Endurance at 70°C
±
(3.0%+0.1Ω)
Endurance
±
(1.0%+0.05Ω)
Resistance to solvent
Max. 100mΩ
Max. 100mΩ
Max. 50mΩ
Bend strength of
the end face plating
Max. 50mΩ
±
(1.0%+0.05Ω)
Without mechanical damage such as breaks.
Rev.B
2/5
MCR18
Resistors
External dimensions
(Unit : mm)
1
0.5±0.25
2
No.
1
Material
Resistive element (Oxide metal thick film)
Silver thick film electrode
Nickel electrode
Sn electrode
Alumina substrate
Overcoating
3
2
3
0.5±0.25
0.55±0.1
3.2±0.15
5
4
4
5
6
6
Packaging
Reel
Taping
P
0
P
2
P
2
φD
2
E
F
B
2
02
04
06
08
08
06
04
1.6±0.15
W
A
B
D
02
A
2
Heat crimp cover/Tape
Thick paper (Underside paper tape) Chip resistor Square punchout hole
I have a Bluetooth module with a USB interface. I plug it into my development board, and then use the "Bluetooth Settings" under the "Control Panel" to search for other Bluetooth devices. This means t...
Keyence vision camera communicates with Siemens 1500 PLC
Implementing grab correction with robotsTable of contents
1.Functions realized and application occasions2.
2Controller Panel Introduction2
3Sof...
Can you recommend a power monitoring chip for power supply? ADE7858A chip. ADI says this chip is outdated. Which is better, transformer sampling or mutual inductor sampling?...
What is the difference between digital power supply and analog power supply? What is the purpose of adding a filter between digital power supply and analog power supply?...
Do you often have to add brake fluid to your car's brakes? The fact that you need to pump out the brake fluid to make sure there is no gas in the brake fluid line may not be done by the car owner h...[Details]
Analog engineers have traditionally struggled with complexity when designing power supplies that required multiple outputs, dynamic load sharing, hot-swap, or extensive fault-handling capabilities....[Details]
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The way to reduce costs is
① Use the Bluetooth data transmission function of mobile ph...[Details]
The reason for the light decay of white LEDs: the decline of phosphor performance
So far, the rapid decline of the luminous performance of white light LEDs, especially low-power white light LE...[Details]
For a long time, due to the limitation of hardware conditions, the display devices of traditional small handheld devices such as PDA are usually monochrome LCD, and the user interface is very simpl...[Details]
PV inverter manufacturer SMA has launched its first DC arc fault circuit interrupter (AFCI) PV inverter and has received UL certification.
The new SunnyBoy AFCI inverter models include 3000-US...[Details]
Smart lighting control systems provide high controllability for various buildings and further enhance the level of green energy. They are the core products of energy conservation and digital techn...[Details]
With the continuous consumption of earth's energy and the scarcity of resources, the harm of greenhouse effect to human beings, and the serious pollution of the atmosphere to the earth, the intern...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
The traditional display screen using 51 single-chip microcomputer to control LED dot matrix has relatively simple functions. If it is to achieve diversified functions, it often takes a lot of time ...[Details]
FPGAs are used in 81% of electronic systems, including many commercial and defense products, and most FPGAs use BGA packaging. The BGA packaging is characterized by small solder balls and small sol...[Details]
At very low temperatures, certain metals and alloys lose their resistance to electric
current
and become
superconductors
. Two parameters that are often measured are the transition ...[Details]
Spatial Division Multiplexing (SDM) MIMO processing can significantly improve spectrum efficiency and thus greatly increase the capacity of wireless communication systems. Spatial Division Multip...[Details]
LED light sources have many environmental advantages, but early products still have certain technical bottlenecks in heat dissipation and high brightness design that cannot be broken through....[Details]
At present, how various communication technologies will evolve after 3G is a focus of great concern in the industry. Especially for TD-SCDMA, whether it can achieve smooth evolution to the next gen...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
