EEWORLDEEWORLDEEWORLD

Part Number

Search

CDF06032K671%100PPM/KNS

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 2670ohm, 75V, 1% +/-Tol, 100ppm/Cel, 0603,
CategoryPassive components    The resistor   
File Size122KB,2 Pages
ManufacturerMicrotech GmbH Electronic
Environmental Compliance
Download Datasheet Parametric View All

CDF06032K671%100PPM/KNS Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 2670ohm, 75V, 1% +/-Tol, 100ppm/Cel, 0603,

CDF06032K671%100PPM/KNS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid907668918
Reach Compliance Codecompliant
Country Of OriginGermany
ECCN codeEAR99
YTEOL2
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length1.6 mm
Package formSMT
Package width0.85 mm
method of packingBulk
Rated power dissipation(P)0.1 W
resistance2670 Ω
Resistor typeFIXED RESISTOR
size code0603
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Tolerance1%
Operating Voltage75 V

CDF06032K671%100PPM/KNS Preview

microtech GmbH electronic Teltow
Chip resistors - Made in Germany
Thick film series - Standard
Type: CDF
Sizes: 0402, 0603, 0805, 1206
Characteristics:
Chip resistors in thick film technology
Resistance area coated with glass and varnish passivation
High stability and reliability
Tight tolerances (≥0,5%) – low temperature coefficient
RoHS-conform
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
Electroplated pure tin
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery)
Epoxy bondable contact –K
Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
ISO/TS 16949:2009
ISO 14001:2009
Dimensions (in mm):
Size
L
Length
Min
Max
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
H
t
0402
0603
0805
1206
0,95
1,50
1,85
2,90
1,10
1,70
2,15
3,35
0,45
0,75
1,10
1,45
0,60
0,95
1,40
1,75
0,25
0,35
0,35
0,35
0,40
0,55
0,65
0,65
0,10
0,10
0,15
0,25
0,35
0,50
0,60
0,75
0,05
0,10
0,15
0,15
0,35
0,50
0,60
0,75
T
L
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
Ordering information:
CDF
Type
-N
Contact
0603
Size
0402
0603
0805
1206
10k
1%
50ppm/K
±
TCR
50
100
K
Marking
P
Packaging
5
(optional)
R-
±
Tolerance
Value
1R
.
W
pcs. / Reel
(T pcs.)
CDF Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
to
.
0,5
1,0
10M
K- with
P- Card tape Depends
on size and
(from size 0603) S- Bulk
packaging
N- without
unit
(only size 0402)
Page 24
Revision: 01-Nov-16
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
ISO/TS 16949:2009
ISO 14001:2009
Chip resistors - Made in Germany
Thick film series - Standard
Type: CDF
Sizes: 0402, 0603, 0805, 1206
Technical data – depending on size:
Size
Nominal voltage
U
max
(V)
Load
P
70
(W)
R-Range
R-Tolerance
(± %)
TCR
(± ppm/K)
P
0402
0603
0805
1206
50
75
150
200
0,063
0,100
0,125
0,250
1R - 10M
1R - 10M
1R - 10M
1R - 10M
1,0
0,5 / 1,0
0,5 / 1,0
0,5 / 1,0
50 / 100
50 / 100
50 / 100
50 / 100
x
x
x
x
Packaging
B
S
x
x
x
x
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
-55°C … +155°C
55 / 155 / 56
245°C 3s
±( 0,5% + 0,05R ) at 260°C 10s
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability
Storage 155°C / 1000h
Endurance P
70
/ 70°C / 1000h
Damp heat, steady state (56d / 40°C / 96%)
± ( 1,0% + 0,05R )
± ( 0,5% + 0,05R )
± ( 1,0% + 0,05R )
Data, unless specified, acc. EN 140401-802.
Catalog microtech GmbH electronic
Revision: 01-Nov-16
Page 25
Bluetooth Low Energy (BLE) peripheral mode (peripheral) - using BLE as a server
[size=4][color=#000000][backcolor=white]Android support for peripheral mode[/backcolor][/color][/size] [size=4][color=#000000][backcolor=white]Supported only since Android 5.0[/backcolor][/color][/siz...
fish001 Wireless Connectivity
Ask about boost chip
Can you recommend a boost chip with lower current consumption? I want to convert positive and negative 5.5v to positive and negative 15v to power the op amp. Thank you!...
richpowerHK Microcontroller MCU
Detailed explanation of PWM of microcontroller
[i=s] This post was last edited by huo_hu on 2016-4-19 09:53 [/i] PWM (pulse width modulation) is widely used in power supply and motor control. This article describes the basic principles of PWM impl...
huo_hu MCU
Help, about ceRapiInvoke function call
//定义 #ifdef PhoneBookData_EXPORTS #define PhoneBookData_API __declspec(dllexport) #else #define PhoneBookData_API __declspec(dllimport) #endifPhoneBookData_API int Invoke_GetSIMNumber(DWORD cbInput, B...
liyanping Embedded System
It's really tangled
Opening JD.com and Taobao is very fast. Opening a technical forum or webpage is so slow that it takes me a cigarette to finish it. Our forum is also the same. What is going on?!...
范小川 Talking
Problems using remote tool with ActiveSync in CE6
In the past, under WM/WINCE5, I could easily connect to the development board through ActiveSync using the remote tool in PB. Now under CE6, when I use the remote tool of Visistadio to connect to the ...
kjwhzx1985 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1420  2652  963  1294  1550  29  54  20  27  32 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号