FXW
CONNECTOR
0.3mm
(.012") pitch
Emboss Tape
Connectors for FPC
Features––––––––––––––––––––––––
• Ultra low-profile (1.0mm (.039'') height) &
adoption of Double ZIF structure
This 1.0mm (.039'') height ultra low-profile connector has been
designed for the LDP module of mobile phones.The Double ZIF
mechanism provides easier FPC insertion, excellent durability
and effective protection from wearing.
• One-touch sliding operation of Molded Cover
After closing the cover, it should be pressed to slide so that it will
be securely held by the enforcement tab.
This mechanism ensures that the Cover remains closed even
when the FPC is connected upwards.
• Heat resistant design for surface mounting
It is designed for the reflowing process by using a heat resistant
material for the Housing.
This ultra low-profile FPC connector with a
mounting height of 1.0mm (.039'') has a
Double ZIF Flip-lock slider structure.
Specifications –––––––––––––––––––
• Current rating: 0.2A AC, DC
• Voltage rating: 50V AC, DC
• Temperature range: -25˚C to +85˚C
(including temperature rise in applying
electrical current)
• Contact resistance: Initial value/60m
Ω
max.
After environmental testing/50m
Ω
max.
(Variance from the initial)
• Withstanding voltage: 200V AC/minute
• Applicable FPC: Lead pitch/0.3mm(.012")
Lead width/0.3mm(.012")
Mating part thickness/
+0.03
+.001"
0.12
-0.02
mm (.005"
-.0008"
)
* Contact JST if Lead-Free product is required.
* Refer to "General Instruction and Notice when using
Terminals and Connectors" at the end of this catalog.
* Contact JST for details.
Standards ––––––––––––––––––––––
0
Recognized E60389
468
FXW
CONNECTOR
Connector –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
B
0.6(.024)
0.3(.012)
Cir-
cuits
17
27
31
35
41
51
Model No.
17FXW-RSM1-G-S-TB
27FXW-RSM1-G-S-TB
31FXW-RSM1-G-S-TB
35FXW-RSM1-G-S-TB
41FXW-RSM1-G-S-TB
51FXW-RSM1-G-S-TB
59FXW-RSM1-G-S-TB
Dimensions mm(in.)
A
4.2(.165)
7.2(.283)
8.4(.331)
9.6(.378)
11.4(.449)
14.4(.567)
16.8(.661)
B
4.8(.189)
7.8(.307)
9.0(.354)
10.2(.402)
12.0(.472)
15.0(.591)
17.4(.685)
C
8.3(.327)
11.3(.445)
12.5(.492)
13.7(.539)
15.5(.610)
18.5(.728)
20.9(.823)
Q'ty /
reel
4,500
4,500
4,500
4,500
4,500
4,500
4,500
0.6(.024)
A
1.0(.039)
59
Material and Finish
C
[4.8(.189)]
Contact: Copper alloy, nickel-undercoated, gold-plated
Housing: Heat resistant resin, UL94V-0
Reinforcing tab: Copper alloy, copper-undercoated, tin/lead-plated
Cover: Heat resistant resin, UL94V-0
Taping specifications ––––––––––––––––––––––––––––––––––––––––––––––––––––––
Feeding direction
Feeding direction
Carrier tape
330±2.0(12.992±.079)dia.
Cover tape leader
Leader part
100(3.937)min.
The end part Connector
160(6.299)min. mounting part 400(15.748)min.
[13(.512)dia.]
W1
+ 2.5
(
+ .098
)
-1.0 -.039
2.0±0.5(.079±.020)
(17 to 41 circuits)
1.75
±0.1
(.069±.004)
1.55
±0.05(.061±.002)dia.
1.015
±0.1
4.0
±0.1
(.040±.004) (.157±.004)
(51 to 59 circuits)
1.015
±0.1
4.0
±0.1
1.55
±0.05(.061±.002)dia.
(.040±.004) (.157±.004)
1.75
±0.1
(.069±.004)
Cover tape
Cover tape
F
±0.1(.004)
S
±0.1(.004)
W
±0.3(.012)
F
±0.1(.004)
W
±0.3(.012)
Carrier tape
8.0
±0.1
(.315±.004)
8.0
±0.1
(.315±.004)
Carrier tape
Taping dimensions mm(in.)
Circuits
F
17
27 to 41
51 to 59
7.5(.295)
11.5(.453)
14.2(.559)
S
−
−
28.4(1.118)
W
16.0( .630)
24.0( .945)
32.0(1.260)
Reel dimensions
mm(in.)
Q'ty /
reel
W1
17.5( .689)
25.5(1.004)
33.5(1.319)
4,500
4,500
4,500
Note:
1. Specifications conform to JIS C 0806. The tape width, connector recess
dimensions, etc. are determined by the number of circuits and external
shape of the connector to be loaded.
2. Specifications are subject to change without prior notice.
469
FXW
CONNECTOR
Lead section dimensions of FPC ––––––––––––––––––––––––––––––––––––––––––––
[0.3(.012)X(Number of circuits+1)]+0.8±0.05(.031±.002)
[0.3(.012)X(Number of circuits+1)]±0.05(.002)
[0.3(.012)X(Number of circuits-1)]±0.03(.001)
0.6
±0.02
(.024
±.0008)
＋
0.04
0.3
−0.03
＋
.002
(.012
−.001
)
＋
0.03
0.12
−0.02
＋
.001
(.005
−.0008
)
2.1
±0.3(.083±.012)
1.6
＋
0.1
0
(.063
＋
.004
)
0
2.6(.102)
Reinforcing layer
[4.8(.189)]
PC board layout
(viewed from component side)
and Assembly layout ––––––––––––––––––
1.05
±0.03(.041±.001)
0.5
±0.03(.020±.001)
B
±0.05(.002)
0.6
±0.03(.024±.001)
0.3
±0.03(.012±.001)
0.35
±0.03
(.014±.001)
1.38
±0.03
(.054±.001)
0.4
±0.03
(.016±.001)
1.77±0.03
(.070±.001)
1.05
±0.03
(.041±.001)
0.6
±0.03(.024±.001)
A
±0.05(.002)
0.6
±0.03
(.024±.001)
Note:
1. Tolerances are non-cumulative:
±
0.03mm(
±
.001" ) for all centers.
2. The dimensions above should serve as a guideline.
Contact JST for details.
470
1.0
(.039)
PCB Design
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