C0805N131K1GSH7246 datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> C0805N131K1GSH7246

C0805N131K1GSH7246: DescriptionCeramic Capacitor, Ceramic, 100V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.00013uF, 0805,; CategoryPassive components capacitor; File Size1MB，10 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

C0805N131K1GSH7246 Overview

Ceramic Capacitor, Ceramic, 100V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.00013uF, 0805,

C0805N131K1GSH7246 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	709484188
package instruction	, 0805
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	7.99
capacitance	0.00013 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.3 mm
JESD-609 code	e0
length	2 mm
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	Bulk
positive tolerance	10%
Rated (DC) voltage (URdc)	100 V
Guideline	MIL-PRF-55681
series	C(SIZE)N
size code	0805
Temperature characteristic code	C0G
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
width	1.25 mm

Preview

Download Datasheet

View All

CERAMIC CHIP/MIL-PRF-55681

CAPACITOR OUTLINE DRAWINGS

DIMENSIONS—MILLIMETERS AND (INCHES)

STYLE

KEMET

SIZE

CODE

MIN.

MAX.

CDR01

CDR02

CDR03

CDR04

CDR05

CDR06

CDR31

CDR32

CDR33

CDR34

CDR35

C0805

C1805

C1808

C1812

C1825

C2225

C0805

C1206

C1210

C1812

C1825

2.03 ±.38 (.080 ±.015)

4.57 ±.38 (.180 ±.015)

+.51

+.020

4.57

.180

–.38

–.015

5.72 ±.51 (.225 ±.020)

2.00 ±.20 (.078 ±.008)

3.20 ±.20 (.125 ±.008)

3.20 ±.25 (.125 ±.010)

4.50 ±.25 (.176 ±.010)

4.50 ±.30 (.176 ±.012)

(

)

1.27 ±.38 (.050 ±.015)

2.03 ±.38 (.080 ±.015)

3.18 ±.38 (.125 ±.015)

+.51

+.020

6.35

.250

–.38

–.015

6.35 ±.51 (.250 ±.020)

1.25 ±.20 (.049 ±.008)

1.60 ±.20 (.062 ±.008)

2.50 ±.25 (.098 ±.010)

3.20 ±.25 (.125 ±.010)

6.40 ±.30 (.250 ±.012)

.56 (.022)

.51 (.020)

1.40 (.055)

2.03 (.080)

1.30 (.051)

1.50 (.059)

.51 ± 0.25 (.020 ±.010)

.50 ± 0.20 (.020 ±.008)

.50 ± 0.25 (.020 ±.010)

.50 ± 0.30 (.020 ±.012)

(

)

Note:

For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following

amounts:

Length

Width

Length

CDR01

0.51MM (.020)

0.38MM (.015)

CDR02-06

0.64MM (.025)

0.38MM (.015)

CDR31-35

0.60MM (.023)

0.30MM (.012)

MIL-PRF-55681 PART NUMBER ORDERING INFORMATION

CDR01

B P

101 B K

STYLE & SIZE CODE

STYLE

C — Ceramic

D — Dielectric, Fixed Chip

R — Established Reliability

FAILURE RATE LEVEL

(%/1000 hrs.)

TERMINATION FINISH

S — Solder Coated, Final

(SolderGuard I)

U — Base Metalization—

Barrier Metal—Solder

Coated

(SolderGuard I)

W — Base Metalization—

Barrier Metal—Tinned

Tin or (Tin/Lead Alloy)

SolderGuard II

Y — Base Metalization

Barrier Metal—Tinned

(100% Tin)

Solderguard II

RATED TEMPERATURE

–55°C to +125°C

DIELECTRICS

P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE

X —± 15%—without voltage

+ 15%, –25%—with voltage

CAPACITANCE

Expressed in picofarads (pF).

First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.

(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)

CAPACITANCE TOLERANCE

±.1 pF ±.25 pF ±.5 pF ±1%

±5%

±10% ±20%

Z – Base metallization -

barrier metal-tinned (tin/lead

alloy, with a min. of 4% lead)

RATED VOLTAGE

A — 50; B — 100

KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS

C 0805

P 101 K

1 G M

CERAMIC

SIZE CODE

See Table Above

END METALIZATION

L — 70Sn/30Pb Plated (Military codes Z,W,U )

C— 100% Tin Plated (Military code Y)

H – Sn60 Coated (Military code S)

SPECIFICATION

P -MIL-PRF-55681 = CDR01-CDR06

N-MIL-PRF-55681 = CDR31-CDR35

FAILURE RATE

(%/1,000 hrs.)

R — 0.01

S — 0.001

M — 1.0

P — 0.1

CAPACITANCE CODE

Expressed in picofarads (pF).

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 thru 9.9 pF. Example: 2.2 pF –229)

VOLTAGE TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G — BP (C0G/NP0) (±30 PPM/°C)

X — BX (±15% Without Voltage

+15% -25% With Voltage)

CAPACITANCE TOLERANCE

.1 pF

.25 pF

.5 pF

10%

20%

VOLTAGE

1 — 100V, 5 — 50V

Part Number Example: C0805P101K1GML

(14 digits - no spaces)

Ceramic Surface Mount

M — 1.0

P — 0.1

R — 0.01

S — 0.001

Recommended Resources

Simple buzzer circuit three

Servo motor control circuit

TOP switch application circuit diagram in switching power supply

Two-phase 2KHZ audio oscillator circuit diagram

flash alarm circuit

Digital sine wave generator circuit

Introduction to UFUN Circuit Board: I have been waiting for UFUN to arrive these days. Today it was finally delivered to the company, so I rushed to the company to pick it up. When I opened the package and saw UFUN, the design of the bo...; qwerghf stm32/stm8

How to implement CAN communication between LPC1766 and MCU: How to implement CAN communication between LPC1766 and multiple microcontrollers? Is it mainly about the implementation of the software part? Which hero can give me some advice? Thank you very much![[...; zhangjun1960 NXP MCU

Writing and transplanting drivers under Linux: Hello everyone, I am a Linux beginner. I want to learn how to write and transplant drivers under Linux. I don't know where to start, what books to read, and what development software to use to build a...; 无泪的哭泣 Linux and Android

DIY-Make a simple Bluetooth speaker: [i=s]This post was last edited by ginny on 2017-5-7 13:02[/i] [align=center][b][color=#5e7384]This content was originally created by EEWORLD forum user [size=3]ginny[/size]. If you want to reprint or ...; ginny DIY/Open Source Hardware

Package-on-package technology that meets the needs of small size and high performance applications: For a long time, multi-chip packages (MCPs) have met the need to pack more performance and features into smaller and smaller spaces. It is natural to want the memory MCP to be extended to include ASIC...; zhengying968 Analog electronics

I would like to ask about the issue of developing multi-language programs under CE (MUI): I saw that there is MUI (Multilingual User Interface) content in the CE help document, which should be better. I have read it for a few days but I don’t understand it very well. I wonder if there are ...; wkg029 Embedded System

Simple and easy automatic charging

Emergency hand-held lamps powered by 6V maintenance-free batteries are widely used in rural areas. The charger used is a transformer step-down and single diode half-wave rectifier, and the charging...[Details]
Design requirements for remote keyless entry (RKE)

Remote keyless entry (RKE) systems have become popular with users, with more than 80% of new cars in North America and more than 70% in Europe equipped with RKE systems. In addition to the obvious ...[Details]
Embedded-ARM register basic concepts

No matter which processor you are learning, the first thing you need to understand is the registers and working mode of the processor. ARM has 37 registers, including 31 general registers and ...[Details]
Application of fighter jets based on LabVIEW

The Portable Digital Data Acquisition System (PDDAS) uses LabVIEW Real-Time and PXI to control the wind tunnel test and record air pressure data from 128 different channels. "The LabVIEW Real-...[Details]
Power management poses challenges

As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
Two CAN bus expansion methods based on ARM920T

1. Introduction With the gradual automation and modernization of industrial control systems, fieldbus control systems have received more and more attention and application. CAN bus is currentl...[Details]
Using CAN232B converter to build CAN control network

I. Introduction Since RS232 has a short communication distance (only 15 meters according to EAT/TAI-232 standard), and can only perform point-to-point communication, it cannot directly f...[Details]
Application example of CIF50-PB bus card and force control configuration software

1. Introduction to CIF Board Fieldbus integration based on PC system Whether it is a master or a slave, fieldbus has won unanimous praise in the field of PC-based automation. For more...[Details]
Application of frequency converter based on PROFIBUS in continuous casting cutting machine

1 Introduction The Third Steel Plant of Jigang Group is a key investment project of Jigang Group during the "15th Five-Year Plan". It has introduced first-class domestic and foreign advanced eq...[Details]
Design of multi-channel waveform generation system for digital array

Digital array radar (DAR) uses digital beam forming (DBF) in both receiving and transmitting modes to achieve flexible distribution and reception of RF signal power in the airspace, obtain excellent t...[Details]
Design of battery monitoring circuit using PIC12C508 single chip microcomputer

12v Lead Acid batteries used in trucks, cars, RVs and uninterruptible power supplies are usually rated at 12V. This circuit monitors the battery, the charge and discharge curves, gives the cu...[Details]
Design of infrared remote controller decoder using single chip microcomputer

TC9012F is a universal CMOS large-scale integrated circuit for infrared remote control signal transmission, suitable for remote control of TV, VTR, laser player and other equipment. In the market, ...[Details]
Design of intelligent control system for traffic lights

1. Overview At present, an information revolution is in the ascendant around the world, led by microelectronics, computers and communication technologies, and centered on information technolog...[Details]
Design of intelligent lighting controller based on LPC2104

1 Introduction With the improvement of people's quality of life, lamps are no longer just basic indoor lighting tools, but also a kind of practical art for architectural decoration. When ther...[Details]
USB charging latest specifications (V1.1) and testing

Currently, each country is developing its own USB interface charging specifications , which leads to a major problem that a USB interface charging device manufactured in one country...[Details]

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components