5962-9461104HXX datasheet, PDF

5962-9461104HXX: DescriptionSRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size325KB，12 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461104HXX Overview

SRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Maker	Microsemi
Parts packaging code	PGA
package instruction	PGA,
Contacts	66
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	70 ns
Other features	CONFIGURABLE AS 512K X 32 OR 1024K X 16
JESD-30 code	S-CPGA-P66
length	35.2 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2MX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	35.2 mm
Base Number Matches	1

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