FRSM150627K700TCR0.2DSW datasheet, PDF

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FRSM150627K700TCR0.2DSW: DescriptionFixed Resistor, Metal Foil, 0.3W, 27700ohm, 95V, 0.5% +/-Tol, -.2,.2ppm/Cel, 1506,; CategoryPassive components The resistor; File Size3MB，7 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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FRSM150627K700TCR0.2DSW Overview

Fixed Resistor, Metal Foil, 0.3W, 27700ohm, 95V, 0.5% +/-Tol, -.2,.2ppm/Cel, 1506,

FRSM150627K700TCR0.2DSW Preview

FRSM Series of Precision Chip Resistors

Z1 Foil Ultra High Precision Wrap-around Chip Resistor for Improved

Load Life Stability of 0.0025% (25 ppm) with TCR of

± 0.05 ppm/°C and withstands ESD of 25 KV min

FEATURES



Temperature coefficient of resistance (TCR):

0.05 ppm/°C typical (0 °C to + 60 °C)

0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.)



Resistance tolerance: to ± 0.01 %



Power coefficient “R due to self heating”:

5 ppm at rated power



Power rating: to 750 mW at + 70 °C



Load life stability:



± 0.0025 % at 70 °C, 2000 h at rated power.

± 0.005 % at 70 °C, 10,000 h at rated power.



Resistance Range: 5



to 125 k (for higher and lower

values, please contact us)



Vishay Foil resistors are not restricted to standard values;

we can supply specific “as required” values at no extra cost

or delivery (e.g. 1K2345 vs. 1K)



Thermal stabilization time < 1 s (nominal value achieved

within 10 ppm of steady state value)



Electrostatic discharge (ESD) at least to 25kV



Short time overload: 0.005 %



Rise time: 1 ns effectively no ringing



Current noise: 0.010 µV

RMS

/V of applied voltage

(< - 40 dB)



Voltage coefficient: 0.1 ppm/V

Non inductive: 0.08 µH

Non hot spot design

Terminal finishes available: lead (Pb)-free, tin/lead alloy

(1)

Matched sets are available on request

Prototype quantities available in just 5 working days

or sooner. For more information, please contact

foil@vpgsensors.com



For higher temperature application up to +240 °C and for

better performances, please contact us

Top View

INTRODUCTION

The FRSM is based on the new generation Z1-technology of

the Bulk Metal® Precision Foil resistor elements by Vishay

Precision Group (VPG), which makes these resistors

virtually insensitive to destabilizing factors. Their element,

based on the new Z1 Foil is a solid alloy that displays the

desirable bulk properties of its parent material; thus, it is

inherently stable (remarkably improved load life stability of

25 ppm), noise-free and withstands ESD to 25KV or more.

The alloy is matched to the substrate and forms a single

entity with balanced temperature characteristics for an

unusually low and predictable TCR over a wide range from

-55 C° to more than 175C°. Resistance patterns are

photo-etched to permit trimming of resistance values to very

tight tolerances.

Our application engineering department is available to

advise and make recommendations. For non-standard

technical requirements and special applications, please

FIGURE 1 - POWER DERATING CURVE

- 55 °C

+ 70 °C

Rated Power (%)

100

- 75

TABLE 1 - TOLERANCE AND TCR VS.

RESISTANCE VALUE

(1)

(- 55 °C to + 125 °C, + 25 °C Ref.)

RESISTANCE

VALUE

()

250to 125K

100to < 250

50to < 100

25to < 50

10to < 25

5to < 10

TOLERANCE

(%)

± 0.01

± 0.02

± 0.05

± 0.1

± 0.25

± 0.5

TYPICAL TCR AND

MAX. SPREAD

(ppm/°C)

± 0.2 ± 1.8

± 0.2 ± 2.8

± 0.2 ± 3.8

± 0.2 ± 7.8

- 50

- 25

+ 25 + 50 + 75 + 100 + 125 + 150 + 175

Ambient Temperature (°C)

Lead (Pb)-free terminals

Tin/lead alloy terminals

(1)

Pb containing terminations are not RoHS compliant, exemptions may apply.

Document Number: 63209

Revision: 9-Mar-15

For any questions, contact

foil@vpgsensors.com

www.vishayfoilresistors.com

FRSM Series of Precision Chip Resistors

ABOUT THE FRSM

Several factors need to be considered when choosing a resistor for

applications that require long term stability, including TCR (ambient

temperature), Power TCR (self heating), load-life stability for more

than 10K hours (instead of the typical 1000 or 2000 hours load-life),

end-of-life tolerance (which is more important than the initial

tolerance), thermal EMF (low values, D.C), thermal stabilization and

ESD. Some precision resistor technologies such as Precision Thin

Film offer designers tight initial tolerances as low as 0.02 % but have

poor load life stability, high end-of-life tolerance, long thermal

stabilization, high drifts during operational life and ESD sensitivity.

Other resistor technologies, such as Wirewounds, provide low

absolute TCR and excellent current noise of -40 dB but have high

inductance and poor rise time (or thermal lag) for more than a few

seconds.

There are essentially only three resistance technologies widely used

for precision resistors in military and space applications: Thin Film,

Wirewound and Bulk Metal® Foil. Each has its own balance of

characteristics and costs that justify its selection in these

applications. Thin Films are most cost-efficient within their normal

range of characteristics but have the highest TCR, highest noise and

have the least stability of the three technologies. Wirewounds have

low noise, low TCR and a high level of stability at moderate cost but

also have high impedance and slow signal response. Wirewounds

can also have a higher power density, but some stability is lost

through temperature cycling and load-life when made in smaller

configurations. Bulk Metal® Foil resistors have the lowest noise,

lowest TCR, highest stability and highest speed of any technology

but may have a higher cost, depending upon model. With Bulk

Metal® Foil resistors, savvy designers often save overall by

concentrating the circuit stability in the foil resistors where

exceptional stability allows for use of less-costly active devices---an

option not available with other resistor technologies because foil

requires a smaller total error budget through all cumulative resistor

life exposures. Also, foil often eliminates extra circuitry added

merely for the purpose of correcting the limitations of other resistor

components. FRSM’s Bulk Metal® Foil resistors, based on new

generation technology and improved production methods starting

from February 2011, offer designers the complete set of top

performance characteristics to simplify circuitry and lower overall

system costs by reducing the number of required parts while

assuring a better end product. The new series of FRSM feature a

long-term load-life stability within 0.0025 % after 2000 hours and

0.005% after 10000 hours under full rated power at + 70 °C, first time

in the history of all resistor technologies. In addition to their low

absolute TCR of almost zero TCR , the devices offer Power TCR

(“



R due to self heating”) to ±5 ppm at rated power; tight tolerance

from 0.01% and thermal EMF of 0.05 µV/°C. Current design practice

has been to over specify resistors to allow for expected tolerance

degradation during service and there is a trend to move to

commercial off the shelf (COTS) parts instead of MIL spec Qualified

(QPL) parts. Vishay Precision Group offers a new approach with

lower prices to bring Foil resistors within the reach of designers

whose end-of-life tolerance target is 0.05 % (total end of life

cumulative deviation from nominal) or less with COTS resistors

having all the inherent features for long term reliability.

While other resistor technologies can take several seconds or even

minutes to achieve a steady state thermal stabilization (thermal lag),

Vishay Foil resistors feature an almost instantaneous thermal

stabilization time and a nearly immeasurable 1 ns rise time

effectively with no ringing. The stress levels of each application are

different so the designer must make an estimation of what they might

be and assign a stress factor to each one. The stress may normally

be low but for these purposes, we must assure that the installed

precision resistor is capable of reliability withstanding all potential

stresses. For example, if the resistor is installed in a piece of

equipment that is expected to go out into an oil field in the back of a

pickup truck, shock and vibration and heat from the sun are obvious

factors. The specific causes of resistor drift are listed in Table 4 and

the allowances shown are for full scale exposure. The designer may

choose to use a percentage of full scale stress factor if the

equipment will never see the full scale conditions. For example, a

laboratory instrument that is expected to be permanently installed in

an air-conditioned laboratory does not need an end-of-life allowance

for excessive heat. There are other reasons for tolerancing the

resistors tighter than the initial calculation: Measurement equipment

accuracy is traditionally ten times better than the expected accuracy

of the devices under test. So, these tighter tolerance applications

require a Foil resistor. Also, the drift of the resistor without any

stress factor considerations results in a shift over time that must be

considered. FRSMs have the least amount of time shift. The

manufacturer’s recommended recalibration cycle is a factor in the

saleability of the product and the longer the cycle, the more

acceptable the product. Foil resistors contribute significantly to the

longer calibration cycle.

FIGURE 2 - TRIMMING TO VALUES*

(Conceptual Illustration)

Interloop Capacitance

Reduction in Series

Current Path

Before Trimming

Current Path

After Trimming

Trimming Process

Removes this Material

from Shorting Strip Area

Changing Current Path

and Increasing

Resistance

Mutual Inductance

Reduction due

to Change in

Current Direction

Note:

Foil shown in black, etched spaces in white

* To acquire a precision resistance value, the Bulk Metal® Foil chip

is trimmed by selectively removing built-in “shorting bars.” To

increase the resistance in known increments, marked areas are cut,

producing progressively smaller increases in resistance. This

method eliminates “hot spot” and improves the long term stability of

the resistor.

www.vishayfoilresistors.com

For any questions, contact

foil@vpgsensors.com

Document Number: 63209

Revision: 9-Mar-15

FRSM Series of Precision Chip Resistors

FIGURE 3 - TYPICAL RESISTANCE/

TEMPERATURE CURVE

(2)

+250

+200

+150

+100

(ppm)

-50

-100

-150

-200

-250

-55

- 0.16 ppm/ºC

-25

+25

+50

0.05 ppm/ºC

- 0.1 ppm/ºC

0.1 ppm/ºC

0.14 ppm/ºC

0.2 ppm/ºC

+65

+75

+100

+125

+250

+200

+150

+100

+50

-50

-100

-150

-200

-250

TABLE 3 - SPECIFICATIONS

(1)

CHIP

SIZE

0402

(3)

0603

0805

1206

1506

2010

2512

RATED

POWER

(mW)

at + 70 °C

100

200

300

500

750

MAX.

WORKING

VOLTAGE

(



)

22 V

40 V

87 V

95 V

187 V

220 V

RESISTANCE

RANGE

()

100 to 500

100 to 4K*

5to 8K

5to 25K

5to 30K

5to 70K

5to 125K

MAXIMUM

WEIGHT

(mg)

* For 0603 values between 4K and 5K, please contact us

TABLE 2 - DIMENSIONS

in Inches (Millimeters)

Top View

CHIP

SIZE

0603

0805

1206

1506

2010

2512

(1)

± 0.005 (0.13)

0.063 (1.60)

0.080 (2.03)

0.126 (3.20)

0.150 (3.81)

0.198 (5.03)

0.249 (6.32)

± 0.005 (0.13)

0.032 (0.81)

0.050 (1.27)

0.062 (1.57)

0.097 (2.46)

0.127 (3.23)

THICKNESS

MAXIMUM

0.025 (0.64)

± 0.005 (0.13)

0.011 (0.28)

0.015 (0.38)

0.020 (0.51)

0.025 (0.64)

0.032 (0.81)

Notes

For tighter performances and non-standard values up to 150K, please contact VPG application engineering using the e-mail addresses in the

footer below.

(2)

The TCR values for < 100



are influenced by the termination composition and result in deviation from this curve.

TABLE 4 - PERFORMANCES

TEST OR CONDITIONS

Thermal Shock, 100 x (- 65 °C to + 150 °C)

(see Figure 6)

Low Temperature Operation, - 65 °C, 45 min at P

nom

Short Time Overload, 6.25 x Rated Power, 5 s

High Temperature Exposure, + 150 °C, 100 h

Resistance to Soldering Heat, +245°C for 5 sec,+235°C

for 30 sec

Moisture Resistance

Load Life Stability + 70 °C for 2000 h at Rated Power

(see Figure 8)

Load Life Stability + 70 °C for 10,000 h at Rated Power

Note

(3)

As shown + 0.01



to allow for measurement errors at low values.

R

LIMITS OF

PRECISION THIN FILM

± 0.1 %

± 0.5 %

TYPICAL

MAXIMUM

R

LIMITS OF FRSM

R

LIMITS OF FRSM

SERIES

(3)

± 0.005% (50 ppm)

± 0.0025% (25 ppm)

± 0.005% (50 ppm)

± 0.0025% (25 ppm)

± 0.005 % (50 ppm)

± 0.003% (30 ppm)

0.0025% (25 ppm)

0.005% (50 ppm)

± 0.01% (100 ppm)

± 0.005% (50 ppm)

± 0.01% (100 ppm)

± 0.005% (50 ppm)

± 0.01% (100 ppm)

± 0.005% (50ppm)

± 0.015% (150ppm)

Document Number: 63209

Revision: 9-Mar-15

For any questions, contact

foil@vpgsensors.com

www.vishayfoilresistors.com

FRSM Series of Precision Chip Resistors

FIGURE 4 - RECOMMENDED MOUNTING

Notes

(1)

IR and vapor phase reflow are recommended.

(2)

Avoid the use of cleaning agents which could attack epoxy resins, which form part

of the resistor construction

(3)

Vacuum pick up is recommended for handling

(4)

If the use of a soldering iron becomes necessary, precautionary measures should

be taken to avoid any possible damage / overheating of the resistor

* Recommendation: The solder fillet profile should be such as to avoid running over

the top metallization

PULSE TEST

TEST DESCRIPTION

All parts baked at +125°C for 1 hr and allowed to cool at room

temperature for 1 hr, prior to testing. By using an electrolytic 0.01µF

capacitor charged to 1000 VDC, a single pulse was performed on 20

units of 1206, for each value: 100, 1K and 10K of Surface

Mount Vishay Foil resistor and Thin Film resistor. The unit was

allowed time to cool down, after which the resistance measurement

was taken and displayed in ppm deviation from the initial reading.

TEST RESULTS

FIGURE 6 - THERMAL SHOCK TEST

Test per MIL PRF 55342 4.8.3 Mil STD 202, Method 107

Test Conditions: 100 X (-65°C to +150°C), n=10

100

∆R

(ppm)

FIGURE 5 - PULSE TEST DESCRIPTION

0805

1206

25K

2512

-20

2512

75K

ELECTROSTATIC DISCHARGE (ESD)

ESD can be categorized into three types of damages

Parametric Failure

- occurs when the ESD event alters one or more

device parameters (resistance in the case of resistors), causing it to

shift from its required tolerance. This failure does not directly pertain

to functionality; thus a parametric failure may be present while the

device is still functional.

Catastrophic Damage

- occurs when the ESD event causes the

device to immediately stop functioning. This may occur after one or

a number of ESD events with diverse causes, such as human body

discharge or the mere presence of an electrostatic field.

Latent Damage

- occurs when the ESD event causes moderate

damage to the device, which is not noticeable, as the device appears

to be functioning correctly. However, the load life of the device has

been dramatically reduced, and further degradation caused by

operating stresses may cause the device to fail during service.

Latent damage is the source for greatest concern, since it is very

difficult to detect by re-measurement or by visual inspection, since

damage may have occurred under the external coating.

TABLE 5 - PULSE TEST RESULTS

AVERAGE DEVIATION

(%)

VALUE

VOLTAGE

T= RC

VISHAY

FOIL

RESISTOR

<0.001

THIN

FILM

Open

>35

>0.008

100R

10K

1000VDC

1µsec

10 µsec

100 µsec

www.vishayfoilresistors.com

For any questions, contact

foil@vpgsensors.com

Document Number: 63209

Revision: 9-Mar-15

FRSM Series of Precision Chip Resistors

TEST DESCRIPTION

By using a electrolytic 500 pF capacitor charged up to 4500 V,

pulses were performed on 10 units of 1206, 10K of three different

Surface Mount Chip Resistors technologies, with an initial voltage

spike of 2500 V (Figure 7). The unit was allowed time to cool down,

after which the resistance measurement was taken and displayed in

ppm deviation from the initial reading. Readings were then taken in

500 V increments up to 4500 V.

TEST RESULTS

POWER COEFFICIENT OF RESISTANCE

(PCR)

In precision resistors with low TCR, the self heating (Joule effect)

causes the resistor not to perform strictly to its TCR specifications.

This inaccuracy will result in an error at the end in the resistance

value under applied power. Vishay Foil Resistors introduced a new

concept of Power Coefficient of Resistance (PCR) along with a new

Z-Foil technology which leads to reduction of the sensitivity of

precision resistor to ambient temperature variations and changes of

applied power.

Figure 9 represents PCR behavior of three different resistor

technologies under applied power.

FIGURE 7 - ESD TEST DESCRIPTION

2500 V to 4500 V

1 MΩ

500 pF

FIGURE 9 - BEHAVIOR OF THREE

DIFFERENT RESISTOR

TECHNOLOGIES UNDER

APPLIED POWER (POWER

COEFFICIENT TEST)

0.1

0.2

Thick Film

Surface

Mount Chip

0.3

0.4

Thin Film

Surface

Mount Chip

0.5

+ 100 ppm

DMM

ΔR

(ppm)

-------

0 ppm

Z-Foil

Surface

Mount Chip

TABLE 6 - ESD TEST RESULTS

VOLTS

2500

3000

3500

4000

4500

∆R

(%)

THICK FILM

-2.7

-4.2

-6.2

-7.4

-8.6

THIN FILM

366

>5000

OPEN

FOIL

<0.005

Note: Size 1206, value: 1K

- 100 ppm

Applied power, (W)

FIGURE 10 - CURRENT PATH IN A

RESISTIVE ALLOY

FIGURE 8 - LOAD LIFE TEST FOR

2000 HRS @ +70°C

AT RATED POWER

100

-20 0

-40

-60

-80

-100

250

500

750

1000 1250 1500 1750 2000 2250

0805-1K

0805-8K

1206-1K

1206-25K

2512-75K

2512-125K

∆R (ppm)

Noise generation is minimal when current

flow is through multiple paths as exists in

Bulk Metal

Foil resistive alloy.

Time (hrs)

Document Number: 63209

Revision: 9-Mar-15

For any questions, contact

foil@vpgsensors.com

www.vishayfoilresistors.com

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