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MS312RAA8N2JPN

Description
General Purpose Inductor, 8.2uH, 5%, 1 Element, Ceramic-Core, SMD, 0704, CHIP, 0603
CategoryPassive components    inductor   
File Size296KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

MS312RAA8N2JPN Overview

General Purpose Inductor, 8.2uH, 5%, 1 Element, Ceramic-Core, SMD, 0704, CHIP, 0603

MS312RAA8N2JPN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1062826250
package instructionCHIP, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0704
structureChip
core materialCERAMIC
DC Resistance0.115 Ω
Nominal inductance(L)8.2 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height1.02 mm
Package length1.8 mm
Package formSMT
Package width1.12 mm
method of packingTR, Paper, 7 Inch
Minimum quality factor (at nominal inductance)26
Maximum rated current0.7 A
self resonant frequency3880 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead - Matte Tin - with Nickel barrier
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance5%
0603 CHIP INDUCTORS
High-Reliability Chip Inductors
MS312RAA
Small size, exceptional Q and high SRFs make these
inductors ideal for high frequency applications where
size is at a premium. They also have excellent DCR and
current carrying characteristics.
This robust version of Coilcraft’s standard 0603CS series
features high temperature materials that allow operation in
ambient temperatures up to 155°C and a leach-resistant
base metalization with tin-lead (Sn-Pb) terminations that
ensures the best possible board adhesion.
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
40
Typical L vs Frequency
200
175
120 nH
Percent of rated
I
rms
-40
-20
0
20
25°C
40
60
80
100
120
140 160
150
Ambient temperature (°C)
Inductance (nH)
125
100
75
50
25
0
10
100
1000
68 nH
B
overall
F
C
I
J
I
H
33 nH
A
G
F
12 nH
3.9 nH
10000
E
terminal
D
Terminal wraparound:
approx 0.007/0,18 both ends
Frequency (MHz)
Suggested
Land Pattern
Typical Q vs Frequency
120
110
100
90
80
A
max
0.071
3.9 nH
12 nH
B
max
0.044
1,12
C
max
1,02
D
ref
0,38
E
0,76
F
0,33
G
0,86
H
1,02
I
0,64
J
0,64
0.040 0.015 0.030 0.013 0.034 0.040 0.025 0.025
1,80
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Q Factor
70
60
50
40
30
20
10
0
1
10
100
1000
10000
33 nH
68 nH
120 nH
Frequency (MHz)
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –65°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing
Document MS195-1 Revised 03/24/15
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