PPS1100-82R0G datasheet, PDF - EEWORLD Datasheet

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PPS1100-82R0G: DescriptionRESISTOR, METAL GLAZE/THICK FILM, 1 W, 2 %, 100 ppm, 82 ohm, SURFACE MOUNT, 2010; CategoryPassive components The resistor; File Size202KB，2 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

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PPS1100-82R0G Overview

RESISTOR, METAL GLAZE/THICK FILM, 1 W, 2 %, 100 ppm, 82 ohm, SURFACE MOUNT, 2010

PPS1100-82R0G Parametric

Parameter Name	Attribute value
Objectid	1053811959
package instruction	, 2010
Reach Compliance Code	unknown
Other features	FLAME PROOF
Manufacturer's serial number	PPS-1
Installation features	SURFACE MOUNT
Maximum operating temperature	150 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TR
Rated power dissipation(P)	1 W
Rated temperature	70 °C
resistance	82 Ω
Resistor type	FIXED RESISTOR
size code	2010
surface mount	YES
technology	METAL GLAZE/THICK FILM
Terminal shape	FLAT
Tolerance	2%
Operating Voltage	350 V

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Metal Glaze

™

Power Pack

Surface Mount High Power

Density Ceramic Package

PPS-1 Series

•

Low inductance

0.1Ω to 348KΩ range

Superior surge handling capability

150°C maximum operating temperature

1 Watt performance - standard 2010 footprint

Flameproof ceramic package provides superior temperature rise profile

Electrical Data

Size

IRC

Type

PPS-1

Maximum

Power Rating

Working

Voltage¹

350

Maximum

Voltage

700

Resistance Range

(ohms)

0.1 to 0.99

1.0 to 348K

Tolerance

(±%)²

1, 2, 5

TCR

(ppm/°C)²

100

50, 100

2010

¹Not to exceed (

√

P x R )

²Consult factory for tighter tolerances and TCRs.

Applications

The PPS-1 will dissipate 1 watt at 70°C on a 2010 footprint. The PPS-1 is recommended for applications where

board real estate or component/board TCE mismatch is a major concern. It is also recommended in circuits

where a standard 2010 resistor exhibits marginal or unacceptable performance due to high power density/surge

handling demands.

Environmental Data

Characteristic

Thermal Shock

Low Temperature Operation

Short Time Overload

High Temperature Exposure

Resistance to Bonding Exposure

Solderability

Moisture Resistance

Life Test

Terminal Adhesion Strength

Resistance to Board Bending

Maximum Change

±(0.5% + 0.01 ohm)

±(0.25% + 0.01 ohm)

±(1.0% + 0.01 ohm)

±(0.5% + 0.01 ohm)

±(0.25% + 0.01 ohm)

95% minimum coverage

±(0.5% + 0.01 ohm)

±(1.0% + 0.01 ohm)

±(1% + 0.01 ohm)

Test Method

MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)

MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)

MIL-R-55342E Par 4.7.5 (2.5 x (PxR)

MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)

MIL-R-55342E Par 4.7.7 (Reﬂow soldered to board @ 260°C

for 10 seconds)

MIL-STD-202, Method 208 (245°C for 5 seconds)

MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)

MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)

1200 gram push from underside of mounted chip for 60

seconds

Chip mounted in center of 90mm long board, deﬂected 5mm

so as to exert pull on chip contacts for 10 seconds

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

Wire and Film Technologies Division

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

PPS-1 Series Issue December 2008 Sheet 1 of 2

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