16-BIT, 20.5MHz, OTHER DSP, CDIP40, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Address bus width | 12 |
| barrel shifter | YES |
| boundary scan | NO |
| maximum clock frequency | 20.5 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| Internal bus architecture | MULTIPLE |
| JESD-30 code | R-CDIP-T40 |
| JESD-609 code | e0 |
| low power mode | NO |
| Number of DMA channels | |
| Number of external interrupt devices | 1 |
| Number of serial I/Os | |
| Number of terminals | 40 |
| Number of timers | |
| On-chip data RAM width | 16 |
| On-chip program ROM width | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| RAM (number of words) | 256 |
| ROM programmability | UVPROM |
| Maximum seat height | 5.08 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| 5962-8763306QA | 5962-8763308XA | 5962-8763306XA | 5962-8763301QA | 46-4373-620 | 5962-8763307XA | 5962-8763301XA | |
|---|---|---|---|---|---|---|---|
| Description | 16-BIT, 20.5MHz, OTHER DSP, CDIP40, CERAMIC, DIP-40 | 16-BIT, 25.6MHz, OTHER DSP, PQCC44 | 16-BIT, 20.5MHz, OTHER DSP, PQCC44 | 16-BIT, 20.5MHz, OTHER DSP, CDIP40, CERAMIC, DIP-40 | EDGE CONNECTOR,PCB MNT,RECEPT,40 CONTACTS,0.156 PITCH,COMPLIANT FIT TERMINAL | 16-BIT, 20.5MHz, OTHER DSP, PQCC44 | 16-BIT, 20.5MHz, OTHER DSP, PQCC44 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 120 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 3.9624 mm | 1.27 mm | 1.27 mm |
| package instruction | DIP, | QCCJ, | - | DIP, DIP40,.6 | - | QCCJ, | QCCJ, |
| Address bus width | 12 | 12 | 12 | 12 | - | 12 | 12 |
| barrel shifter | YES | YES | YES | YES | - | YES | YES |
| boundary scan | NO | NO | NO | NO | - | NO | NO |
| maximum clock frequency | 20.5 MHz | 25.6 MHz | 20.5 MHz | 20.5 MHz | - | 20.5 MHz | 20.5 MHz |
| External data bus width | 16 | 16 | 16 | 16 | - | 16 | 16 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | - | NO | NO |
| Internal bus architecture | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | - | MULTIPLE | MULTIPLE |
| JESD-30 code | R-CDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | R-CDIP-T40 | - | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | - | - | e0 | e0 |
| low power mode | NO | NO | NO | NO | - | NO | NO |
| Number of external interrupt devices | 1 | 1 | 1 | 1 | - | 1 | 1 |
| Number of terminals | 40 | 44 | 44 | 40 | - | 44 | 44 |
| On-chip data RAM width | 16 | 16 | 16 | 16 | - | 16 | 16 |
| On-chip program ROM width | 16 | 16 | 16 | 16 | - | 16 | 16 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | QCCJ | DIP | - | QCCJ | QCCJ |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | - | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | - | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| RAM (number of words) | 256 | 256 | 256 | 144 | - | 256 | 144 |
| ROM programmability | UVPROM | MROM | UVPROM | MROM | - | MROM | MROM |
| Maximum seat height | 5.08 mm | 4.5 mm | 4.5 mm | 5.08 mm | - | 4.5 mm | 4.5 mm |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | - | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | - | - | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | - | J BEND | J BEND |
| Terminal location | DUAL | QUAD | QUAD | DUAL | - | QUAD | QUAD |
| width | 15.24 mm | 16.585 mm | 16.585 mm | 15.24 mm | - | 16.585 mm | 16.585 mm |
| uPs/uCs/peripheral integrated circuit type | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | - |
| length | - | 16.585 mm | 16.585 mm | - | - | 16.585 mm | 16.585 mm |