2Mx32, 50 - 80ns, TSTACK
30A165-15
A
256 Megabit CMOS DRAM
DPnnD8MX32RY5
PRELIMINARY
DESCRIPTION:
The DPnnD8MX32RY5 is the 8 Meg x 32 Dynamic RAM
module that utilize the new and innovative space saving TSOP
stacking technology. The module is constructed of four 4 Meg
x 16 Dynamic RAM’s that are configured as 2 banks of 4 Meg x
32.
The DPnnD8MX32RY5 provides for a compatible upgrade path
to lower density compatible modules. The module features high
speed access times, common data inputs and outputs, and three
standard refresh modes.
FEATURES:
•
Access Times: 60, 70, 80ns (max.)
•
5.0V or 3.3V Supply
•
Common Data Inputs and Outputs
•
EDO or Fast Page Mode Capability
•
4096 Cycles / 64 ms
•
3 Variations of Refresh: - RAS only Refresh
- CAS before RAS Refresh
- Hidden Refresh
•
Package: TSOP Leadless Stack
PIN-OUT DIAGRAM
PIN NAMES
A0 - A11
DQ0 - DQ31
UCAS
LCAS
RAS0 - RAS1
WE0 - WE1
OE0 - OE1
V
DD
V
SS
N.C.
Row Address:
A0 - A11
Column Address: A0 - A9
Refresh Address: A0 - A11
Data In / Data Out
Upper Column Addres Strobe
Lower Column Addres Stobe
Row Address Enables
Data Write Enables
Data Output Enables
Power Supply (+5V)
Ground
No Connect
FUNCTIONAL BLOCK DIAGRAM
NOTE:
Pin 43 and Pin 46 are connected together,
Pin 42 and Pin 45 are connected together.
30A165-15
REV. A
NOTE:
LCAS controls DQ0-DQ15, UCAS controlls DQ16-DQ31.
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1
DPnnD8MX32RY5
PRELIMINARY
ORDERING INFORMATION
Dense-Pac Microsystems, Inc.
MECHANICAL DRAWING
7321 Lincoln Way
¿
Garden Grove , California 92841-1431
(714) 898-0007 (800) 642-4477
(Outside CA)
¿
FAX: (714) 897-1772
¿
http://www.dense-pac.com
Dense-Pac Microsystems, Inc.
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30A165-15
REV. A