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FX11LA-68P-SV(22)

Description
conn hdr 68pos W/posts smd
CategoryThe connector    The connector   
File Size691KB,20 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
Environmental Compliance
Download Datasheet Parametric View All

FX11LA-68P-SV(22) Overview

conn hdr 68pos W/posts smd

FX11LA-68P-SV(22) Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerHirose
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH DENSITY, LOW PROFILE
Board mount optionsPEG
body width0.207 inch
subject depth0.075 inch
body length0.89 inch
Body/casing typeRECEPTACLE
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationNOT SPECIFIED
Contact completed and terminatedGold (Au)
Contact point genderMALE
Contact materialNOT SPECIFIED
contact modeRECTANGULAR
Contact resistance70 mΩ
Contact styleBELLOWED TYPE
DIN complianceNO
Durability50 Cycles
Filter functionNO
IEC complianceNO
Insulation resistance100000000 Ω
Insulator colorBEIGE
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee4
MIL complianceNO
Plug contact pitch0.02 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing4.7498 mm
Plating thickness4u inch
polarization keyPOLARIZED HOUSING
Rated current (signal)0.3 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal pitch0.5 mm
Termination typeSURFACE MOUNT
Total number of contacts68
UL Flammability Code94V-0
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
sFeatures
1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs.
10 Signal: 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
Ground Plate
Signal contact
mm
.75
0
m
m
5m
0.7
Housing
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
Metal fitting
m
0.5
4. Metal Fittings for Added Solder Weld Strength
Metal fittings provide greater adhesion to the board,
protecting against peeling.The unique connector design
provides a connection between the fitting and the ground
plate for a stronger ground.
Ground plate and metal fitting make contact
Stacking height variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
2mm
2. 5 , 3
mm
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
Note: 2.0mm type and 2.5mm, 3mm type are not mated with each other.
Structure Prevent solder vicking
7. High contact reliability
Effective mating length is 0.55mm (2mm height),
1mm(2.5mm, 3mm height) for signal contacts.
Solder gap portion
Contact
surface
Board mounting portion
Land
8. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
sApplications
Notebook computers, PDA, and other miniature electronic equipment.
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