Tantalum Chip Capacitors
Low Profile;
H
max
= 2 mm; Standard and Low ESR
Construction
I
I
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B45194
Polar tantalum capacitors with solid electrolyte
Conventional Ta-MnO
2
technology
Flame-retardant plastic case (UL 94 V-0)
Tinned terminals
Maximum height 2,0 mm
Features
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High volumetric efficiency
Excellent solderability
Stable temperature and frequency characteristics
Low leakage current, low dissipation factor
Low self-inductance
High resistance to shock and vibration
Suitable for use without series resistor
(recommended operating voltage see “General Technical Information”, page 111, 4.4)
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Low ESR (version R)
Applications
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Telecommunications (e.g. mobile phones, private branch exchanges)
Data processing (e.g. laptops, main frames)
Measuring and control engineering (e.g. voltage regulators)
Automotive electronics
Medical engineering
Switch-mode power supplies with very high clock frequencies (300 kHz)
DC/DC converters
Soldering
Suitable for reflow soldering (IR and vapor phase) and wave soldering
Delivery mode
Taped and reeled in accordance with IEC 60286-3
Ordering code structure
B45194
Passive component
E1227
+40
*
Reel diameter
9 = 180 mm, 6 = 330 mm
Case size
40 = V
Tantalum capacitor
Capacitance tolerance
M =
±
20 %, K =
±
10 %, J =
±
5 %
Rated capacitance
First two digits = significant figures
Third digit = exponent
Voltage (code number)
29
10/02
Series
194 = tinned terminals Sn100
E = Standard
R = Low ESR
Tantalum Chip Capacitors
Low Profile;
H
max
= 2 mm; Standard and Low ESR
Specifications and characteristics in brief
For characteristic curves see “General Technical Information”, page 107 ff.
Standard
Series
Technology
Terminals
Rated voltage
V
R
(up to 85 °C)
Rated capacitance
C
R
Capacitance tolerance
Operating temperature
Failure rate
C
R
·
V
R
≤
330
µ
F · V
C
R
·
V
R
>
330
µ
F · V
Service life
Leakage current
(V
R
, 5 min, 20 °C)
ESR
max
(20 °C, 100 kHz)
IEC climatic category
B45194E
Ta-MnO
2
Tinned
6,3 … 35 Vdc
6,8 … 470
µ
F
Low ESR
B45194R
Ta-MnO
2
Tinned
6,3 … 20 Vdc
22
… 470
µ
F
B45194
±
10%,
±
20%
±
5% (on request)
– 55 … +125
°
C
±
10%,
±
20%
±
5% (on request)
– 55 … +125
°
C
At 40 °C;
≤
V
R
,
R
S
≥
3
Ω
/V (1 fit = 1 . 10
-9
failures/h)
≤
8 fit
≤
24 fit
> 500 000 h
10 nA/
µ
C
—
≤
8 fit
≤
24 fit
> 500 000 h
10 nA/
µ
C
150 … 400 m
Ω
To IEC 60068-1
55/125/56 (– 55/+125
°
C; 56 days damp heat test)
30
10/02
Tantalum Chip Capacitors
Low Profile;
H
max
= 2 mm; Standard and Low ESR
Dimensional drawing
L
2
B45194
W
2
W
2
L
1
W
2
H
P
P
Marking
H
2
Positive pole marking
KTA0209-E
➀
➁
Encapsulation: molded epoxy resin
NiFe; tinned surface Sn100
Positive pole marking
Case size
Dimensions in mm (inches)
L
W
4,3
±
0,3
(,169
±
,012)
H
2,0 max
(,079 max)
L
2
typ.
7,1
(,280)
W
2
±
0,1
H
2
typ.
±(
,004)
2,4
(,094)
1,1
(,043)
p
±
0,3
±
(,012)
1,3
(,051)
V (40)
7,3
±
0,3
(,287
±
,012)
31
10/02
Tantalum Chip Capacitors
Low Profile;
H
max
= 2 mm; Standard and Low ESR
Marking
Case size V
Positive
pole (bar)
Manufacturer’s
logo
B45194
EPCOS
Internal code for
production equipment
(2 to 3 figures)
Date code
V
Rated voltage, (not
coded)
V
R
= 6,3 V
is abbreviated as 6.
Capacitance
(in coded form)
KTA0244-2-E
Capacitance coding
1st and 2nd digit
3rd digit
Capacitance in pF
Multiplier: 5 = 10
5
pF
6 = 10
6
pF
7 = 10
7
pF
Date coding
Year
M = 2000
N = 2001
P = 2002
R = 2003
S = 2004
T = 2005
Month
1 = January
2 = February
3 = March
4 = April
5 = May
6 = June
7 = July
8 = August
9 = September
O = October
N = November
D = December
In addition to the year and month of manufac-
ture, the stamp includes another two or three
figures which internally allow us an assign-
ment to production equipment.
32
10/02
FPGA/CPLD
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