Custom High Performance Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-59007-C2-R0
Features
& Benefits
»
»
»
Designed for flip-chip processors such as Freescale MPCs
maxiGRIP™ attachment applies steady,
even pressure to
the component and does not require holes in the PCB
Comes preassembled with high performance, phase
changing, thermal interface material
B
A
C
D
Thermal Performance
AIR VELOCITY
*Image above is for illustration purposes only.
THERMAL RESISTANCE
FT/MIN
200
300
400
500
600
700
800
M/S
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°C/W (UNDUCTED FLOW)
2.42
1.98
1.7
1.53
1.4
1.3
1.2
°C/W (DUCTED FLOW)
1.6
Product Details
DIMENSION A
35 mm
NOTES:
1)
2)
3)
4)
5)
DIMENSION B
46 mm
DIMENSION C
16 mm
DIMENSION D
68.6 mm
INTERFACE MATERIAL
SAINT-GOBAIN C1100F
FINISH
BLACK-ANODIZED
Dimension
C = heat sink height from bottom of the base to the top of the fin field.
ATS-59007-C1-R0
is a subsitute item available utilizing an equivalent phase change
material (Chomerics T766).
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS
reserves the right to update or change its products without notice to improve the
design or performance.
Contact
ATS
to learn about custom options available.
For more information,
to find a distributor or to place an order,
visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV2_111408
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