Excellent stability in different environmental conditions
Best in class pulse load capability
AEC – Q200 Qualified
Intrinsic sulfur resistance
RoHs & REACH Compliant
Type
Historical Part Number
Nominal Power
P
70
Rating
Resistance Range
(Other values upon request)
E-Series
Tolerances
Temperature Coefficient
IEC60115-1 clause 4.2 ; 4.8
(+20 / -55[°C] and (+20 /
+125[°C])
Working Temperature Range
Permissible film temperature
(
ϑ
F max.)
Max. Working Voltage
Dielectric Withstanding
Voltage
IEC115-1 clause 4.7 (1[min])
±[%]
±[10 K ]
[ºC]
[ºC]
[AC or DC]
RMS
[V]
RMS
-6* -1
ZCM102
SMD
[W]
[Ω]
Min
Máx
-
0,2
10R
2M21
B = 0,1%, F = 1%
ZCM204
ZC0204
0,4
0R22
10M
E24 / E96 / E192
ZCM207
ZC0207
1,0
0R16
10M
B = 0,1% , C = 0,25% , D = 0,5% , F = 1% , G = 2% , J = 5%
Depends on the value, please check the table below
-55 … +125
125
150
200
200
300
-55 … +155
155
350
500
Type
ZCM102
ZCM204
ZCM207
5,8 +0 /-0,3
2,2 ±0,2
2,6 min.
D +0 /-0,2
1,25 ±0,2
77
Recommended solder pads dimensions
Type
ZCM102
ZCM204
ZCM207
Wave soldering
I
0.7
1,5
2,4
a
1.2
1,5
2,3
b
1.5
1,8
2,6
c
3.1
4,5
7,0
I
1.1
1,7
2,6
Reflow soldering
a
0.8
1,2
2,0
b
1.3
1,6
24
c
2.7
4,1
6,6
1
1
File Nr. 3900.18-450.113.20 |
Revision: 202010
Historical
P/N:
-
ZC0204
ZC0207
L
2,2
+0 /-0,15
Ø
D
L
1
1,2
min.
1,8 min.
Ø
D
1
A
0,40
±0,05
0,80 ±0,10
MASS
(mg)
1,1
+0 /-0,1
D
+0 /-0,1
D +0 /-0,15
7
22
3,6 +0 /-0,2 1,4 +0 /-0,1
ZCM Series Datasheet
Type
Historical Part Number
Climatic Category
Short Time Overload
Standard
IEC60115-1 clause 4.13
(U=2,5*
[s])
,
≤2*
U
max,
5
ZCM102
-
0,1 (<211kΩ) ;
0,15(>211kΩ)
-
-
ZCM204
ZC0204
55/155/56
0,03 (≤1M) ; 0,15 (>1M)
0,05
(≤1M) ; 0,15 (>1M)
0,15
0,15
0,15
0,3
≤ 0,1
ZCM207
ZC0207
0,03 (≤1M) ; 0,15 (>1M)
0,05
(≤1M) ; 0,15 (>1M)
0,25
0,5
0,15
0,3
operation
Single pulse high
voltage overload
10[µs]/700[µs]
Power
operation
Standard
operation
Power
operation
Standard
operation
Power
operation
±[%]
IEC60115-1 clause 4.27
(U=10*
,
Severity 4, 10 pulses
±[%]
-
-
Periodic electric
overload
(U=15*
2.5[s]off,1000 cycles
cont. lev.)
IEC60115-1 clause 4.39
±[%]
[10
-9
h
-1
]
±[%]
±[%]
±[%]
±[%]
1000h
8000h
1000h
8000h
1000h
8000h
125ºC
155ºC
,
0.1[s]on,
-
Failure Rate
(Total,
ϑ0 ,
max, 60[%]
Endurance at 70ºC,
IEC60115-1 clause
4.25.1
(U=
0,5[h]OFF)
U
max,
, 1,5[h]ON ;
Precision
operation
Standard
operation
Power
operation
-
-
0,25 (<211kΩ) ;0,5(>211kΩ)
0,5 (<211kΩ) ; 1 (>211kΩ)
-
-
0,25 (<211kΩ) ; 1 (>211kΩ)
-
0,5 (<211kΩ) ; 1 (>211kΩ)
0.05 (10R≤1M)
0.1 (10R≤1M)
0.15 (<10R) ; 0.1 (10R≤1M) ; 0.25
0.3 (<10R) ; 0.2 (10R≤1M) ; 0.5
0.25
0.5
0,15
(≤1M) ; 0,5 (>1M)
0,3
(≤1M) ; 1 (>1M)
0,25 (≤ 1M) ; 1 (>1M)
Endurance at upper Category
Temp.
IEC60115-1 clause 4.25.3
( 1000[h]
0.05 (10R≤1M)
0.1 (10R≤1M)
0.15 (≤1M) ; 0.5 (>1M)
0.3 (≤1M) ; 1 (>1M)
0,25
(≤1M) ; 0,5 (>1M)
0,5 (≤1M) ; 1 (>1M)
0.15 (<10R) ; 0.1 (10R≤1M) ; 0.25
(>1M)
0.3 (<10R) ; 0.2 (10R≤1M) ; 0.5
(>1M)
0,25 (≤ 1M) ; 1 (>1M)
Damp Heat, Steady State
IEC60115-1 clause 4.24
(40 [°C], 93 [% r.h.], 56[d])
±2
±3
±[%]
Damp Heat, Steady State,
Accelerated
IEC60115-1 clause 4.37
(85
±2
[°C], 85
±5
[%RH], U = 0.3*
±[%]
-55~125ºC
-
-
-
0,25 (≤ 1M) ; 2 (>1M)
0,25
0,5
0,5 (≤ 1M) ; 2 (>1M)
0,25
0,5
Temperature Cycling
( 30[min] each , 1000 cycles)
)
IEC60068-2-14 ; IEC60115-1 clause
4.19
±[%]
-55~155ºC
Vibration
IEC60068-2-6 ; IEC60115-1 clause
4.22
(10;2000[Hz],
≤1,5[mm]
, or
≤200[m/s
]
7,5[h])
2
±[%]
-
0,05 (≤ 1M) ; 0,1 (>1M)
0,05
Resistance to Soldering Heat
IEC60115-1 clause 4.18
±5
±1
±[%]
±[%]
(260 [°C], 10 [s])Solder bath method
0,1 (<211kΩ) ;
0,25(>211kΩ)
-
0,1 (≤
10R) ; 0,05 (>10R)
0,1 (≤ 10R)
; 0,05 (>10R)
Electrostatic Discharge
IEC60115-1 clause 4.38 ; IEC61340-
3-1
( 3 positives + 3 negatives discharges)
0,5 [2 kV]
0,5 [4 kV]
File Nr. 3900.18-450.113.20 |
Revision: 202010
Voltage proof
Flammability
IEC60115-1 clause 4.7
U
RMS
=U
INS
, 60 [s]
IEC60115-1 clause 4.35, IEC60695-
11-5
Needle flame test, 10[s]
-
No flash over or breakdown
-
No burning after 30[s]
Solderability
IEC60068-2-20 ; IEC60115-1 clause
4.17
(235
±3
[ºC] 2
±0,2
[s],SnAg
3
Cu
0.5
or SnAg
3.5
)
-
≥ 95% covered, no visible damage
2
1
ZCM Series Datasheet
Component Resistance to
Solvents
(50[ºC] method 2)
IEC60068-2-45 ; IEC60115-1 clause
4.29
No visible damage
Resistance to solvents of
Marking
(50[ºC] method 1)
IEC60068-2-45 ; IEC60115-1 clause
4.30
Marking visible , no visible damage
Marking
IEC60062
Color code
•
ZCM204
NOTES: MARKING [COLOR CODE]:
•
ZCM207
Color code marking is applied according to IEC 60062 in four (E24 series) or six bands (E96 series). Each color band appears as a single
Zero ohm jumpers
are marked with one centered black band.
Color code marking is applied according to IEC 60062 in four bands (E24 series) for 5 % tolerance, or in five bands (E96 or E192 series). Each color band appears as a single solid
line, voids are permissible if at least
2/3
of the band is visible from each radial angle of view. The last color band for tolerance is approximately 50 % wider than the other bands.
2/
of the band is visible from each radial angle of view. The last color band represents the TCR for resistors with TCR
≤50
ppm/K and nominal tolerance
≤1
%.
3
solid line, voids are permissible if at least
ZCM102
-
-
10R…2M21
-
-
-
100R… 100K
-
-
100R… 100K
Jumper
I
max
= 2A
ZCM204
Resistance range
0R22 … 0R91
0R82… 10M
10R… 1M65
10R… 1M65
22R… 1M65
22R… 1M65
10R… 221K
22R… 221K
43R… 221K
Jumper
I
max
= 3A
ZCM207
0R16 … 0R91
0R22 … 0R91
1R… 10M
1R… 2M21
43R… 1M
43R… 1M
43R… 1M
100R… 511K
100R… 511K
100R… 511K
Jumper
I
max
= 5A
Tolerance
± 5%
± 2%
± 1%
± 0,5%
± 0,5%
± 0,25%
± 0,1%
± 0,5%
± 0,25%
± 0,1%
≤ 10 mΩ
TCR
± 100 ppm/K
± 50 ppm/K
± 25 ppm/K
E-Series
E24
E24 / E96
E24 / E192
E24 / E192
± 15 ppm/K
E24 / E192
The body coating color is light green for jumpers and for a temperature coefficient of ±50 or 100 [ppm], pink for ±25[ppm] and violet for ±15[ppm]
A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits.
[size=4][color=blue][size=10.5pt][b] Everyone may be busy with simulation competitions and training. In the process of simulation competitions, we will definitely have some gains and some unresolved p...
[p=30, null, left][font=宋体][size=3][color=#000000][b]0 Introduction[/b] The DSP device (ADSP-TS101) of Analog Devices has the advantages of strong floating-point real-time processing capability and go...
[b][color=black] To maintain long life and high brightness of LED fluorescent lamps, the problems to be solved are: power supply, LED light source, heat dissipation, and safety. [/color][/b][b][color=...
Can someone post a piece of their own code? A completed driver (with comments). My goal is to figure out where to write some code! For example: usbdeviceattach is called when the USB is connected to t...
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
Long ago, the lifespan of cars in my country was 15 years. Once a car reached 15 years old, it was forced to be scrapped. However, the policy was later changed. As long as the car does not exceed 6...[Details]
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
With the increasing popularity of automated equipment, linear modules, a common auxiliary device for automated equipment, have also seen a bright future. In particular, in recent years, many small ...[Details]
Facial recognition, a biometric technology that uses facial features to authenticate identity, has rapidly become a global market hotspot in recent years as the technology has entered practical use...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
The drive shaft is a high-speed, low-support rotating body, so its dynamic balance is crucial. Generally, drive shafts undergo dynamic balancing tests and adjustments on a balancing machine before ...[Details]
Electronics engineers all know that transient voltage suppression (TVS) diodes are used to protect ports, preventing damage to downstream circuits caused by transient voltage surges. In short, TVS ...[Details]
Talking
京公网安备 11010802033920号
EEWORLD
