W
0603 CERAMIC CHIP CAPACITOR
MLS Applications
0603 Size- Dimensions ( mm)
Length
1.60
Width
0.8
Term min
0.25
Term max
0.46
Tolerance:
±0.1
General Specifications
Electrical Characteristics @25°C
Unless otherwise specified
L
T(max)
(max)
P
Temperature Characteristic and
Operating Temperature Range
Temperature range: -55°C to +125°C
NP0:0±30ppm/°C
X7R:±15% @ 0Vdc -55°C to +125°C
BX: ±15%@0Vdc,+15%-25%@rated voltage
X5R:±15% @-55°C to 85°C
Dissipation Factor (DF)
CECC 32101-801 §4.6.2.
NP0:0.1% Max
Measured at 1Vrms,1kHz except for
Dielectric
Type
NPO
NPO
NPO
NPO
NPO
X7R
X7R
X7R
X5R
X5R
Voltage
(Vdc)
10
16
25
50
100
16
25
50
6,3
16
Cap Range
Min
0,22pF
0,22pF
0,22pF
0,33pF
0,33pF
100pF
100pF
100pF
470nF
220nF
Max
2.2nF
1.5nF
1nF
0.68nF
0.47nF
470nF
220nF
47nF
10µF
2,2µF
NP0 values≤1000pFmeasured at 1MHz.
X7R/X5R:2,5%max
except 25v ,3,5%max
Dielectric Withstanding Voltage (DWV)
CECC 32101-801 §4.6.2.
250% rated voltage for 5sec±1sec,50mA max
For 500volts 200% rated voltage
Insulation Resistance (IR)
CECC 32101-801§4.6.3.
@25°C and rated Vdc:100GΩ min or
1000Ω-F min,whichever is less.
@+125°C and Rated Vdc:10GΩ min or
100Ω-F min,whichever is less.
Capacitance measured at 1Vrms,1kHz
except NPO values≤1000pFmeasured
at 1MHz.
Chip Ordering Information
0603 A 220 F A H
Chip size
Dielectric code
:A=NP0 Y=X7R
Cap value
220=22x10
0
pF
G=2% J=5% K=10%
S=X5R
B D04 MLS
Tolerance
F=1%
Voltage
B=100V A=50V X=25V J=16V Q=10V R=6.3V
Termination
H=Ni-63%Tin/36%Lead/2%Silver
Packaging
B=Tape W=Wafle Pack V=Bulk
D04=200°C None=250°C
None :Standard product MLS: MIL PRF123
X=Ni-100%Tin
Special Pretinning
High Reliability Testing
12-12-13
MEDICAL LIFE SUPPORT CAPACITORS
The present specification affords an increased reliability level for MLS components over the
specification CECC 322101-801 used for standard components.
1. Lots selection
Lots are selected from parts on stock and all manufacturing documents are joined with the lot.
2. DPA analysis on 50 pcs MIL PRF-123D
Results of the analysis are reported in the document QC0901 Annex V.
3. Lot Selection
When the lot is selected by the Quality department , MLS tests are done
4. Specific
MLS tests MIL PRF 123D
Before Burn-in on 100% of the parts : CAP,DF,IR,DWV
Burn-in 168hours, 2xWVDC, 125°C
After burn in on 100% of the parts : CAP,DF,IR,DWV
Allowable PDA is 3% overall and 0.1% the last 48 hours
Visual inspection 100%
Solderability test on 5 samples
Results of the tests are described in
annex 1
QC5001.
12-12-13
NXP MCU
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