Ultra-Precision SMT Resistor 1-2-3 Network
(Molded, J-Lead Terminal)
Resistance Range, Tolerance, Rated Power
Resistance
Range
Element
10
MU
MU
Patent Pending
<
R<100
=
<
R<1k
=
Type
Resistance Tolerance
Absolute
±0.1% (B) ±0.5% (D)
±0.05% (A) ±0.1% (B)
±0.5% (D)
Matching
±0.05% (A) ±0.1% (B)
±0.5% (D)
±0.02% (Q) ±0.05% (A)
±0.1% (B) ±0.5% (D)
Rated Power
Element (W)
at 125°C
100
1k
0.05
<
R<20k
=
±0.02% (Q) ±0.05% (A) ±0.01% (T) ±0.02% (Q)
±0.05% (A) ±0.1% (B)
±0.1% (B) ±0.5% (D)
±0.5% (D)
Composition of Type Number
Symbols in parentheses are for type number composition.
Please contact us for the availibility combination of resistance values.
Absolute TCR
Resistance Range
( )
10
30
100
<
R<30
=
<
R<100
=
<
R<20k
=
TCR Tracking
Absolute TCR
(ppm/°C)
-55C to +125°C
±15
±10
±5
Resistance
Ratio
Ratio=1
=
1<Ratio
<
10
10<Ratio
<
100
=
MU 1K000/ 10K00 B Q L
deriuqeR gnieB egakcaP leeR & epaT 6 )2R( seulaV ecnatsiseR lanimoN 3
)gnihctaM( ecnareloT 5 )1R( seulaV ecnatsiseR lanimoN 2
epyT 1
)etulosbA( ecnareloT 4
6
2
H
3
L
Configuration
Frequency Characteristics
1
P
L
3.2
±0.2
W
1
2.7
±0.2
W
2.5
±0.2
W
2
2.7
±0.2
H
1.5
±0.2
W
3
0.8
±0.1
H
1
1.4
±0.2
L
1
3.0
±0.2
H
2
1.6
±0.2
L
2
0.7
±0.2
H
3
1.1
±0.2
L
3
0.8
±0.1
P
1
1.6
±0.1
L
4
3.0
±0.2
P
2
1.4
±0.1
t
0.1
±0.05
P
3
0.9
±0.1
Example of Applications
An Application of Type MU (input/feedback resistors for amplifiers)
Because the input and the feedback resistors are incorporated into one single element,
amplification is not affected by temperature change.
Dimensions in mm
Power Derating Curve
1
R
NI
V
2
R
1
R
10
)zHM(
TUO
V
k5
k1
001
5.74
k02
k01
001
2
R
ycneuqerF
01
1
051
001
05
)%(
erutarepmeT tneibmA
C¡ 061 041 021 001 08 06 04
051 521
t
5
2
W
1
W
2
L
4
3
H
3
L
3
3
P
3
W
02
4
L
2
P
1
L
L
08
06
04
02
001
)%(
3
W
2
1
P
3
P
:elpmaxE
TCR Tracking
(ppm/°C)
-55°C to +125°C
±1
±2
±3
±5
1
1
H
100<Ratio
W
)CD(R/)CA(R
H
egatnecreP rewoP detaR
Performance
Parameters
Maximum Rated Operating Temperature
Working Temperature Range
Thermal Shock
Overload
Low Temperature Storage and Operation
Substrate Bending Test
Dielectric Withstanding Voltage
Insulation Resistance
Resistance to Soldering Heat
Moisture Resistance
Shock
Vibration, High Frequency
Life
Storage Life
High Temperature Exposure
Test Condition
ALPHA Specification
R
Ratio
ALPHA Typical Test Data
R
Ratio
125
°
C
-
65
°
C
to +
150
°
C
±
0.01%
±
0.02%
±
0.005%
±
0.01%
±
0.02%
±
0.005%
-
65
°
C
/
30 min.
+
150
°
C
/
30 min., 5 cycles
Rated Voltage
x
2.5, 5 sec.
±
0.05%
±
0.05%
±
0.05%
±
0.05%
±
0.01%
-
65
°
C, No Load, 24 hrs. Rated Voltage, 45 min.
3mm Bend 60 sec.
Atmospheric: AC 200V, 1 min.
DC 100V, 1 min.
260
°
C, 10 sec.
+
65
°
C
to -
10
°
C, 90%
to
98% RH, Rated Power, 10 cycles (240 hrs.)
100G, 6ms, Sawtooth Wave, X, Y, Z, each 10 shocks
20G, 10Hz
to
2,000Hz
to
10Hz, 20 min., X, Y, Z, each 2.5 hrs.
125
°
C, Rated Power, 1.5 hrs. – ON, 0.5 hrs. – OFF, 2,000 hrs.
15
°
C
to
35
°
C, 15%
to
75% RH, No Load, 10,000 hrs.
150
°
C, No Load, 2,000 hrs.
±
0.02%
±
0.02%
±
0.01%
±
0.01%
±
0.01%
±
0.005%
±
0.005%
±
0.005%
±
0.0025%
over 10,000M
±
0.05%
±
0.02%
±
0.05%
±
0.02%
over 10,000M
±
0.01%
±
0.005%
±
0.03%
±
0.01%
±
0.02%
±
0.02%
±
0.05%
±
0.005%
±
0.05%
±
0.01%
±
0.01%
±
0.02%
±
0.0025%
±
0.02%
±
0.01%
±
0.01%
±
0.03%
±
0.0025%
±
0.02%
±
0.005%
±
0.005%
±
0.015%
±
0.0015%
±
0.01%
Tape and Reel Package
Tape Dimensions
(based on EIA-481-1)
Reel Dimensions
2
W
Type
MU
A
3.6
±0.2
B
3.1
±0.2
C
12.0
±0.3
D
5.5
±0.05
E
1.75
±0.1
F
8.0
±0.1
G
2.0
±0.05
H
4.0
±0.1
J
1.5
+0.1-0
A
178
±2
N
60
min.
B
13
±0.5
C
21
±0.8
D
2
±0.5
Dimensions in mm
Reel Capacity: 800 pieces/reel
Precaution in Using Face-Bonded Chip Resistor
1. Storage
Storage condition or environment may adversely affect solderability of the exterior
terminals. Do not store in high temperature and humidity. The recommended storage
environment is lower than 40°C, has less than 70% RH humidity and free is from harmful
gases such as sulphur and chlorine.
2. Caution in Soldering
1
Hand Soldering
Hand soldering is applicable as shown at
right.
Recommended
• Temp. of lron Tip: 300°C max.
• Power of lron: 20W or less
• Diameter of Tip: dia. 3mm max.
2
Solder Reflow in Furnace
Recommended
• Peak Temperature: 245°C
• Holding time: 220°C (40sec.max.)
• To cool gradually at room temperature
3
Dipping in Solder (Wave or Still)
Recommended
• Temp. of Solder: 240°C to 250°C
• Length of Dipping: 3 to 4 seconds
• To cool gradually at room temperature
4
Other
Corrosion-free flux, such as rosin, is recommended.
Do not apply pressure to the molded housing immediately after soldering.
tcatnoc fo htgneL
)ces( 06 05 04 03 02 01 5
elbacilppA toN
elbacilppA
053
)C¡(
013
072
032
norI fo .pmeT
3. Cleaning
Use volatile cleaner such as methylalcohol or propylalcohol.
4. Circuit Board Design
The dimensions of solder land must be determined in conformity with the size of resistors
and with the soldering method. They are also subject to the mounting machine and the
material of the substrate. See example below.
When parts are mounted on a board in high density, solder can possibly attach to the
resistors in an excessive amount to affect peformance or reliability of the resistors. To
prevent this effect, the use of solder resist is recommended to isolate solder lands.
lanimreT
mm ni snoisnemiD
draoB tiucriC
UM
1
W
C
B
N
W1
12.4
+2.0-0
W2
18.4
max.
r
1.0
±0.5
Dimensions in mm
D
lanimreT
A
r
1.0±5.2
1.0±9.0
1.0±6.1
dnaL redloS
.xam 53.0
C
1.0±7.0
.xam 7.2
ytivaC
A
J
eloH tekcorpS
H G F
B
E
D
1.0±4.1
1.0±7.0
11
Embedded System
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