HTHG (Z1 Foil Technology)
Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip
Resistor for Hybrid Circuits for High Temperature Applications up to
+240°C, Long Term Stability of 0.05%
FEATURES
Temperature coefficient of resistance (TCR):
±3 ppm/°C typical (- 55 °C to + 220 °C, + 25 °C ref.)
Resistance range: 5 to 100 k(for higher
or lower values, please contact VFR's application
engineering department)
Resistance tolerance: to ± 0.02 %
Connection method: gold wire bonding
Working power: to 150mW at + 220°C
Long term stability: to ± 0.05 % at + 240°C for 2000h, no
power
Load life stability: to 0.05% at + 220°C for 2000h at
working power
Bulk Metal Foil resistors are not restricted to standard
values; specific "as required" values can be supplied at no
extra cost or delivery (e.g. 1K2345 vs. 1K)
Thermal stabilization time < 1 s (nominal value achieved
within 10 ppm of steady state value)
Electrostatic discharge (ESD) at least to 25 kV
Non inductive, non capacitive design
Rise time: 1 ns effectively no ringing
Current noise: 0.010 µV (RMS)/Volt of applied voltage
(< - 40 dB)
Voltage coefficient: < 0.1 ppm/V
Non inductive: < 0.08 µH
Non hot spot design
Terminal finish: gold plated (lead (Pb)-free alloy)
quantities
available,
please
contact
Prototype
foil@vpgsensors.com
INTRODUCTION
Vishay Foil Resistors (VFR) introduces a new line of Ultra
Precision Bulk Metal
®
Z1 Foil Technology: hybrid chip
resistors, connected using gold wire bonding. The HTHG
series features two different layouts of chip designs
according to the sizes (see figure 3 and table 4). These new
types of hybrid chips were especially designed for high
temperature applications up to + 240°C
(1)
(working power: to
150mW at + 220°C), and include gold plated terminals.
The HTHG series is available in any value within the
specified resistance range. VFR's application engineering
department is available to advise and make
recommendations.
For non-standard technical requirements and special
applications, please contact
foil@vpgsensors.com.
FIGURE 1 - POWER DERATING CURVE
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)(2)
(- 55 °C to + 220 °C, + 25 °C Ref.)
RESISTANCE
VALUE
()
100to 100K
50to < 100
25to < 50
10to < 25
5to 10
(1)
(2)
Percent of Rated Power
-55°C
100
75
50
25
0
-75
+70°C
TOLERANCE
(%)
± 0.02
± 0.05
± 0.1
± 0.25
± 0.5
TCR Typical
(ppm/°C)
-50
-25
0
+25
+50
+240
+75 +100 +125 +150 +175 +200 +225 +250
±3
Ambient Temperature (°C)
Notes
Performances obtained with ceramic PCB.
For tighter performances or non-standard values up to 150 k,
please contact VFR's application engineering department by
sending an e-mail to the address in the footer below.
Document Number: 63221
Revision: 13-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
1
HTHG (Z1 Foil Technology)
HIGH TEMPERATURE PRODUCTS
Resistors are the passive building blocks of an electrical
circuit. They may be used for dropping the voltage, buffering
the surge when the circuit is turned on, providing feedback in
a monitoring loop, sensing current flow, etc. When the
application requires stability over time and load, initial
accuracy, minimal change with temperature for more than
200 °C, resistance to moisture and a number of other
characteristics that will be described, only the new
generation of Bulk Metal
®
Foil resistors have the attributes
needed for this application. Over the past few months, there
has been considerable growth in the demand for precise,
stable and reliable resistors that can operate in harsh
environments and especially at high temperatures to 220 °C.
Many analog circuits for industrial, military, aerospace,
medical, down-hole, oil well and automotive applications
require passive components such as resistors to have a
minimal drift from their initial values when operating above +
175 °C and in humid environments. In these applications, the
most important factor is the end of life tolerance (which is part
of the stability) and to a lesser extent, the initial tolerance.
The Bulk Metal Foil resistors provide stabilities well under the
maximum allowable drift required by customers’
specifications through thousands of hours of operation under
harsh conditions, such as the extreme temperatures and
radiation-rich environments of down-hole oil-well logging
applications in the frigid arctic, under the sea or in deep
space. All Bulk Metal Foil resistors receive stabilization
processing, such as repetitive short term power overloads, to
assure reliable service through the unpredictable stresses of
extreme operation. Compared to Bulk Metal Foil, thick and
thin film resistor elements are produced with a
non-controllable material. Heat or mechanical stresses on
the resistive elements cause the particles forming the film to
expand. However, after these stresses are alleviated, the
particles in the film matrix do not return to the exact original
position. That degenerates their overall stability.
Ultra High Precision Bulk Metal Foil technology includes
many types of resistors with a variety of standard
configurations
that
can
withstand
unconventional
environmental conditions above and below the earth’s
surface using special post manufacturing operations
specially developed for this purpose. The stability of a
resistor depends primarily on its history of exposures to high
temperature. Stability is affected by:
1. Changes in the ambient temperature and heat from
adjacent components (defined by the Temperature
Coefficient of Resistance, or TCR)
2. Destabilizing thermal shock of suddenly-applied power
(defined by the Power Coefficient of Resistance, or PCR)
3. Long-term exposure to applied power (load-life stability)
4. Repetitive stresses from being switched on and off
In very high-precision resistors that need to operate in an
environment with temperatures above + 175 °C, these
effects must be taken into account to achieve high stability
with changes in load (Joule Effect) and ambient temperature.
The Bulk Metal Foil Resistors’ new Z1 Foil technology
provides an order of magnitude reduction in the Bulk Metal
Foil element’s sensitivity to temperature changes — both
external and internal – with emphasis on long term stability in
high temperature environments.
In order to take full advantage of the low TCR and long term
stability improvement, it is necessary to take into account the
differences in the resistor’s response to each of the
above-mentioned effects. As described below, new products
have been developed to successfully deal with these factors.
For high temperature applications where stability and total
error budget is the main concern, the new generation of Bulk
Metal Foil resistors offers the best resilience against time at
elevated temperature.
The Bulk Metal Foil technology allows us to produce
customer-oriented products designed to satisfy unique and
specific technical requirements. In addition to the special
chip stabilization under extreme environment conditions in
the production line, we offer additional specially oriented post
manufacturing operations (PMO) for high temperature
applications that require an even higher degree of reliability
and stability.
Electrostatic Discharge (ESD) is another potential problem
that can cause unpredictable failure in high temperature
applications that increase the sensitivity of the resistors to
ESD.
ESD damage to electronic devices can occur at any point in
the device’s life cycle, from manufacturing to field service. A
resistor that is exposed to an ESD event may fail immediately
or may experience a latent defect. With latent defects,
premature failure can occur after the resistor is already
functioning in the finished product after an unpredictable
length of service. Bulk Metal Foil resistors are capable of
withstanding electrostatic discharges at least to 25 kV volts
without degradation.
VFR’s Application Engineering department is always
available to assist with any special requirements you might
have. If you are not sure which resistor best suits your needs,
please do not hesitate to contact them for more information:
foil@vpgsensors.com
www.vishayfoilresistors.com
2
For any questions, contact
foil@vpgsensors.com
Document Number: 63221
Revision: 13-Oct-15
PCB Design
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