TN80960SA16 datasheet, PDF - EEWORLD Datasheet

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TN80960SA16: DescriptionIC mpu i960sa 16mhz 84-plcc; Categorysemiconductor The embedded processor and controller; File Size2MB，39 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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IC mpu i960sa 16mhz 84-plcc

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80960SA

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS

■

High-Performance Embedded

Architecture

— 20 MIPS* Burst Execution at 20 MHz

— 7.5 MIPS Sustained Execution

at 20 MHz

■

512-Byte On-Chip Instruction Cache

— Direct Mapped

— Parallel Load/Decode for Uncached

Instructions

■

Multiple Register Sets

— Sixteen Global 32-Bit Registers

— Sixteen Local 32-Bit Registers

— Four Local Register Sets Stored

On-Chip

— Register Scoreboarding

■

Pin Compatible with 80960SB

■

Built-in Interrupt Controller

— 4 Direct Interrupt Pins

— 31 Priority Levels, 256 Vectors

■

Easy to Use, High Bandwidth 16-Bit Bus

— 32 Mbytes/s Burst

— Up to 16 Bytes Transferred per Burst

■

32-Bit Address Space, 4 Gigabytes

■

80-Lead Quad Flat Pack (EIAJ QFP)

— 84-Lead Plastic Leaded Chip Carrier

(PLCC)

■

Software Compatible with

80960KA/KB/CA/CF Processors

The 80960SA is a member of Intel’s i960

32-bit processor family, which is designed especially for low cost

embedded applications. It includes a 512-byte instruction cache and a built-in interrupt controller. The 80960SA

has a large register set, multiple parallel execution units and a 16-bit burst bus. Using advanced RISC

technology, this high performance processor is capable of execution rates in excess of 7.5 million instructions

per second

. The 80960SA is well-suited for a wide range of cost sensitive embedded applications including

non-impact printers, network adapters and I/O controllers.

SIXTEEN

32-BIT GLOBAL

REGISTERS

64- BY 32-BIT

LOCAL

CACHE

32-BIT

INSTRUCTION

EXECUTION

UNIT

INSTRUCTION

FETCH UNIT

512-BYTE

INSTRUCTION

CACHE

INSTRUCTION

DECODER

MICRO-

INSTRUCTION

SEQUENCER

MICRO-

INSTRUCTION

ROM

32-BIT

BUS

CONTROL

LOGIC

32-BIT

ADDRESS

16-BIT

BURST

BUS

Figure 1. The 80960SA Processor’s Highly Parallel Architecture

* Relative to Digital Equipment Corporation’s VAX-11/780 at 1 MIPS (VAX-11™ is a trademark of Digital Equipment

Corporation)

Intel Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in an Intel product. No other circuit patent

licenses are implied. Information contained herein supersedes previously published specifications on these devices from Intel.

August 2004

Order Number: 272206-003

80960SA

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS

CONTENTS

PAGE

1.0 THE i960

PROCESSOR

...........................................................................................................................1

1.1 Key Performance Features .................................................................................................................2

1.1.1 Memory Space And Addressing Modes ................................................................................... 4

1.1.2 Data Types ...............................................................................................................................4

1.1.3 Large Register Set ...................................................................................................................4

1.1.4 Multiple Register Sets ..............................................................................................................5

1.1.5 Instruction Cache .....................................................................................................................6

1.1.6 Register Scoreboarding ........................................................................................................... 6

1.1.7 High Bandwidth Bus ................................................................................................................6

1.1.8 Interrupt Handling ....................................................................................................................6

1.1.9 Debug Features .......................................................................................................................6

1.1.10 Fault Detection .......................................................................................................................7

1.1.11 Built-in Testability ....................................................................................................................7

1.1.12 CHMOS .................................................................................................................................. 7

2.0 ELECTRICAL SPECIFICATIONS.............................................................................................................

2.1 Power and Grounding ....................................................................................................................... 11

2.2 Power Decoupling Recommendations .............................................................................................. 11

2.3 Connection Recommendations ......................................................................................................... 11

2.4 Characteristic Curves ....................................................................................................................... 11

2.5 Test Load Circuit ............................................................................................................................... 13

2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14

2.7 DC Characteristics ............................................................................................................................ 14

2.8 AC Specifications .............................................................................................................................. 15

3.0 MECHANICAL DATA................................................................................................................................

3.1 Packaging ......................................................................................................................................... 21

3.2 Pin Assignment ................................................................................................................................. 21

3.3 Pinout ................................................................................................................................................ 23

3.4 Package Thermal Specifications ...................................................................................................... 27

3.5 Stepping Register Information .......................................................................................................... 27

4.0 WAVEFORMS

........................................................................................................................................... 28

5.0 REVISION HISTORY

................................................................................................................................ 34

LIST OF FIGURES

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

PAGE

The 80960SA Processor’s Highly Parallel Architecture ................................................................ 0

80960SA Programming Environment ........................................................................................... 1

Instruction Formats ...................................................................................................................... 4

Multiple Register Sets Are Stored On-Chip .................................................................................. 5

Connection Recommendation for LOCK .................................................................................... 11

Typical Supply Current vs. Case Temperature ........................................................................... 12

Typical Current vs. Frequency (Room Temp) ............................................................................. 12

Typical Current vs. Frequency (Hot Temp) ................................................................................. 13

Capacitive Derating Curve ......................................................................................................... 13

Test Load Circuit for Three-State Output Pins ............................................................................ 13

Drive Levels and Timing Relationships for 80960SA Signals ..................................................... 15

Processor Clock Pulse (CLK2) ................................................................................................... 19

RESET Signal Timing ................................................................................................................. 19

HOLD Timing .............................................................................................................................. 20

80-Lead EIAJ Quad Flat Pack (QFP) Package .......................................................................... 21

84-Lead Plastic Leaded Chip Carrier (PLCC) Package ............................................................. 22

Non-Burst Read and Write Transactions Without Wait States .................................................... 28

Quad Word Burst Read Transaction With 1, 0, 0, 0, 0, 0, 0, 0 Wait States ................................ 29

Burst Write Transaction With 2, 1, 1, 1 Wait States (6-8 Bytes Transferred) .............................. 30

Accesses Generated by Quad Word Read Bus Request,

Misaligned One Byte from Quad Word Boundary 1, 0, 0, 0, 0, 0, 0, 0 Wait States ..................... 31

Interrupt Acknowledge Cycle ...................................................................................................... 32

Cold Reset Waveform ................................................................................................................ 33

LIST OF TABLES

Table 1

Table 2

Table 3

Table 4

Table 5

Table 6

Table 7

Table 8

Table 9

Table 10

Table 11

Table 12

Table 13

Table 14

Table 15

80960SA Instruction Set .............................................................................................................. 3

Memory Addressing Modes ......................................................................................................... 4

80960SA Pin Description: Bus Signals ........................................................................................ 8

80960SA Pin Description: Support Signals ................................................................................ 10

DC Characteristics ..................................................................................................................... 14

80960SA AC Characteristics (10 MHz) ...................................................................................... 16

80960SA AC Characteristics (16 MHz) ...................................................................................... 17

80960SA AC Characteristics (20 MHz) ...................................................................................... 18

80960SA QFP Pinout — In Pin Order ........................................................................................ 23

80960SA QFP Pinout — In Signal Order ................................................................................... 24

80960SA PLCC Pinout — In Pin Order ...................................................................................... 25

80960SA PLCC Pinout — In Signal Order ................................................................................. 26

80960SA QFP Package Thermal Characteristics ...................................................................... 27

80960SA PLCC Package Thermal Characteristics .................................................................... 27

Die Stepping Cross Reference ................................................................................................... 27

iii

TN80960SA16 Related Products

	TN80960SA16	EE80960SA20512	EE80960SA20512 S W227	EE80960SA16512	EN80960SA16512	N80960SA20SW227	N80960SA20	EG80960SA16512	N80960SA10
Description	IC mpu i960sa 16mhz 84-plcc	IC mpu i960sa 5V 20mhz 84plcc	IC mpu i960sa 5V 20mhz 84-plcc	IC mpu i960sa 16mhz 84-plcc	IC mpu i960sa 16mhz 84-plcc	IC mpu i960sa 5V 20mhz 84-plcc	IC mpu i960sa 5V 20mhz 84plcc	IC mpu i960sa 16mhz 80-mqfp	IC mpu i960sa 10mhz 84-plcc

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