EEWORLDEEWORLDEEWORLD

Part Number

Search

5114-250/103K225TR

Description
Film Capacitor, Polypropylene, 250V, 0.01uF
CategoryPassive components    capacitor   
File Size69KB,2 Pages
ManufacturerTecate Group
Download Datasheet Parametric View All

5114-250/103K225TR Overview

Film Capacitor, Polypropylene, 250V, 0.01uF

5114-250/103K225TR Parametric

Parameter NameAttribute value
Objectid1193805213
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.01 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPROPYLENE
high23 mm
length30.5 mm
Manufacturer's serial number5114(250VOLTS)
Number of terminals2
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package formRadial
method of packingTR
Rated (DC) voltage (URdc)250 V
series5114(250 VOLTS)
Terminal pitch22.5 mm
width14 mm
METALLIZED POLYESTER/POLYPROPYLENE
COMBINATION FILM-LOW VOLTAGE
NON-INDUCTIVE, EPOXY DIP COATED, HIGH TEMPERATURE
GENERAL SPECIFICATION
TYPE 5114
Part Number Example: See Page F.2
1.
OPERATING TEMPERATURE RANGE:
-40°C ~ +105°C
2.
WORKING VOLTAGE RANGE:
250, 400, 630 VDC
3.
DIELECTRIC STRENGTH:
150% of W.V. for 1 minute
4.
CAPACITANCE VALUE:
.01 ~ 3.3 mfd.
5.
CAPACITANCE TOLERANCE:
J ± 5%, K ± 10%, M ± 20%
6.
DISSIPATION FACTOR:
0.5% max. at 1KHz, 20°C
7.
INSULATION RESISTANCE:
C < .33 mfd, R >15,000MW
C > .33 mfd, R > 5,000MW mfd.
CAP. (µF)
.01
.012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.1
.12
.15
.18
.22
.27
.33
.39
.47
.56
.68
.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
250 VDC
L x H xT
12.5 x 8.5 x 4.5
12.5 x 8.5 x 4.5
12.5 x 8.5 x 4.5
12.5 x 8.5 x 4.5
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.5 x 5.5
12.5 x 10.0 x 6.0
12.5 x 10.0 x 6.0
12.5 x 11.0 x 6.0
18.0 x 11.0 x 6.0
18.0 x 12.0 x 6.5
18.0 x 13.0 x 7.0
18.0 x 14.0 x 7.5
18.0 x 14.5 x 8.5
18.0 x 15.0 x 8.5
26.0 x 14.0 x 7.5
26.0 x 15.0 x 8.0
26.0 x 16.0 x 9.0
26.0 x 17.0 x 10.0
26.0 x 18.0 x 11.0
30.5 x 19.0 x 10.0
30.5 x 20.0 x 11.0
30.5 x 21.0 x 12.0
30.5 x 22.0 x 13.0
30.5 x 23.0 x 14.0
S
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
15.0
15.0
15.0
15.0
15.0
15.0
22.5
22.5
22.5
22.5
22.5
27.5
27.5
27.5
27.5
27.5
400 VDC
L x H xT
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.0 x 5.0
12.5 x 9.5 x 5.5
12.5 x 9.5 x 5.5
12.5 x 10.0 x 6.0
12.5 x 10.0 x 6.0
12.5 x 11.0 x 6.5
12.5 x 12.0 x 7.0
18.0 x 9.5 x 5.5
18.0 x 11.0 x 6.0
18.0 x 12.0 x 6.5
18.0 x 13.0 x 7.0
18.0 x 14.0 x 7.5
18.0 x 14.5 x 8.0
18.0 x 15.0 x 8.5
26.0 x 14.0 x 7.5
26.0 x 15.0 x 8.0
26.0 x 16.0 x 9.0
26.0 x 17.0 x 10.0
26.0 x 18.0 x 11.0
26.0 x 19.0 x 12.0
30.5 x 19.0 x 10.0
30.5 x 20.0 x 11.0
30.5 x 21.0 x 12.0
30.5 x 23.0 x 14.0
30.5 x 25.0 x 16.0
S
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
15.0
15.0
15.0
15.0
15.0
15.0
15.0
22.5
22.5
22.5
22.5
22.5
22.5
27.5
27.5
27.5
27.5
27.5
630 VDC
L x H xT
12.5 x 9.5 x 5.5
12.5 x 9.5 x 5.5
12.5 x 10.0 x 6.0
12.5 x 11.0 x 6.5
12.5 x 12.0 x 7.0
18.0 x 10.0 x 5.5
18.0 x 11.0 x 6.0
18.0 x 12.0 x 6.5
18.0 x 13.0 x 7.0
18.0 x 14.0 x 7.5
18.0 x 14.5 x 8.0
18.0 x 15.0 x 8.5
26.0 x 14.0 x 7.5
26.0 x 15.0 x 8.0
26.0 x 16.0 x 9.0
26.0 x 17.0 x 10.0
26.0 x 18.0 x 11.0
30.5 x 18.0 x 9.5
30.5 x 19.0 x 10.0
30.5 x 20.0 x 11.0
30.5 x 21.0 x 12.0
30.5 x 22.5 x 13.5
30.5 x 24.0 x 15.0
S
10.0
10.0
10.0
10.0
10.0
15.0
15.0
15.0
15.0
15.0
15.0
15.0
22.5
22.5
22.5
22.5
22.5
27.5
27.5
27.5
27.5
27.5
27.5
S
10.0
0.6
15.0
0.8
22.5
0.8
27.5
0.8
Tecate Industries 858.513.2300 Fax 858.513.2345 E-mail tiinfo@tecategroup.com
F.39
Received a gift
I received the gift, opened it and saw...raincoat????? Unzip it, unfold it, oh, it turns out to be... It turns out to be...Bags!! The gifts from EEWORLD are so creative. Thank you....
gumuchixin NXP MCU
Another strange thing happened, SPI problem caused by STM32IAR optimization
The hardware is the same, and even the board is not powered off. It is just re-simulated with different optimizations. When using IAR high optimization, the SCK of SPI1 has no waveform: When highly op...
tt181003 stm32/stm8
[Perf-V Evaluation] Program Construction and CoreMark Porting on E203 SOC
In the previous post, I used GCC to compile a piece of code to operate the GPIO of the E203 SOC, and then used the openocd debugging tool to write the binary directly into the ITCM memory of the E203,...
cruelfox FPGA/CPLD
Protel DXP 2004 Practical Tutorial CD Version
Protel DXP 2004 Practical Tutorial CD Version...
最好的从该花 PCB Design
How to add TFTP to Ltib? Thank you
I am using the 8315E development board. When using LTIB to compile, I always use the default method without changing the configuration items. After compiling, I download the generated kernel to the de...
jutlmh NXP MCU
OVP Circuit Design in TPS92692-Q1 Buck-Boost Circuit
[i=s]This post was last edited by qwqwqw2088 on 2020-7-31 08:21[/i]Since it can be designed into various topologies such as Boost, Buck-Boost, SEPIC, etc., it has been widely used in automotive LED li...
qwqwqw2088 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 109  2380  2088  1633  2149  3  48  43  33  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号