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D55342M07B226DP

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 226ohm, 100V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size488KB,5 Pages
ManufacturerMini-Systems Inc (MSI)
Websitehttp://www.mini-systemsinc.com
Download Datasheet Parametric View All

D55342M07B226DP Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 226ohm, 100V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 1206, CHIP

D55342M07B226DP Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid2062042574
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.55
Other featuresPRECISION
structureChip
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.457 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.6 mm
method of packingTray
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance226 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage100 V
QPL Precision Resistors
MSR
(Top Contact)
WA
(Wrap Around)
MWA
(Mini Wrap Around)
MINI-SYSTEMS, INC.
QPL PART NUMBER DESIGNATION
EXAMPLE:
M55342M01W10E0S
MIL-PRF-55342:
M55342
D = For /07 series only
M = all other series
Military Spec. Indicating
MIL=PRF-55342
Per MIL-PRF-55342, TCR ±300ppm, 0502 case size, Top Contact,
Gold base metal, 10KΩ, 1% tol., “S” Life Failure Rate
QPL thick film resistors are printed and fired on 96%
Alumina. All case sizes are offered to fit a variety of
Hi-Rel hybrid microelectronic applications. Advanced
processing techniques and, Hi-Rel Construction assure
optimum performance where TCR, VCR and operating
power are critical factors. All styles meet and exceed
the qualification requirements of MIL-PRF-55342.
Characteristic:
M
QPL Size:
01
Termination:
W
Material:
Base Metal
K = ±100ppm
M = ±300ppm
70 °C Max. ambient temperature at rated
wattage
See Tables on pages 16 & 17
W = Gold
Top Contact
T = Platinum Gold
Top Contact
D = Palladium Silver
Top Contact
B = Nickel Barrier,
Solder Coated
Wrap Around
G = Nickel Barrier,
Gold Plated
Wrap Around
C = Palladium Silver
Wrap Around
U = Platinum Gold
Wrap Around
Value and:
10EO
10KΩ, 1%
See pgs. 14 & 15 for tables III & IV
Tollerance
Of MIL-PRF-55342
Life Failure:
S
Rate
Product Level
C = Non-ER
M = 1.0% / 1000 Hrs.
P = 0.1% / 1000 Hrs.
R = 0.01% / 1999 Hrs.
S = 0.001% / 1000 Hrs.
T = Space Level
Packaged in chip trays if not specified.
12
E-mail: msithick@mini-systemsinc.com Web site: http://www.Mini-Systemsinc.com
MADE IN AMERICA
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