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V58C2512804SELJ4

Description
DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60,
Categorystorage    storage   
File Size1MB,60 Pages
ManufacturerProMOS Technologies Inc
Environmental Compliance
Download Datasheet Parametric View All

V58C2512804SELJ4 Overview

DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60,

V58C2512804SELJ4 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid114797835
package instructionBGA, BGA60,9X12,40/32
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN codeEAR99
YTEOL2
Maximum access time0.7 ns
Maximum clock frequency (fCLK)250 MHz
I/O typeCOMMON
interleaved burst length2,4,8
JESD-30 codeR-PBGA-B60
memory density536870912 bit
Memory IC TypeDDR1 DRAM
memory width8
Number of terminals60
word count67108864 words
character code64000000
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA60,9X12,40/32
Package shapeRECTANGULAR
Package formGRID ARRAY
Certification statusNot Qualified
refresh cycle8192
Continuous burst length2,4,8
Maximum standby current0.01 A
Maximum slew rate0.295 mA
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
V58C2512(804/164)SE
HIGH PERFORMANCE 512 Mbit DDR SDRAM
4 BANKS X 16Mbit X 8 (804)
4 BANKS X 8Mbit X 16 (164)
PRELIMINARY
4
DDR500
Clock Cycle Time (t
CK2
)
Clock Cycle Time (t
CK2.5
)
Clock Cycle Time (t
CK3
)
System Frequency (f
CK max
)
-
-
4ns
250 MHz
5
DDR400
7.5ns
6ns
5ns
200 MHz
6
DDR333
7.5ns
6ns
-
166 MHz
75
DDR266
-
7.5ns
-
133 MHz
Features
-
-
-
-
-
-
Description
The V58C2512(804/164)SE is a four bank DDR DRAM
organized as 4 banks x 16Mbit x 8 (804), 4 banks x 8Mbit x
16 (164). The V58C2512(804/164)SE achieves high
speed data transfer rates by employing a chip architec-
ture that prefetches multiple bits and then synchronizes
the output data to a system clock.
All of the control, address, circuits are synchronized
with the positive edge of an externally supplied clock. I/O
transactions are occurring on both edges of DQS.
Operating the four memory banks in an interleaved
fashion allows random access operation to occur at a
higher rate than is possible with standard DRAMs. A se-
quential and gapless data rate is possible depending on
burst length, CAS latency and speed grade of the device.
-
-
-
-
-
-
-
-
-
-
-
-
-
High speed data transfer rates with system frequency
up to 250MHz
Data Mask for Write Control
Four Banks controlled by BA0 & BA1
Programmable CAS Latency: 2, 2.5, 3
Programmable Wrap Sequence: Sequential
or Interleave
Programmable Burst Length:
2, 4, 8 for Sequential Type
2, 4, 8 for Interleave Type
Automatic and Controlled Precharge Command
Power Down Mode
Auto Refresh and Self Refresh
Refresh Interval: 8192 cycles/64 ms
Available in 60 Ball FBGA and 66 Pin TSOP II
SSTL-2 Compatible I/Os
Double Data Rate (DDR)
Bidirectional Data Strobe (DQS) for input and output
data, active on both edges
On-Chip DLL aligns DQ and DQs transitions with CK
transitions
Differential clock inputs CK and CK
Power Supply 2.5V ± 0.2V
tRAS lockout supported
Concurrent auto precharge option is supported
Device Usage Chart
Operating
Temperature
Range
0°C to 70°C
-40°C to 85°C
Package Outline
JEDEC 66 TSOP II
60 FBGA
CK Cycle Time (ns)
-4
Power
-75
-5
-6
Std.
L
Temperature
Mark
Blank
I
V58C2512(804/164)SE Rev.1.0 January 2014
1

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