jh4ODEL
No.
1 PAGE
.
I
7.
Notes
7.1
For cleaning
* Cleaning
(1)
(2)
Solvent
Ultrasonic
conditions:
cleaning:
cleaning:
Solvent
te perature
45°C
Immersion
3 min. or less
PC3Q64
I
4
or less
Affection
to device
by ultrasonic
cleaning
has
different
affection
by cleaning
bath size,
ultrasonic
power output,
cleaning
time,
PWB size
or device
mounting
condition
etc-
If user
carries
out ultrasonic
cleaning,
user should
select
fit
condition
that doesn't
occur defect.
be carried
Ethyl
Freon
out
with
solvent
below.
Isopropyl
S3-E
alcohol
* The cleaning
Solvent:
shall
alcohol,
TE.TF,
Methyl
alcohol,
Daiflon-solvent
Please
refrain
from using Chloro Fluoro
Carbon type solvent
to clean
devices
as much as possible
since it is restricted
to protect
the
ozonosphere.
Before
you use alternative
solvent
you are requested
to confirm
that it does not damage package resin.
7.2
On mounting
In mounting
this device,
please
perform
soldering
reflow
satisfied
with the conditions
indicated
in page 12.
And please
pay attention
not to occur the temperature
rising
of the package sectionally.
8.
Others
Any doubt as to this specification
upon mutual
consultation
of the
shall
be determined
both parties.
in
good
faith