PC450T11
PC450T11
s
Features
1. Built-in breakdown diode for absorption of
surge voltage
2. High current transfer ratio
( CTR: MIN. 1 500% at I
F
= 5mA )
3. Mini-flat package
4. Applicable to soldering reflow
5. Available tape-packaged products
Photocoupler with Built-in
Breakdown Diode for Surge
Voltage Absorption
s
Outline Dimensions
( Unit : mm )
Internal connection
diagram
4
3
Model No.
4.4
±
0.2
4
3
Anode mark
2.54
±
0.25
0.4
±
0.1
1
2
s
Applications
1. Programmable controllers
0.1
±
0.1
2.6
±
0.2
1
2
0.2
±
0.05
7.0
+
0.2
-
0.7
3 Emitter
4 Collector
3.6
±
0.3
C0.4
(Input side )
5.3
±
0.3
s
Package Specifications
Model No.
PC450T11
Package Specification
Taping diameter 178mm ( 750pcs. )
0.5
+
0.4
-
0.2
6˚
1 Anode
2 Cathode
s
Absolute Maximum Ratings
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Emitter-collector voltage
*2
Surge endurance
Collector current
Collector power dissipation
Total power dissipation
*3
Isolation voltage
Operating temperature
Storage temperature
*4
Soldering temperature
Symbol
I
F
I
FM
V
R
P
V
ECO
E
sj
I
C
P
C
P
tot
V
iso
T
opr
T
stg
T
sol
Rating
50
1
6
70
6
20
150
150
170
3.75
- 30 to + 100
- 40 to + 125
260
( Ta = 25˚C )
Unit
mA
A
V
mW
V
mJ
mA
mW
mW
kV
rms
˚C
˚C
˚C
Input
Output
*1 Pulse width <=100
µs,
Duty ratio : 0.001
*2 Esj = 40V ( V
CEO
) x 100mA ( I
C
) x 10ms x 1/2
*3 AC for 1 min., 40 to 60% RH, f = 60Hz
*4 For 10 seconds
“
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
”
PC450T11
Fig. 3 Power Dissipation vs. Ambient
Temperature
200
170
Power dissipation P
tot
( mW )
150
Fig. 4 Peak Forward Current vs. Duty Ratio
10000
5000
Peak forward current I
FM
( mA )
2000
1000
500
200
100
50
20
10
Pulse width <=100
µs
T
a
= 25˚C
100
50
0
- 30
0
25
50
75
100
125
Ambient temperature T
a
( ˚C )
5
5
10
- 3
2
5
10
-2
2
5
10
- 1
2
5
1
Duty ratio
Fig. 5 Forward Current vs.
Forward Voltage
100
25˚C
Fig. 6 Current Tranfer Ratio vs.
Forward Current
T
a
= 25˚C
5000
50
( mA )
Current tranfer ratio CTR ( % )
50˚C
20
75˚C
10
5
0˚C
- 25˚C
4000
Forward current I
F
3000
V
CE
= 2V
2000
2
1
0.0
1000
0.5V
0.5
2.0
Forward voltage V
F
( V )
1.0
1.5
2.5
3.0
0
0.1
1.0
5.0
10
50
100
Forward current I
F
( mA )
Fig. 7 Collector Current vs. Collector
-emitter Voltage
Pc (max)
100
I
F
= 10mA
5mA
80
T
a
= 25˚C
Fig. 8 Relative Current Transfer Ratio vs.
Ambient Temperature
150
I
F
= 1mA
Relative current transfer ratio ( % )
V
CE
= 5V
Collector current I
C
( mA )
100
60
3mA
40
2.5mA
2mA
20
1.5mA
1mA
0.5mA
0
1.0
2.0
3.0
4.0
Collector-emitter voltage V
CE
( V )
5.0
50
0
0
- 30
0
20
40
60
80
100
Ambient temperature T
a
( ˚C )
Application Circuits
NOTICE
qThe
circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact
SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve
the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact
a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf
the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis
publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
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and consult with a SHARP representative if there are any questions about the contents of this
publication.
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