Lead forming type ( I type ) and taping reel type ( P type ) are also available. (
PC817I/PC817P
)
gg
TUV ( VDE0884 ) approved type is also available as an option.
s
Outline Dimensions
PC817
2.54
±
0.25
4
PC817
CTR
rank mark
Anode mark
1
3
6.5
±
0.5
Internal connection diagram
4
3
Anode
mark
1
2
1
( Unit : mm )
PC827
8
7
PC817
2.54
±
0.25
6 5
PC817
6.5
±
0.5
Internal connection diagram
8
7
6 5
2
0.9
±
0.2
1.2
±
0.3
4.58
±
0.5
2.7
±
0.5
2
0.9
±
0.2
1.2
±
0.3
3
4
1
2
3
4
7.62
±
0.3
0.5
TYP.
3.5
±
0.5
1
2
3
4
Anode
Cathode
Emitter
Collector
2.7
±
0.5
9.66
±
0.5
7.62
±
0.3
1
2
5
6
3
4
7
8
Anode
Cathode
Emitter
Collector
3.5
±
0.5
0.5
TYP.
0.26
±
0.1
θ
θ
θ
=
0 to 13
˚
0.26
±
0.1
θ
θ
θ=
0 to 13
˚
3.0
±
0.5
3.0
±
0.5
0.5
±
0.1
0.5
±
0.1
PC837
Anode mark
2.54
±
0.25
12
11
10
9
PC817
8
PC817
7
6.5
±
0.5
12 11
10
9
8
7
Anode mark
Internal connection
diagram
PC847
2.54
±
0.25
16
15
14
13
12 11
10
Internal connection
diagram
9
PC817
6.5
±
0.5
16 15
14 13
12 11
10
9
PC817
PC817
PC817
1
2
3
4
5
6
1
2
3
4
5
6
7 8
0.9
±
0.2
1.2
±
0.3
0.5
TYP.
3.5
±
0.5
PC817
1
2
3
4
5
6
1
2
3 4
5
6
0.9
±
0.2
1.2
±
0.3
0.5
TYP.
3.5
±
0.5
14.74
±
0.5
2.7
±
0.2
1 3 5 Anode
2 4 6 Cathode
7 9
11
Emitter
8
10 12
Collector
7.62
±
0.3
7
8
7.62
±
0.3
19.82
±
0.5
2.7
±
0.5
0.26
±
0.1
θ
θ
=
0 to 13
˚
9
11 13 15
10 12 14 16
Emitter
Collector
θ
0.26
±
0.1
θ
θ
=
0 to 13
˚
θ
3.0
±
0.5
3.0
±
0.5
0.5
±
0.1
1 3 5 7 Anode
2 4 6 8 Cathode
0.5
±
0.1
“
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
PC817 Series
s
Absolute Maximum Ratings
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Total power dissipation
*2
Isolation voltage
Operating temperature
Storage temperature
*3
Soldering temperature
Symbol
I
F
I
FM
V
R
P
V
CEO
V
ECO
I
C
P
C
P
tot
V
iso
T
opr
T
stg
T
sol
Rating
50
1
6
70
35
6
50
150
200
5 000
- 30 to + 100
- 55 to + 125
260
( Ta = 25˚C )
Unit
mA
A
V
mW
V
V
mA
mW
mW
V
rms
˚C
˚C
˚C
Input
Output
*1 Pulse width <=100µs, Duty ratio : 0.001
*2 40 to 60% RH, AC for 1 minute
*3 For 10 seconds
s
Electro-optical Characteristics
Parameter
Forward voltage
Peak forward voltage
Reverse current
Terminal capacitance
Collector dark current
*4
Current transfer ratio
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
Rise time
Response time
Fall time
Symbol
V
F
V
FM
I
R
C
t
I
CEO
CTR
V
CE ( sat )
R
ISO
C
f
f
c
t
r
t
f
Conditions
I
F
= 20mA
I
FM
= 0.5A
V
R
= 4V
V = 0, f = 1kHz
V
CE
= 20V
I
F
= 5mA, V
CE
= 5V
I
F
= 20mA, I
C
= 1mA
DC500V, 40 to 60% RH
V = 0, f = 1MHz
V
CE
= 5V, I
C
= 2mA, R
L
= 100
Ω,
- 3dB
V
CE
= 2V, I
C
= 2mA, R
L
= 100
Ω
MIN.
-
-
-
-
-
50
-
5 x 10
10
-
-
-
-
TYP.
1.2
-
-
30
-
-
0.1
10
11
0.6
80
4
3
( Ta = 25˚C )
MAX.
1.4
3.0
10
250
10
- 7
600
0.2
-
1.0
-
18
18
Unit
V
V
µ
A
pF
A
%
V
Ω
pF
kHz
µ
s
µ
s
Input
Output
Transfer
charac-
teristics
*4 Classification table of current transfer ratio is shown below.
Fig. 1 Forward Current vs.
Ambient Temperature
60
Model No.
PC817A
PC817B
PC817C
PC817D
PC8g7AB
PC8g7BC
PC8
g7CD
PC8
g7AC
PC8g7BD
PC8
g7AD
PC8
g
7
g
: 1 or 2 or 3 or 4
Rank mark
A
B
C
D
A or B
B or C
C or D
A, B or C
B, C or D
A, B, C or D
A, B, C, D or No mark
CTR ( % )
80 to 160
130 to 260
200 to 400
300 to 600
80 to 260
130 to 400
200 to 600
80 to 400
130 to 600
80 to 600
50 to 600
50
Forward current I
F
( mA )
40
30
20
10
0
- 25
75
Ambient temperature T
a
( ˚C)
0
25
50
100
125
PC817 Series
Fig. 2 Collector Power Dissipation vs.
Ambient Temperature
200
Collector power dissipation P
C
( mW )
Fig. 3 Peak Forward Current vs. Duty Ratio
10 000
5 000
( mA )
Pulse width <=100
µ
s
T
a
= 25˚C
150
2 000
1 000
500
200
100
50
20
10
100
50
Peak forward current I
FM
0
- 30
5
0
25
50
75
a
100
( ˚C )
125
5
10
- 3
2
5
10
-2
2
5
10
-1
2
5
1
Ambient temperature T
Duty ratio
Fig. 4 Current Transfer Ratio vs.
Forward Current
200
180
Current transfer ratio CTR ( % )
160
V
CE
= 5V
T
a
= 25˚C
Fig. 5 Forward Current vs. Forward Voltage
500
200
100
Forward current I
F
( mA )
50
20
10
5
2
1
T
a
= 75˚C
50˚C
25˚C
0˚C
- 25˚C
140
120
100
80
60
40
20
0
1
2
5
10
20
50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward current I
F
( mA )
Forward voltage V
F
( V)
Fig. 6 Collector Current vs.
Collector-emitter Voltage
30
I
F
= 30mA
25
Collector current I
C
( mA )
20mA
T
a
= 25˚C
P
C
( MAX. )
Fig. 7 Relative Current Transfer Ratio vs.
Ambient Temperature
150
I
F
= 5mA
V
CE
= 5V
Relative current transfer ratio ( % )
20
100
15
10mA
10
5mA
5
0
0
50
1
2
3
4
5
6
7
CE
8
9
0
- 30
0
25
50
a
75
( ˚C )
100
Collector-emitter voltage V
(V)
Ambient temperature T
PC817 Series
Fig. 8 Collector-emitter Saturation Voltage vs.
Ambient Temperature
0.16
Collector-emitter saturation voltage V
CE ( sat )
( V )
Collector dark current I
CEO
( A)
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
- 25
10
0
25
50
75
100
Ambient temperature T
a
(˚C)
- 11
Fig. 9 Collector Dark Current vs.
Ambient Temperature
10
-5
I
F
= 20mA
I
C
= 1mA
10
-6
V
CE
= 20V
10
-7
10
-8
10
10
-9
- 10
- 25
0
75
Ambient temperature T
a
( ˚C )
25
50
100
Fig.10 Response Time vs. Load Resistance
500
200
100
50
Response time (
µ
s )
20
10
5
2
1
0.5
0.2
0.1
0.1
1
Load resistance R
L
( k
Ω
)
10
t
d
t
s
t
r
t
f
V
CE
= 2V
I
C
= 2mA
Ta = 25˚C
Fig.11 Frequency Response
V
CE
= 2V
I
C
= 2mA
0
Voltage gain A
v
( dB )
T
a
= 25˚C
100
Ω
-10
1k
Ω
R
L
= 10k
Ω
-20
0.5
1
2
5
10
20
50 100 200 500
Frequency f ( kHz )
Test Circuit for Response Time
V
CC
Input
R
D
R
L
Output
Input
Output
10%
90%
t
d
t
s
t
r
t
f
Fig.12 Collector-emitter Saturation
Voltage vs. Forward Current
Collector-emitter saturation voltage V
CE ( sat )
( V )
6
T
a
= 25˚C
5
I
C
= 0.5mA
1mA
4
3mA
5mA
3
7mA
Test Circuit for Frepuency Response
V
CC
R
D
R
L
Output
2
1
0
0
5
10
15
Forward current I
F
( mA )
q
Please refer to the chapter “ Precautions for Use ”
Application Circuits
NOTICE
qThe
circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact
SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve
the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact
a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf
the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis
publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact
and consult with a SHARP representative if there are any questions about the contents of this
Greetings to everyone. Can anyone send me a complete process of making an electronic combination lock? Thank you. Email: smj088@126.com QQ: 85145857 I urgently need help from people all over the count...
The statements are as follows: FiqStackSpace SPACE FIQ_Stack_Legth FiqStack DCD FiqStackSpace + FIQ_Stack_Legth In the last statement, DCD is followed by FiqStackSpace + FIQ_Stack_Legth. The FiqStackS...
There are two function definitions in csparm_macros.h: #define CSP_BITFMASK(bit) (((1U << (bit ## _WID)) - 1) << (bit ## _LSH)) #define CSP_BITFVAL(bit, val) ((val) << (bit ## _LSH)) What do these two...
introduction
1 The significance of using RTOS on MSP430
It is understandable that it is meaningless to use RTOS on MSP430. Because the hardware resources of MSP430 are limited (for exampl...[Details]
1 Introduction
With the acceleration of the pace of urban modernization, society has higher requirements for urban road lighting and urban lighting projects. The state has clearly required tha...[Details]
5. Identifiers and keywords of C language
A complete PIC microcontroller C language program usually consists of six parts: include files (i.e. header files 1, variable definitions, variable de...[Details]
Vertical cavity surface emitting lasers (VCSELs) are gradually replacing traditional edge emitting lasers, especially in low bandwidth and short-distance communication systems where cost factors ar...[Details]
This week, Microsoft held its 2012 Microsoft Worldwide Partner Conference (WPC) in Toronto, Canada. At the conference, Microsoft showed its new products and services to partners around the world. A...[Details]
VP2188 is a color STN LCD module produced by Jingdian Pengyuan. This module is a dot matrix transmissive color STN display screen with a color scale of 65 k colors and white LED backlight. Its core...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
OC faults may be the most frequent and the most frequent of all faults in the inverter. They alarm during the startup process, during the shutdown process, during operation, and even when powered o...[Details]
In today's body control module (BCM) designs, savvy engineers are moving away from electromechanical relays whenever possible. Their next step is to eliminate fuses. But is eliminating fuses a nece...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
Abstract: In recent years, with the establishment and grid-connected power generation of a large number of solar photovoltaic power stations at home and abroad, photovoltaic grid-connected inverter...[Details]
Preface
In recent years, white light LEDs have gradually replaced incandescent bulbs and fluorescent lamps because they have unparalleled advantages over traditional light sources in terms...[Details]
0 Introduction
With the rapid development of social economy and science and technology, electric locomotives, subways and electric vehicles will be widely used. The power conversion and cont...[Details]
LED is the abbreviation of the English word. Its main meanings are: LED = Light Emitting Diode, a solid-state semiconductor device that can convert electrical energy into visible light. It can dire...[Details]
a. Keep the battery clean, wipe off the spilled electrolyte, contaminated dirt and dust in time; keep the poles and terminal clamps clean and in good contact, and apply vaseline or butter to preven...[Details]
Integrated technical exchanges
京公网安备 11010802033920号
EEWORLD
