54F157FM datasheet, PDF - EEWORLD Datasheet

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54F157FM: DescriptionMultiplexer, 4-Func, 2 Line Input, TTL, CDFP16,; Categorylogic logic; File Size214KB，5 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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54F157FM Overview

Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,

54F157FM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Fairchild
package instruction	DFP, FL16,.3
Reach Compliance Code	compliant
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Logic integrated circuit type	MULTIPLEXER
Humidity sensitivity level	2A
Number of functions	4
Number of entries	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	250
Prop。Delay @ Nom-Sup	17 ns
Certification status	Not Qualified
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
Base Number Matches	1

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Description	Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	compliant	compliant	compliant
JESD-30 code	R-XDFP-F16	R-XDFP-F16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
Humidity sensitivity level	2A	2A	2A	2A	2A	2A	2A	2A
Number of functions	4	4	4	4	4	4	4	4
Number of entries	2	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DFP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	FL16,.3	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	250	250	250	250	250	250	250	250
Prop。Delay @ Nom-Sup	17 ns	17 ns	17 ns	17 ns	13 ns	15 ns	15 ns	15 ns
surface mount	YES	YES	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30
Base Number Matches	1	1	1	1	1	1	1	1
package instruction	DFP, FL16,.3	DFP, FL16,.3	-	-	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
JESD-609 code	e0	e0	e0	e0	-	e0	e0	e0
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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