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S71WS256JC0BAITA0

Description
Memory Circuit, Flash+PSRAM, CMOS, PBGA84
Categorystorage    storage   
File Size4MB,183 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Environmental Compliance
Download Datasheet Parametric View All

S71WS256JC0BAITA0 Overview

Memory Circuit, Flash+PSRAM, CMOS, PBGA84

S71WS256JC0BAITA0 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid104712828
package instructionFBGA, BGA84,10X12,32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time55 ns
JESD-30 codeR-PBGA-B84
Memory IC TypeMEMORY CIRCUIT
Mixed memory typesFLASH+PSRAM
Number of terminals84
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA84,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Certification statusNot Qualified
Maximum standby current0.00005 A
Maximum slew rate0.06 mA
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
S71WSxxxJ based MCPs
Stacked Multi-Chip Product (MCP)
128/64 Megabit (8M/4M x 16-bit) CMOS 1.8 Volt-only,
Simultaneous Read/Write, Burst Mode Flash Memory
with CellularRAM
PRELIMINARY
Distinctive Characteristics
MCP Features
Power supply voltage of 1.7 to 1.95V
Speed: 66MHz
Packages
— 8 x 11.6mm, 84 ball FBGA
Operating Temperature
— –25°C to +85°C
— –40°C to +85°C
General Description
The S71WS series is a product line of stacked Multi-Chip Product (MCP) packages
and consists of:
One or more flash memory die
CellularRAM-compatible pSRAM
The products covered by this document are listed in the table below. For details
about their specifications, please refer to the individual constituent datasheets for
further details:
Flash Memory Density
256Mb
64Mb
pSRAM
Density
32Mb
16Mb
S71WS256JC0
128Mb
S71WS128JC0
S71WS128JB0
S71WS128JA0
S71WS064JB0
S71WS064JA0
64Mb
Publication Number
S71WS256/128/064J_00
Revision
A
Amendment
0
Issue Date
November 10, 2004

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