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MA4P1250-1072T

Description
PIN DIODE,SINGLE,50V V(BR),SQUARE
CategoryDiscrete semiconductor    diode   
File Size143KB,3 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
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MA4P1250-1072T Overview

PIN DIODE,SINGLE,50V V(BR),SQUARE

MA4P1250-1072T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTE Connectivity
Parts packaging codeMELF
Contacts2
Manufacturer packaging codeCASE 1072
Reach Compliance Codeunknown
Minimum breakdown voltage50 V
Nominal diode capacitance0.8 pF
Maximum diode forward resistance0.75 Ω
Diode resistance test current50 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
Minority carrier nominal lifetime8 µs
Maximum operating temperature175 °C
Reverse test voltage50 V
surface mountYES
Base Number Matches1
Surface Mount
PIN Diodes
Features
q
q
q
q
q
q
q
MA4P1250, MA4P1450 SMQ™
V3.00
Non-Rollable MELF Design
Hermetically Sealed
Low Loss, Low Distortion
Passivated PIN Diode Chips
Full Face Chip Bonds
Non-Magnetic Package
Pick and Place Compatibility
Size, Inches (mm)
Model No.
MA4P1250
MA4P1450
Case
Style
1072
1091
A(sq.)
Min./Max.
0.080/0.095
(2.03/2.41)
0.138/0.155
(3.51/3.94)
B
Min./Max.
0.115/0.135
(2.92/3.43)
0.180/0.200
(4.57/5/08)
C
Min./Max.
0.008/0.030
(0.203/0.762)
Description
The MA4P1250 and MA4P1450 are square surface mount-
able PIN diodes in a non-rollable, metal electrode lead-
less faced (MELF) package. They incorporate passivated
PIN diode chips that are full face bonded to refractory
metal pins. These parts utilize M/A-COM’s HIPAX tech-
nology in a low inductance ceramic package with no rib-
bons or whisker wires. The package is hermetically
sealed at temperatures exceeding 300˚C.
Applications
The MA4P1250 is designed for use as a low loss switch-
ing element from HF through UHF. Its high power rating
allows performance in antenna switch elements at RF
power levels greater than 100 watts CW. It is designed to
meet the low distortion requirements of mobile radios.
The MA4P1450 is a higher power diode. It has lower dis-
tortion at RF CW power greater than 10 watts and can
dissipate 7.5 watts.
FULL FACE
BOND
PASSIVATED
PIN DIODE CHIP
Designed for Automated Assembly
These surface mount PIN diodes are designed for high
volume tape and reel assembly. The square package
eases automatic pick and place indexing and assembly.
The parallel flat surfaces are suitable for key jaw or vac-
uum pickup techniques. All solderable surfaces are tin
plated and compatible with reflow and vapor phase sol-
dering methods.
CERAMIC
SOLDERABLE
SURFACES
Environmental Capability
These HIPAX diodes are applicable for use in industrial
and military applications. They can meet the environmen-
tal requirements of MIL-STD-750 and MIL-STD-202 or be
screened to JAN-TX and other high reliability standards.
SMQ is a trademark of M/A-COM, Inc.
Specifications Subject to Change Without Notice.
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
Fax (800) 618-8883
s
1
Asia/Pacific: Tel. +81 3 3263 8761
Fax +81 3 3263 8769
s
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020

MA4P1250-1072T Related Products

MA4P1250-1072T MA4P1450-1091T
Description PIN DIODE,SINGLE,50V V(BR),SQUARE PIN DIODE,SINGLE,50V V(BR),SQUARE
Is it Rohs certified? conform to conform to
Maker TE Connectivity TE Connectivity
Parts packaging code MELF MELF
Contacts 2 2
Manufacturer packaging code CASE 1072 CASE 1091
Reach Compliance Code unknown unknown
Minimum breakdown voltage 50 V 50 V
Nominal diode capacitance 0.8 pF 1.8 pF
Maximum diode forward resistance 0.75 Ω 0.75 Ω
Diode resistance test current 50 mA 50 mA
Diode resistance test frequency 100 MHz 100 MHz
Diode type PIN DIODE PIN DIODE
Minority carrier nominal lifetime 8 µs 8 µs
Maximum operating temperature 175 °C 175 °C
Reverse test voltage 50 V 50 V
surface mount YES YES
Base Number Matches 1 1

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