EEWORLDEEWORLDEEWORLD

Part Number

Search

1812Y2000270JAT

Description
Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size562KB,9 Pages
ManufacturerSyfer
Environmental Compliance  
Download Datasheet Parametric View All

1812Y2000270JAT Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT

1812Y2000270JAT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1469805815
package instruction, 1812
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN codeEAR99
YTEOL7.73
capacitance0.000027 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high3.2 mm
JESD-609 codee3
length4.5 mm
Manufacturer's serial number1812
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 7 INCH
positive tolerance5%
Rated (DC) voltage (URdc)200 V
GuidelineAEC-Q200
seriesAEC-Q200
size code1812
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width3.2 mm
Surface mount capacitors
1.1 to 1.3
1.1 - Production process flowchart
Ceramic powder
preparation
Electrode ink
material
1.2 - Syfer reliability grades
High reliability
(space quality)
Space
Grade
ESCC 3009
(1)
MIL Grade
(2)
IECQ-CECC
(3)
AEC-Q200
(4)
Standard components
Multilayer build
(wet process)
Fire
Standard
reliability
Rumble
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specification S02A 0100.
Internal inspection
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certification which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
Termination
(if specified)
Plating
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualification
For Passive Components. Refer to Syfer application note reference
AN0009.
Printing
(if specified)
1.3 - Syfer reliability surface mount product
groups
Electrical test
Tandem
FlexiCap
TM
capacitors
(1)
Open Mode
FlexiCap
TM
capacitors
(2)
Standard FlexiCap
TM
capacitors
(3)
Standard MLC capacitor
(4)
High reliability
Test verification
Additional sample
Rel tests
(if specified)
Standard
reliability
Notes:
QC inspection
Additional Hi Rel
activities
(S02A & S05
100% burn-in, QC insp)
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualified to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCap
TM
termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualified to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCap
TM
termination. By using
FlexiCap
TM
termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin finish over nickel,
but no FlexiCap
TM
.
Packaging
4
Finished goods store
Code Composer Studio v4.2 for MSP430(tm) User’s Guide
[[i] This post was last edited by wstt on 2011-9-14 13:34[/i]]...
晓端 Microcontroller MCU
Download Zhixin Technology FPGA Training Introductory Videos
[i=s]This post was last edited by fpgaw on 2016-1-21 16:12[/i] [b][color=#ff0000]Zhixin Technology[/color][/b]As the most professional FPGA talent training base in China and a key member of Altera ATP...
fpgaw FPGA/CPLD
[2009 Electronic Design Competition Topic Analysis 3] - Multiple Figures
The 30m frequency communication circuit diagram in the electronic competition is outhttps://bbs.eeworld.com.cn/thread-85045-1-1.htmlThemaximum power tracking of the electronic competitionhttps://bbs.e...
njlianjian Electronics Design Contest
A complete collection of research materials on wireless positioning algorithms
Recently, I have been researching wireless positioning algorithms, so I uploaded some information to share with you. I collected it from various channels. I hope it will be useful to you. I also hope ...
wateras1 RF/Wirelessly
Welcome all netizens to come here to speak
To all netizens: Hello, everyone, I am here to chat. If you have nothing to do, come here to browse. If you need any kind of software or technical articles, you can tell us here. We will do our best t...
rain MCU
Sino-American Ai*ti*Tech, new classes start on September 10th, free trial!
Sino-American Ai*ti* Technology, .NET Foreign Enterprise Software Engineer Class will start on September 10, 2007. The first week of the course is free for trial. Welcome to sign up! Sino-American Ai*...
win32sasser Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1428  660  1648  1480  253  29  14  34  30  6 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号