HCHP2208K19R1FB151 datasheet, PDF

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HCHP2208K19R1FB151: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.75W, 19.1ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2208,; CategoryPassive components The resistor; File Size136KB，9 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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HCHP2208K19R1FB151 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 19.1ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2208,

HCHP2208K19R1FB151 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	228037025
Reach Compliance Code	unknown
Country Of Origin	France
ECCN code	EAR99
YTEOL	6.65
structure	Chip
Number of terminals	2
Maximum operating temperature	155 °C
Minimum operating temperature	-55 °C
Package height	0.5 mm
Package length	5.58 mm
Package form	SMT
Package width	2 mm
method of packing	Waffle Pack
Rated power dissipation(P)	0.75 W
Guideline	MIL-R-55342D
resistance	19.1 Ω
Resistor type	FIXED RESISTOR
series	HCHP
size code	2208
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Tolerance	1%
Operating Voltage	200 V

HCHP2208K19R1FB151 Preview

CHP, HCHP

www.vishay.com

Vishay Sfernice

High Stability Resistor Chips

(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology

FEATURES

• Robust terminations

• Large ohmic value range 0.1



to 100 M

• Tight tolerance to 0.5 %

• CHP: Standard passivated version for

industrial, professional and military applications

• HCHP: For high frequency applications

• ESCC approved see CHPHR

• High temperature (245 °C) see CHPHT

Vishay Sfernice thick film resistor chips are specially

designed to meet very stringent specifications in terms

of reliability, stability < 0.25 % at Pn at + 70 °C during

1000 h, homogeneity, reproducibility and quality.

They conform to specifications NFC 83-240 and

MIL-R-55342 D.

Evaluated to ESCC 4001/026 (see CHPHR datasheet).

Sputtered Thin Film terminations, with nickel barrier, are

very convenient for high operating conditions. They can

withstand thousands of very severe thermal shocks.

B (W/A), N (W/A), and F (one face) types are for solder reflow

assembly.

G (W/A) and W (one face) types are for wire bonding, gluing

and even high temperature solder reflow.

• SMD wraparound chip resistor

• Halogen-free according to IEC 61249-2-21 definition

• Withstand moisture resistance test of AEC-Q200

• Material categorization: For definitions of compliance

please see

www.vishay.com/doc?99912

Note

Lead (Pb)-containing terminations are not RoHS-compliant.

Exemptions may apply.

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

CHP0502

HCHP0502

CHP0505

HCHP0505

CHP0603

HCHP0603

CHP0805

HCHP0805

CHP1005

HCHP1005

CHP1206

HCHP1206

CHP1505

HCHP1505

CHP2010

HCHP2010

CHP1020

HCHP1020

CHP2208

HCHP2208

CHP2512

CHP2512

CHP1010

CHP1010

(1)

SIZE

0502

0505

0603

0805

1005

1206

1505

2010

1020

2208

2512

1010

RATED POWER

0.050

0.125

0.200

0.250

0.500

1.000

(2)

1.000

(2)

0.750

2.000

(2)

0.500

LIMITING ELEMENT

VOLTAGE

150

200

250

200

MAX. OVERLOAD

VOLTAGE

100

300

400

500

400

MAX.

RESISTANCE

(1)

M

100

UNIT WEIGHT

Notes

Shall be read in conjunction with other tables

(2)

With special assembly care

Revision: 30-May-12

Document Number: 52023

For technical questions, contact:

sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

CHP, HCHP

www.vishay.com

Vishay Sfernice

DIMENSIONS

in millimeters (inches)

CASE

SIZE

0502

0505

0603

0805

1005

1206

1505

2010

1020

2208

2512

1010

VALUE

1.27 (0.050)

1.52 (0.060)

1.91 (0.075)

2.54 (0.100)

3.05 (0.120)

3.81 (0.150)

5.08 (0.200)

2.54 (0.100)

5.58 (0.220)

6.35 (0.250)

2.54 (0.100)

TOL.

0.152 (0.006)

VALUE

0.60 (0.024)

1.27 (0.050)

0.85 (0.033)

1.27 (0.050)

1.70(0.067)

1.32 (0.052)

2.54 (0.100)

5.08 (0.200)

2.00 (0.079)

3.30 (0.130)

2.54 (0.100)

TOL.

0.127 (0.005)

VALUE

0.5 (0.020)

TOL.

0.127 (0.005)

VALUE

0.38 (0.015)

D/E

TOL.

0.127 (0.005)

SUGGESTED LAND PATTERN

(to IPC-7351A)

min.

max.

CASE SIZE

0502

0505

0603

0805

1005

1206

1505

2010

1020

2208

2512

1010

DIMENSION IN MM (INCHES)

ZMAX.

1.82 (0.072)

2.37 (0.093)

2.76 (0.109)

3.39 (0.134)

3.90 (0.154)

4.66 (0.184)

5.93 (0.234)

3.39 (0.134)

6.43 (0.253)

7.20 (0.284)

3.39 (0.134)

GMIN.

0.10 (0.004)

0.35 (0.014)

0.74 (0.029)

1.37 (0.054)

1.88 (0.074)

2.64 (0.104)

3.91 (0.154)

1.37 (0.054)

4.41 (0.174)

5.18 (0.204)

1.37 (0.054)

XMAX.

0.73 (0.029)

1.40 (0.055)

0.98 (0.038)

1.40 (0.055)

1.73 (0.068)

1.45 (0.057)

2.67 (0.105)

5.21 (0.205)

2.04 (0.080)

3.19 (0.125)

2.67 (0.105)

Revision: 30-May-12

Document Number: 52023

For technical questions, contact:

sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

CHP, HCHP

www.vishay.com

POWER DERATING CURVE

Rated Power (%)

100

Vishay Sfernice

MECHANICAL SPECIFICATIONS

Substrate

Technology

Protection

Alumina

Thick film (ruthenium oxyde)

Epoxy coating

B (W/A):

SnPb over nickel barrier

for solder reflow

N (W/A):

SnAg over nickel barrier

for solder reflow

F (Flip Chip):

SnAg over nickel barrier

for solder reflow

W (one face) and G (W/A) type:

Gold over nickel barrier

for other applications

Terminations

60 70 80

100

120

140 155

Ambient Temperature in °C

Note

• Refer to Application Note “Guidelines for Vishay Sfernice

Resistive and Inductive Components” (document number:

52029) for recommended reflow profile. Profile #3 applies.

PACKAGING

ESD packaging available: Waffle pack and plastic tape and

reel (low conductivity). Paper tapes available on request

(ESD only).

NUMBER OF PIECES PER PACKAGE

WAFFLE

TAPE AND REEL

PACK

MIN.

MAX.

CLIMATIC SPECIFICATIONS

Operating temperature

range

- 55 °C; + 155 °C

SIZE

0502

0505

0603

0805

1005

1206

1505

2010

1010

2208

1020

2512

TAPE

WIDTH

Note

• For temperature up to 215 °C please consult Vishay Sfernice

100

4000

140

100

1000

4000

1000

2000

8 mm

BEST TOL. AND TCR VS. OHMIC VALUE

OHMIC VALUE

RANGE in



< 5M



< 10M



max.

0.1



max.

TIGHTEST

TOLERANCE

(%)

0.5 % (D)

1 % (F)

2 % (G)

5 % (J)

(1)

BEST

TCR

(ppm/°C)

100 (K)

200 (L)

Note

(1)

Improved performance on request

PACKAGING RULES

Waffle Pack

Can be filled up to maximum quantity indicated in the table

here above, taking into account the minimum order quantity.

When quantity ordered exceeds maximum quantity of a

single waffle pack, the waffle packs are stacked up on the

top of each other and closed by one single cover.

To get “not stacked up” waffle pack in case of ordered

quantity > maximum number of pieces per package:

Please consult Vishay Sfernice for specific ordering

code

Tape and Reel

Can be filled up to maximum quantity indicated in the table

here above, taking into account the minimum order quantity.

When quantity ordered is between the MOQ and the

maximum reel capacity, only one reel is provided.

When several reels are needed for ordered quantity

within MOQ and maximum reel capacity: Please consult

Vishay Sfernice for specific ordering code

CHIPS FOR HIGH FREQUENCY APPLICATIONS

The HF performance of flip chip and W/A types can be

improved on request.

Please ask for HCHP

Revision: 30-May-12

Document Number: 52023

For technical questions, contact:

sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

CHP, HCHP

www.vishay.com

TYPICAL HF PERFORMANCE OF HCHP

2.0

1.8

1.6

1.4

1.2

2.0

1.8

1.6

1.4

1.2

Vishay Sfernice

|Z|/R

1.0

0.8

0.6

0.4

0.2

100

1000

1 MΩ

100 kΩ

10 kΩ

100

200

1.0

0.8

0.6

100

1 kΩ

200

1 kΩ

0.4

0.2

10 000

100

1000

1 MΩ

100 kΩ

10 kΩ

10 000

Size 0603 (W/A)

f (MHz)

Size 0603 (Flip chip)

f (MHz)

POPULAR OPTIONS

For any option it is recommended to consult Vishay Sfernice for availability first.

Option: Enlarged terminations:

0063

For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint

can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat

sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,

PRA Arrays, CHP Thick Film)

www.vishay.com/doc?53048.

Option to order: 0063 (applies to size 1206/1505/1020/2010/2512).

DIMENSIONS

(Option 0063) in millimeters

Bottom view for mounting

Uncoated

ceramic

Enlarged

termination

CASE

SIZE

1206

1505

2010

1020

2208

2512

± 0.152

3.00

3.70

5.03

2.49

5.53

6.30

± 0.127

1.73

1.25

2.64

5.18

2.05

3.30

± 0.127

0.38

0.50

± 0.127

0.40

0.50

0.31

0.50

± 0.127

1.19

1.54

2.20

0.93

2.45

2.84

Revision: 30-May-12

Document Number: 52023

For technical questions, contact:

sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

CHP, HCHP

www.vishay.com

Vishay Sfernice

SUGGESTED LAND PATTERN

(Option 0063)

min.

max.

CASE SIZE

1206

1505

2010

1020

2208

2512

DIMENSIONS (IN MILLIMETERS)

max.

3.85

4.55

5.88

3.34

6.38

7.15

min.

0.50

max.

1.86

1.38

2.77

5.31

2.18

3.43

OPTION: MARKING

Option to order 0013:

Marking of ohmic value and tolerance:

Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)

Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)

Tolerance indicated by a color dot.

Option to order 0014:

Marking of ohmic value:

Sizes 0805 to 1005: 3 digits marking (according to EIA-96)

Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)

No standard marking available for smaller sizes.

A price adder will apply to the unit price of the parts for options 0013 and 0014.

PERFORMANCE

TESTS

Termination adhesion

Resistance to solder heat

CONDITIONS

5N for 10 s

Immersion 10 s

in Sn/Pb 60/40

at + 260 °C

5 cycles

- 55 °C

+ 155 °C

Phase A dry heat

Phase B damp heat

Phase C cold - 55 °C

Phase D damp heat 5 cycles

56 days

AEC-Q200

85 °C/85 % RH/Pn/10

1000 h

6.25 Pr

for 2 s

1000 h at rated power

90’/30’ at + 70 °C

REQUIREMENTS

± (0.25 % + 0.05

)

± (0.25 % + 0.05

)

± (0.25 % + 0.05

)

TYPICAL VALUES

AND DRIFTS

< ± 0.1 %

Rapid temperature change

< ± 0.1 %

Climatic sequence

Humidity (steady state)

Moisture resistance

Short time overload

Load life

± (1 % + 0.05

)

± (1 % + 0.05

)

0.5 % + 0.05



± (0.25 % + 0.05

)

1000 h

± (1 % + 0.05

)

1000 h

< 0.25 %

< ± 0.2 %

Max. < 3 % + 0.05



< ± 0.1 %

2000 h

< 0.5 %

10 000 h

<1%

Revision: 30-May-12

Document Number: 52023

For technical questions, contact:

sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

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