stability and jitter performance over temperature. The
single-output DSC61xxB MEMS oscillators are
excellent choices for use as clock references in small,
battery-powered devices such as wearable and
Internet of Things (IoT) devices in which small size, low
power consumption, and long-term reliability are
paramount.
The DSC61xxB family is available in ultra-small
1.6 mm x 1.2 mm,
2.0 mm x 1.6 mm,
and
2.5 mm x 2.0 mm packages. These packages are
“drop-in” replacements for standard 4-pin CMOS
quartz crystal oscillators. The Automotive Grade
AEC-Q100 qualified option is also available for this
device.
Package Types
DSC61
XX
B
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
Applications
• Low Power/Portable Applications: IoT,
Embedded/Smart Devices
• Consumer: Home Healthcare, Fitness Devices,
Home Automation
• Industrial: Building/Factory Automation,
Surveillance Camera
• Automotive (Please Refer to the DSA61xx Family)
OE/STDBY/FS
1
4
VDD
GND
2
3
OUT
2019 Microchip Technology Inc.
DS20006155A-page 1
DSC61XXB
Block Diagram
DSC61
XX
B
DIGITAL
CONTROL
OE/STDBY/FS
PIN 1
SUPPLY
REGULATION
VDD
PIN 4
MEMS
RESONATOR
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
OUTPUT
DIVIDER
DRIVER
OUTPUT
PIN 3
GND
PIN 2
DS20006155A-page 2
2019 Microchip Technology Inc.
DSC61XXB
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (V
IN
) ..............................................................................................................................–0.3V to V
The program is compiled and run by IAR, using the P1.0~P1.3 ports of the microcontroller as four independent buttons, which are triggered by the falling edge of the external interrupt.
/**************...
[p=26, null, left][color=#646464][font=Arial]Android's startup speed has always been criticized. Although the hardware speed of Android devices is getting faster and faster, with the emergence of new ...
Recently, when debugging SPI SPI1 and using DMA1 Channel3 to send data, I found a strange problem. When the highest bit of the last data (byte in my case, because the data size is selected as BYTE) of...
#includeint main() { char *p="abcdef"; //Many books say: p is on the stack, "abcdef" is in the data area p[2]='W'; printf(p); getchar(); return 0; } This program compiles, but what program will fail w...
EtherCAT (Ethernet for Control Automation Technology) is a real-time industrial fieldbus communication protocol based on an Ethernet-based development framework. EtherCAT is one of the fastest indu...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
0 Introduction
Portable terminals integrate a computer and display screen into a single device. Due to limited space in portable devices, previous designs often used a single-chip microcompute...[Details]
Cadence and NVIDIA Collaborate to Revolutionize Power Analysis Technology, Accelerating Development of Billion-Gate AI Designs
Cadence's new Palladium Dynamic Power Analysis applicat...[Details]
introduction
Whether in the automotive entertainment or home theater system markets, consumers continue to demand more channels and speakers, each capable of handling higher audio po...[Details]
Chip architecture licensing company ARM has hired Amazon's AI chip chief Rami Sinno to help advance its plan to develop its own complete chip, people familiar with the matter said, according to Reu...[Details]
On August 18, domestic EDA manufacturer HuaDa JiuTian launched the advanced packaging design platform Storm for the first time in the world at the end of July. It claims that the chiplet wiring eff...[Details]
On August 9th, at the 2025 World Robotics Conference (WRC), Shenzhen Cyborg Robotics Co., Ltd. officially unveiled the Cyborg-H01, the world's first lightweight bionic dexterous hand. This core com...[Details]
On August 14, Chinese researchers broke through the bottleneck of energy density and application performance of existing traditional lithium-ion batteries and developed soft-pack batteries with an ...[Details]
3D-SLISE, a quasi-solid-state electrolyte developed by the Institute of Science Tokyo, enables the production of safe and fast-charging 2.35 V lithium-ion batteries at room temperature and pressure...[Details]
1. How vibration sensors measure vibration
Vibration sensors are mainly used in gas equipment. They can sense disasters such as earthquakes and cut off gas or power supply in time to prevent s...[Details]
Introduction
Telepresence offers the most natural video conferencing experience. You can hold a meeting simply by walking into a conference room or sitting at your desk, making it feel like y...[Details]
Analog electronics
京公网安备 11010802033920号
EEWORLD
