EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K12G33J0P-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 33ohm, 50V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
CategoryPassive components    The resistor   
File Size150KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

M55342K12G33J0P-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 33ohm, 50V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

M55342K12G33J0P-W Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1916005193
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
YTEOL9.8
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length1.58 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.81 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance33 Ω
Resistor typeFIXED RESISTOR
size code0603
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGOLD
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage50 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/12 RM0603
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
100 mW
50 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 12 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /12 = RM0603
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.092
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
1.58
0.81
0.46
0.25
0.36
0.86
(1.47 - 1.78)
(0.69 - 0.94)
(0.25 - 0.84)
(0.18 - 0.43)
(0.25 - 0.51)
(0.76 - 0.97)
.034
.030
.031
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
The specific model of the chip with the top label C80 88Z (known to be used as 4-way frequency division)
As shown in the picture, the first line of the chip top label is: C80, the second line is: 88Z. It is known that it is used as a 4-frequency divider in the circuit. I want the specific model, or the m...
huang0909 Discrete Device
Temperature sensor DS18B20 principle, with STM32 example code
DS18B20 is a commonly used high-precision single-bus digital temperature measurement chip. It has the characteristics of small size, low hardware cost, strong anti-interference ability and high accura...
可乐zzZ stm32/stm8
C language syntax analysis
[backcolor=rgb(239, 245, 249)]SPLASH_HEADER SplashHeader; // This is a structure type[/backcolor] [backcolor=rgb(239, 245, 249)]read_dpp3430_i2c(DPP3430_DEV_ADDR, READ_SPLASH_SCREEN_HEADER, &Param, 1,...
火火山 51mcu
Please help me, great gods!
Dear experts, please help me. I have been working on this all night and have tried the ISP grounding method mentioned in the evening, but this problem still occurs....
jixu NXP MCU
DIY mobile phone solution details collection
The GSM module uses SIM900A, provides SMA interface, earphone (with mic earphone) and speaker interface, onboard mic, serial port can be connected to MCU or lead out for netizens to DIY, SIM card hold...
lcofjp MCU
EEWORLD University----TI DLP Labs - Automotive - DLP for high-resolution headlight application
TI DLP? Labs - Automotive - DLP for high-resolution headlight applications:https://training.eeworld.com.cn/course/5434...
hi5 TI Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1202  1951  2835  145  2821  25  40  58  3  57 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号