3D2D4G08UB2302-IS-5C datasheet, PDF

3D2D4G08UB2302-IS-5C: DescriptionDDR DRAM, 512MX8, CMOS, PBGA63,; Categorystorage storage; File Size222KB，2 Pages; Manufacturer3D PLUS

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3D2D4G08UB2302-IS-5C Overview

DDR DRAM, 512MX8, CMOS, PBGA63,

Parameter Name	Attribute value
Objectid	113247406
package instruction	FBGA, BGA63,9X11,32
Reach Compliance Code	unknown
ECCN code	EAR99
I/O type	COMMON
JESD-30 code	R-PBGA-B63
memory density	4294967296 bit
Memory IC Type	DDR2 DRAM
memory width	8
Number of terminals	63
word count	536870912 words
character code	512000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA63,9X11,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Certification status	Not Qualified
refresh cycle	8192
Filter level	ESCC9000
Maximum standby current	0.01 A
Maximum slew rate	0.115 mA
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM

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