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3D2D4G08UB2302-IS-6E

Description
DDR DRAM, 512MX8, CMOS, PBGA63,
Categorystorage    storage   
File Size222KB,2 Pages
Manufacturer3D PLUS
Download Datasheet Parametric View All

3D2D4G08UB2302-IS-6E Overview

DDR DRAM, 512MX8, CMOS, PBGA63,

3D2D4G08UB2302-IS-6E Parametric

Parameter NameAttribute value
Objectid113247407
package instructionFBGA, BGA63,9X11,32
Reach Compliance Codeunknown
ECCN codeEAR99
I/O typeCOMMON
JESD-30 codeR-PBGA-B63
memory density4294967296 bit
Memory IC TypeDDR2 DRAM
memory width8
Number of terminals63
word count536870912 words
character code512000000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA63,9X11,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Certification statusNot Qualified
refresh cycle8192
Filter levelESCC9000
Maximum standby current0.01 A
Maximum slew rate0.115 mA
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM

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